IP Library › Granted Patent US 12,368,246
Granted Patent B2
US 12,368,246 · App. 17/951,854 · Granted Jul 22, 2025

Multi-band antenna and electronic device including the same

Inventors: Dongyeon Kim (Suwon-si, KR); Youngsuk Yoo (Suwon-si, KR); Sumin Yun (Suwon-si, KR); Woosup Lee (Suwon-si, KR); Sukgi Hong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01Q21/065H01Q1/243H01Q1/48H01Q9/045
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Quick Facts
Patent No.
US 12,368,246
App. No.
17/951,854
Granted
Jul 22, 2025
Kind
B2
Abstract

An antenna includes a first radiating layer including a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch, a second radiating layer including a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch, a feeding layer including a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch, a ground layer provided below the coupling patch, a feed line provided between the second radiation patch and the ground layer and including a third feed point, a signal via connecting the first feed point, the second feed point, and the third feed point, and a ground via connecting the at least one ground point and the ground layer.

Claims (67)

1. An electronic device comprising:

a housing; and

an antenna provided in the housing,

wherein the antenna comprises:

a first radiating layer comprising a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch;

a second radiating layer comprising a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch;

a feeding layer comprising a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch;

a ground layer provided below the feeding layer and below the coupling patch;

a feed line provided between the second radiation patch and the ground layer, the feed line comprising a third feed point;

a signal via connecting the first feed point, the second feed point, and the third feed point; and

a ground via connecting the at least one ground point and the ground layer.

2. The electronic device of claim 1 , wherein the coupling patch comprises a plurality of coupling sections configured to form a coupling pattern.

3. The electronic device of claim 2 , wherein the plurality of coupling sections comprises:

a first section; and

a second section provided opposite to the first section based on a first centerline of the feeding layer.

4. The electronic device of claim 3 , wherein the plurality of coupling sections further comprises:

a third section provided opposite to the second section based on a second centerline of the feeding layer, the second centerline intersecting the first centerline; and

a fourth section provided opposite to the third section based on the first centerline and opposite to the first section based on the second centerline.

5. The electronic device of claim 2 , wherein the second radiation patch comprises an edge, and

wherein the plurality of coupling sections do not overlap the edge of the second radiation patch.

6. The electronic device of claim 2 , wherein each of the plurality of coupling sections comprises a plurality of subsections connected to each other or separated from each other.

7. The electronic device of claim 2 , wherein each of the plurality of coupling sections comprises a plurality of subsections, and each of the plurality of subsections has a width and a length that is less than the width.

8. The electronic device of claim 2 , wherein:

(a) the feeding layer comprises a plurality of ground points arranged in a width direction of the plurality of coupling sections,

(b) the feeding layer comprises a plurality of ground points respectively arranged in the width direction and a length direction of the plurality of coupling sections, or

(c) each of the plurality of coupling sections comprises a plurality of subsections connected to each other, and the at least one ground point of the feeding layer is provided at a portion where the plurality of subsections are connected to each other.

9. The electronic device of claim 1 , wherein the first radiation patch comprises a plurality of first edges,

wherein the second radiation patch comprises a plurality of second edges,

wherein the first radiation patch comprises a first cut area between a pair of first edges adjacent to each other, and

wherein the second radiation patch comprises a second cut area between a pair of second edges adjacent to each other.

10. The electronic device of claim 1 , wherein the second radiating layer further comprises an annular slot surrounding the second feed point.

11. An electronic device comprising:

a housing;

a printed circuit board (PCB) provided in the housing;

an antenna assembly provided in the housing; and

a cover coupled to the housing and covering the PCB and the antenna assembly,

wherein the antenna assembly comprises:

a plurality of antennas, each of the plurality of antennas comprising:

a first radiating layer comprising a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch;

a second radiating layer comprising a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch; and

a feeding layer comprising a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch;

a ground layer provided below the feeding layer of each of the plurality of antennas;

a plurality of feed lines each provided between the second radiating layer of each of the plurality of antennas and the ground layer, each of the plurality of feed lines comprising a third feed point; and

a connector connecting the plurality of feed lines to the PCB.

