Printed circuit board assembly
A circuit board assembly includes a circuit board having at least one conductive inner layer and at least one surface. Contact areas or surfaces and electrical and/or electronic components are disposed on the surface and electrically connected to the contact areas. At least two of the contact areas are connected to one another by an electrically conductive strip having ends each being connected to a respective one of the contact areas. The at least two contact areas and the electrically conductive strip have a width of at least 8 mm and the strip has a thickness that is at least double the thickness of the at least one inner layer.
1. A printed circuit board assembly, comprising:
a printed circuit board having at least one conductive inner layer and at least one surface;
contact areas disposed on said at least one surface;
at least one of electrical or electronic components having a face mounted directly on said at least one surface, a portion of said face additionally directly mounted on a first portion of at least one of said contact areas, and electrically connected to said at least one of said contact areas;
an electrically conductive strip interconnecting at least two of said contact areas, said electrically conductive strip having ends each being connected to a respective one of said at least two contact areas, one end of said electrically conductive strip being directly mounted to a second portion of said at least one of said contact areas extending on said at least one surface beyond the portion of said face directly mounted on said first portion;
said at least two contact areas and said electrically conductive strip having a width of at least 8 mm; and
said electrically conductive strip being at least twice as thick as said at least one inner layer.
2. The printed circuit board assembly according to claim 1 , which further comprises a welded connection interconnecting said electrically conductive strip and one of said contact areas.
3. The printed circuit board assembly according to claim 1 , wherein:
said printed circuit board has insulating layers including an uppermost insulating layer at said at least one surface;
said at least one conductive inner layer includes a plurality of conductive inner layers each being disposed between a respective two of said insulating layers;
said contact areas are embedded within said uppermost insulating layer; and
said at least one of electrical or electronic components are disposed on said uppermost insulating layer.