IP Library › Granted Patent US 12,369,289
Granted Patent B2
US 12,369,289 · App. 18/015,712 · Granted Jul 22, 2025

Component grounding system

Inventors: Yong Hee Park (Anyang-si, KR); Hong Bean Park (Hwaseong-si, KR); Hong Ju Jung (Seoul, KR)
Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
H05K9/0064H05K7/2039H05K9/0007
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Quick Facts
Patent No.
US 12,369,289
App. No.
18/015,712
Granted
Jul 22, 2025
Kind
B2
Abstract

A component grounding system according to one embodiment includes a case for accommodating a plurality of components, a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case, and a bus bar, disposed between the case and the DC capacitor, for connecting the case and the DC capacitor, the bus bar representing an electrode, wherein each of the plurality of components may be connected to the bus bar.

Claims (20)

1. A component grounding system comprising:

a case configured to accommodate a plurality of components;

a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case; and

a bus bar disposed between the case and the DC capacitor to connect the case and the DC capacitor, the bus bar representing a negative (−) electrode;

a heat dissipation plate disposed inside the case; and

a first insulator disposed on an inner side surface of the case,

wherein each of the plurality of components is connected to the bus bar,

wherein a first cable connected to each of the plurality of components is directly connected to the first insulator,

wherein the heat dissipation plate is directly connected to the bus bar by a second cable, and

wherein the second cable and the first insulator are connected by a third cable.

2. The component grounding system of claim 1 , further comprising:

a fourth cable disposed inside the case and used at a high voltage; and

a second insulator configured to separate the fourth cable from the case to prevent the fourth cable from contacting an inner surface of the case.

3. The component grounding system of claim 2 , wherein the second insulator is formed with a shape of “L”.

4. The component grounding system of claim 3 , wherein

the second insulator comprises a plurality of grooves formed to be spaced apart from each other at regular intervals, and

the fourth cable is extended by passing through a portion of the plurality of grooves.

5. The component grounding system of claim 4 , further comprising:

a connection terminal disposed between the case and the DC capacitor to connect the case and the DC capacitor, the connection terminal representing a positive (+) electrode; and

a discharge resistance disposed below the heat dissipation plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2023
From: PARK, YONG HEE; PARK, HONG BEAN; JUNG, HONG JU
To: HYOSUNG HEAVY INDUSTRIES CORPORATION
Reel/Frame 062350/0586 →
Priority Claims (1)
KR 10-2020-0101708 · Aug 13, 2020 · national
Continuity (1)
Related Publication 20230292477A1 · Sep 14, 2023
References Cited (10)
US 8422230B2 · Aiba · 2013 [cited by examiner]
US 11049655B2 · Nishimura · 2021 [cited by examiner]
US 20200245480A1 · Mauger · 2020 [cited by examiner]
US 20210378108A1 · Park · 2021 [cited by examiner]
JP 2013053633A · 2013 [cited by applicant]
JP 2014082738A · 2014 [cited by applicant]
JP 2014096930A · 2014 [cited by applicant]
JP 2015122241A · 2015 [cited by applicant]
JP 6608555B1 · 2019 [cited by applicant]
KR 101763298B1 · 2017 [cited by applicant]