12. The electronic device of claim 11 , further comprising:

a trace provided between a pair of feed lines adjacent to each other and configured to suppress signal interference between the pair of feed lines.

13. The electronic device of claim 11 , wherein the ground layer comprises an overlap area overlapping the plurality of antennas and formed in a mesh structure.

14. The electronic device of claim 11 , wherein the ground layer comprises:

an antenna mount area in which the plurality of antennas are provided; and

a wiring connection area in which at least a portion of the plurality of feed lines and the connector are provided, and

wherein the wiring connection area comprises a bending area configured to be at least partially bent.

15. The electronic device of claim 11 , further comprising:

a fastening part provided between the PCB and the antenna assembly and configured to fasten the PCB and the antenna assembly to the housing.

16. The electronic device of claim 11 , further comprising:

a damage suppressor provided between the antenna assembly and the cover and configured to suppress damage to the cover caused by the antenna assembly.

17. The electronic device of claim 11 , further comprising:

an impact absorber provided between the cover and the connector and configured to prevent separation of the connector from the PCB.

18. The electronic device of claim 11 , wherein the cover comprises a plurality of radiation apertures respectively corresponding to the plurality of antennas.

19. The electronic device of claim 11 , wherein the PCB and the antenna assembly are stacked and mounted in the housing.

20. An antenna comprising:

a first radiating layer comprising a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch;

a second radiating layer comprising a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch;

a feeding layer comprising a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch;

a ground layer provided below the feeding layer and below the coupling patch;

a feed line provided between the second radiation patch and the ground layer and comprising a third feed point;

a signal via connecting the first feed point, the second feed point, and the third feed point; and

a ground via connecting the at least one ground point and the ground layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2022
From: KIM, DONGYEON; YOO, YOUNGSUK; YUN, SUMIN; LEE, WOOSUP; HONG, SUKGI
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061198/0330 →
Priority Claims (1)
KR 10-2021-0105766 · Aug 11, 2021 · national
Continuity (2)
Continuation PCTKR2022010658 · Jul 21, 2022
Related Publication 20230052927A1 · Feb 16, 2023
References Cited (28)
US 8717245B1 · Krivokapic et al. · 2014 [cited by applicant]
US 10734726B2 · Fujimoto · 2020 [cited by applicant]
US 20110032154A1 · Chung · 2011 [cited by examiner]
US 20150333407A1 · Yamagajo et al. · 2015 [cited by applicant]
US 20160365646A1 · Higaki · 2016 [cited by examiner]
US 20170012364A1 · Yang · 2017 [cited by examiner]
US 20170093041A1 · McMichael · 2017 [cited by examiner]
US 20170093042A1 · McMichael · 2017 [cited by examiner]
US 20170125919A1 · Chien et al. · 2017 [cited by applicant]
US 20190058252A1 · Kuo · 2019 [cited by examiner]
US 20190140362A1 · Edenfield · 2019 [cited by examiner]
US 20200021011A1 · Cooper et al. · 2020 [cited by applicant]
US 20200303821A1 · Lee et al. · 2020 [cited by applicant]
US 20200408612A1 · Wu · 2020 [cited by examiner]
US 20200411986A1 · Cooper et al. · 2020 [cited by applicant]
US 20210005982A1 · Han et al. · 2021 [cited by applicant]
US 20210044018A1 · Takaki et al. · 2021 [cited by applicant]
US 20210226312A1 · Guo · 2021 [cited by examiner]
US 20230044949A1 · Park · 2023 [cited by examiner]
US 20230216202A1 · Park · 2023 [cited by examiner]
CN 104319467A · 2015 [cited by applicant]
CN 1107688006A · 2020 [cited by applicant]
KR 101164618B1 · 2012 [cited by applicant]
KR 101470914B1 · 2014 [cited by applicant]
KR 1020210001976A · 2021 [cited by applicant]
KR 1020210004054A · 2021 [cited by applicant]
International Search Report (PCT/ISA/210) dated Oct. 31, 2022 issued by the International Searching Authority in International Application No. PCT/KR2022/010658. [cited by applicant]
Communication issued Oct. 7, 2024 by the European Patent Office in European Patent Application No. 22856051.2. [cited by applicant]