IP Library Granted Patent US 12,364,113
Granted Patent B2
US 12,364,113 · App. 18/644,098 · Granted Jul 15, 2025

Method of manufacturing a display apparatus

Inventors: Junhee Lee (Yongin-si, KR); Minyeul Ryu (Yongin-si, KR)
Assignee: Samsung Display Co., Ltd.
H10K59/123H10K59/1213H10K59/1216H10K59/122H10K59/80518H10K59/1201H10K59/8792
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Quick Facts
Patent No.
US 12,364,113
App. No.
18/644,098
Granted
Jul 15, 2025
Kind
B2
Abstract

Provided are a display apparatus including: a substrate; a pixel circuit disposed over the substrate and comprising a thin film transistor and a storage capacitor; an insulating layer covering the pixel circuit; a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through a contact hole formed in the insulating layer; a pixel electrode disposed over the insulating layer and electrically connected to the bridge electrode; a pixel definition layer disposed over the pixel electrode and including an opening overlapping a portion of the pixel electrode; an opposite electrode over the pixel electrode; and an emission layer disposed between the pixel electrode and the opposite electrode, wherein the pixel electrode does not overlap the contact hole of the insulating layer in a plan view.

Claims (61)

1. A method of manufacturing a display apparatus, the method comprising:

forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate;

forming an insulating layer covering the pixel circuit and comprising at least one contact hole;

forming a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole in the insulating layer;

forming a pixel electrode disposed over the insulating layer;

forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode;

forming an emission layer over the pixel electrode; and

forming an opposite electrode over the emission layer,

wherein the forming of the pixel electrode comprises:

forming a pixel electrode material layer, and

patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer through which the pixel electrode is electrically connected to the thin film transistor in a plan view.

2. The method of claim 1 , wherein the forming of the bridge electrode comprises:

forming a bridge electrode material layer; and

patterning the bridge electrode material layer such that at least a portion of the bridge electrode overlaps the opening of the pixel definition layer in a plan view.

3. The method of claim 2 , wherein the pixel electrode comprises:

a conductive layer comprising a transparent conductive oxide; and

a reflective layer disposed over the conductive layer and comprising a metal, and

wherein the at least a portion of the bridge electrode is disposed over the pixel electrode and contacts an upper surface of the reflective layer of the pixel electrode.

4. The method of claim 2 , wherein the pixel electrode comprises:

a lower conductive layer comprising a transparent conductive oxide;

a reflective layer disposed over the lower conductive layer and comprising a metal; and

an upper conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and

wherein the at least a portion of the bridge electrode is disposed over the pixel electrode and contacts an upper surface of the upper conductive layer of the pixel electrode.

5. The method of claim 2 , wherein the pixel electrode comprises:

a reflective layer comprising a metal; and

a conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and

wherein the at least a portion of the bridge electrode is disposed between the insulating layer and the pixel electrode and contacts a lower surface of the reflective layer of the pixel electrode.

6. The method of claim 2 , wherein the pixel electrode comprises:

a lower conductive layer comprising a transparent conductive oxide;

a reflective layer disposed over the lower conductive layer and comprising a metal; and

an upper conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and

wherein the at least a portion of the bridge electrode is disposed between the insulating layer and the pixel electrode and contacts a lower surface of the lower conductive layer of the pixel electrode.

7. The method of claim 1 , wherein the bridge electrode comprises a transparent conductive oxide.

8. A method of manufacturing a display apparatus, the method comprising:

forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate;

forming an insulating layer covering the pixel circuit and comprising at least one contact hole;

forming a first bridge electrode layer disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole of in the insulating layer;

forming a pixel electrode disposed over the first bridge electrode layer;

forming a second bridge electrode layer disposed over the first bridge electrode layer with the pixel electrode disposed between the first bridge electrode and the second bridge electrode;

forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode;

forming an emission layer over the pixel electrode; and

forming an opposite electrode over the emission layer,

wherein the forming of the pixel electrode comprises:

forming a pixel electrode material layer; and

patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer in a plan view.

9. The method of claim 8 , wherein the pixel electrode comprises a reflective layer comprising a metal, and

wherein the first bridge electrode layer contacts a lower surface of the reflective layer of the pixel electrode.

10. The method of claim 9 , wherein the pixel electrode further comprises a conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and

wherein the second bridge electrode layer contacts an upper surface of the conductive layer of the pixel electrode.

11. A method of manufacturing an apparatus, the method comprising:

forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate;

forming an insulating layer covering the pixel circuit and comprising at least one contact hole;

forming a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole in the insulating layer;

forming a pixel electrode disposed over the insulating layer;

forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode;

forming an emission layer over the pixel electrode; and

forming an opposite electrode over the emission layer,

wherein the forming of the pixel electrode comprises:

forming a pixel electrode material layer, and

patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer through which the pixel electrode is electrically connected to the thin film transistor in a plan view.

12. The method of claim 11 , wherein the apparatus is at least one of a television, a notebook computer, a monitor, a billboard, a mobile phone, a smart phone, a tablet personal computer, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player, a navigation, an Ultra Mobile PC, a smart watch, a watch phone, a glasses-type display, a head-mounted display, or a center information display (CID) of a vehicle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2024
From: LEE, JUNHEE; RYU, MINYEUL
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 067202/0116 →
Priority Claims (1)
KR 10-2021-0050741 · Apr 19, 2021 · national
Continuity (2)
Division 17496828 · Oct 8, 2021
Related Publication 20240276770A1 · Aug 15, 2024
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