IP Library › Granted Patent US 12,363,432
Granted Patent B2
US 12,363,432 · App. 18/721,273 · Granted Jul 15, 2025

Data collection device, data collection system, and electronic image stabilization device

Inventors: Zhongping Wang (Guangdong, CN); Guo Ai (Guangdong, CN); Ju He (Guangdong, CN); Zuoxing Yang (Guangdong, CN); Ruming Fang (Guangdong, CN); Zhihong Xiang (Guangdong, CN)
Assignee: Shenzhen MicroBT Electronics Technology Co., Ltd.
H04N23/6812
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Quick Facts
Patent No.
US 12,363,432
App. No.
18/721,273
Granted
Jul 15, 2025
Kind
B2
Abstract

Disclosed include a data collection device, a data collection system, and an electronic image stabilization device. The data collection device includes a logic circuit. The logic circuit includes: a timer, configured to generate timestamp data; a control module, configured to, in response to receiving a pre-set input signal, generate a data obtaining command and obtain the timestamp data from the timer; a communication module, configured to, in response to the data obtaining command, obtain MEMS (MEMS) data from a MEMS sensor; and a packing module, configured to pack the MEMS data and the timestamp data into a data packet.

Claims (22)

1. A data collection device, comprising a logic circuitry, the logic circuitry comprising:

a timer, configured to generate timestamp data;

a control module, being a dedicated logic circuit independent of a multi-functional control unit, configured to, in response to receiving an interrupt signal of a Micro-Electro-Mechanical system (MEMS) sensor or a trigger signal of the timer, generate a data obtaining command and obtain the timestamp data from the timer for specifying a time at which the MEMS data is obtained;

a communication module, configured to, in response to the data obtaining command, obtain MEMS data from the MEMS sensor;

a time offset register, configured to store a pre-set time offset which is an empirical value with respect to the MEMS sensor; and

a packing module, configured to read the time offset from the time offset register, correct the timestamp data using the time offset, and pack the MEMS data and the corrected timestamp data into a data packet in which the MEMS data is associated with the corrected timestamp data which specifies the time at which the MEMS data is obtained.

2. The data collection device according to claim 1 , wherein the control module is connected to the MEMS sensor via an interrupt signal wire; and

the input signal is an interrupt signal which is generated when the MEMS sensor acquires the MEMS data and is transmitted to the control module via the interrupt signal wire.

3. The data collection device according to claim 1 , wherein the control module is connected to the timer via a clock signal wire; and

the input signal is a timing signal which is generated when the timer detects the arrival of a pre-set time and is transmitted to the control module via the clock signal wire.

4. The data collection device according to claim 1 , further comprising:

a storage module, configured to store the data packet in a queue.

5. An electronic image stabilization device, comprising:

a data collection device, comprising a logic circuitry, the logic circuitry comprising: a timer, configured to generate timestamp data; a control module, being a dedicated logic circuit independent of a multi-functional control unit, configured to, in response to receiving an interrupt signal of a Micro-Electro-Mechanical system (MEMS) sensor or a trigger signal of the timer, generate a data obtaining command and obtain the timestamp data from the timer for specifying a time at which the MEMS data is obtained; a communication module, configured to, in response to the data obtaining command, obtain MEMS data from the MEMS sensor; a time offset register, configured to store a pre-set time offset which is an empirical value with respect to the MEMS sensor; and a packing module, configured to read the time offset from the time offset register, correct the timestamp data using the time offset, and pack the MEMS data and the timestamp data into a data packet in which the MEMS data is associated with the corrected timestamp data which specifies the time at which the MEMS data is obtained;

a digital image stabilization module, configured to perform digital image stabilization processing on a digital image using the data packet provided by the data collection device.

6. The electronic image stabilization device according to claim 5 , wherein

the control module is connected to the MEMS sensor via an interrupt signal wire; and the input signal is an interrupt signal which is generated when the MEMS sensor acquires the MEMS data and is transmitted to the control module via the interrupt signal wire.

7. The electronic image stabilization device according to claim 5 , wherein

the control module is connected to the timer via a clock signal wire; and the input signal is a timing signal which is generated when the timer detects the arrival of a pre-set time and is transmitted to the control module via the clock signal wire.

8. A data collection system, comprising:

a Micro-Electro-Mechanical system (MEMS) sensor, configured to acquire MEMS data; and

a data collection device comprising a logic circuitry, the logic circuitry comprising: a timer, configured to generate timestamp data; a control module, being a dedicated logic circuit independent of a multi-functional control unit, configured to, in response to receiving an interrupt signal of the MEMS sensor or a trigger signal of the timer, generate a data obtaining command and obtain the timestamp data from the timer for specifying a time at which the MEMS data is obtained; a communication module, configured to, in response to the data obtaining command, obtain the MEMS data from the MEMS sensor; a time offset register, configured to store a pre-set time offset which is an empirical value with respect to the MEMS sensor; and a packing module, configured to read the time offset from the time offset register, correct the timestamp data using the time offset, and pack the MEMS data and the timestamp data into a data packet in which the MEMS data is associated with the corrected timestamp data which specifies the time at which the MEMS data is obtained.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2024
From: WANG, ZHONGPING; AI, GUO; HE, JU; YANG, ZUOXING; FANG, RUMING; XIANG, ZHIHONG
To: SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 067754/0113 →
Priority Claims (1)
CN 202210014428.6 · Jan 7, 2022 · national
Continuity (1)
Related Publication 20250159347A1 · May 15, 2025
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