Backside recess in motherboard with thermally conductive mold
Embodiments disclosed herein include microelectronic boards and electronic systems. In an embodiment, a microelectronic board comprises aboard substrate, where the board substrate has a first thickness between a first surface and a second surface opposite from the first surface. In an embodiment, a recess is formed into the first surface of the board substrate, where the recess comprises a third surface between the first surface and the second surface. In an embodiment, the board substrate has a second thickness between the third surface and the second surface. In an embodiment, the microelectronic board further comprises a voltage regulator (VR) module attached to the third surface.
1. A microelectronic board, comprising:
a board substrate, wherein the board substrate has a first thickness between a first surface and a second surface opposite from the first surface;
a recess into the first surface of the board substrate, wherein the recess comprises a third surface between the first surface and the second surface, and wherein the board substrate has a second thickness between the third surface and the second surface;
a voltage regulator (VR) module attached to the third surface; and
a fill material that fills the recess, the fill material having an uppermost surface above the first surface of the board.
2. The microelectronic board of claim 1 , wherein the VR module comprises one or more inductors.
3. The microelectronic board of claim 1 , further comprising: a plurality of conductive layers embedded in the board substrate, and wherein the recess passes through at least one of the plurality of conductive layers.
4. The microelectronic board of claim 3 , wherein the plurality of conductive layers comprises at least five conductive layers, and wherein the recess passes through at least three conductive layers.
5. The microelectronic board of claim 1 , further comprising: a capacitor attached to the third surface.
6. The microelectronic board of claim 1 , wherein the fill material is thermally conductive.
7. The microelectronic board of claim 6 , wherein the VR module is fully embedded in the fill material.
8. The microelectronic board of claim 1 , wherein the first thickness is approximately 3.0 mm or greater.
9. The microelectronic board of claim 8 , wherein the second thickness is approximately 1.0 mm or less.
10. The microelectronic board of claim 1 , wherein the first surface of the board substrate is a backside surface, and wherein the second surface is configured to receive an electronic package.
11. An electronic system, comprising:
a board with a first surface and a second surface opposite from the first surface, and a recess into the first surface;
a voltage regulator (VR) module in the recess;
a fill material that fills the recess, the fill material having an uppermost surface above the first surface of the board;
a package substrate attached to the second surface of the board; and
a die attached to the package substrate.
12. The electronic system of claim 11 , wherein the package substrate is attached to the board with a socket.
13. The electronic system of claim 11 , wherein the package substrate is attached to the board with a ball grid array (BGA).
14. The electronic system of claim 11 , further comprising:
capacitors on a surface of the package substrate facing the board.
15. The electronic system of claim 11 , wherein the package substrate is attached to the second surface of the board with a full grid array.
16. The electronic system of claim 11 , further comprising:
a capacitor in the recess.
17. The electronic system of claim 11 ,
wherein the fill material is thermally conductive.
18. The electronic system of claim 17 , wherein the VR module is embedded by the fill material.
19. An electronic system, comprising:
a microelectronic board, wherein the microelectronic board comprises:
a board substrate, wherein the board substrate has a first thickness between a first surface and a second surface opposite from the first surface;
a recess into the first surface of the board substrate, wherein the recess comprises a third surface between the first surface and the second surface, and wherein the board substrate has a second thickness between the third surface and the second surface; and
a voltage regulator (VR) module attached to the third surface;
a fill material that fills the recess, the fill material having an uppermost surface above the first surface of the board;
a package substrate attached to the second surface of the board substrate; and
a die attached to the package substrate.
20. The electronic system of claim 19 ,
wherein the fill material is thermally conductive, and wherein the fill material embeds the VR module.