Electronic atomization apparatus, and atomizer and heating body of electronic atomization apparatus
A heating body for heating a vaporized aerosol generation substrate includes: a substrate layer having a first surface and a second surface opposite the first surface; a heating layer formed on the first surface and/or the second surface; and a plurality of through holes having a capillary force. Each through hole of the plurality of through holes is elongated and extends through the first surface to the second surface.
1. A heating body configured to heat a vaporized aerosol generation substrate, the heating body comprising:
a substrate layer comprising a first surface and a second surface opposite the first surface;
a heating layer formed on the first surface; and
a plurality of through holes having a capillary force,
wherein each through hole of the plurality of through holes is elongated and extends through the first surface to the second surface,
wherein the heating body further comprises a protective layer formed on a surface of the heating layer, and
wherein the plurality of through holes extend through the protective layer.
2. The heating body of claim 1 , wherein each through hole of the plurality of through holes comprises a linear longitudinal axis, and
wherein the plurality of through holes extend through the heating layer.
3. The heating body of claim 2 , wherein the first surface comprises a first flat surface and the second surface comprises a second flat surface,
wherein the first flat surface and the second flat surface are parallel to each other,
wherein the plurality of through holes extend through the first flat surface to the second flat surface, and
wherein the longitudinal axis of each through hole is perpendicular to or intersects the first flat surface and the second flat surface.
4. The heating body of claim 2 , wherein the first surface comprises a first cylindrical surface and the second surface comprises a second cylindrical surface,
wherein the second cylindrical surface is coaxial with the first cylindrical surface, and
wherein the plurality of through holes extend through the first cylindrical surface to the second cylindrical surface along a normal direction of the first cylindrical surface and the second cylindrical surface.
5. The heating body of claim 1 , wherein the substrate layer comprises a glass layer or a dense ceramic layer.
6. The heating body of claim 1 , wherein a thickness of the heating body ranges from 0.1 mm to 10 mm.
7. The heating body of claim 1 , wherein a porosity of the heating body ranges from 0.1 to 0.9.
8. The heating body of claim 1 , wherein pore sizes of the plurality of through holes range from 1 μm to 200 μm.
9. The heating body of claim 1 , wherein a thickness of the heating layer ranges from 1 μm to 200 μm.
10. The heating body of claim 1 , wherein a resistance of the heating layer ranges from 0.1 ohms to 10 ohms.
11. The heating body of claim 1 , wherein a material of the heating layer comprises at least one of nickel, chromium, silver, palladium, ruthenium, or platinum.
12. The heating body of claim 1 , wherein a thermal conductivity of the substrate layer ranges from 0.1 W/mK to 5 W/mK.
13. The heating body of claim 1 , wherein each through hole of the plurality through holes and/or the substrate layer are/is in a regular geometrical shape.
14. The heating body of claim 1 , wherein the substrate layer comprises a dense substrate,
wherein the plurality of through holes are arranged on the substrate in a circular array or a rectangular array, and
wherein pore sizes of the plurality of through holes are the same or different.
15. The heating body of claim 1 , further comprising:
an isolation layer formed on the second surface,
wherein the plurality of through holes extend through the isolation layer.
16. The heating body of claim 1 , wherein the heating layer is formed on the second surface, and
wherein the heating body further comprises an isolation layer formed on a surface of the heating layer.
17. The heating body of claim 1 , further comprising:
a first heating layer; and
a second heating layer,
wherein the first heating layer and the second heating layer are respectively formed on the first surface and the second surface, and
wherein the plurality of through holes extend through the first heating layer and the second heating layer.
18. The heating body of claim 17 , further comprising:
a protective layer; and
an isolation layer,
wherein the protective layer and the isolation layer are respectively formed on the first heating layer and the second heating layer, and
wherein the plurality of through holes extend through the protective layer and the isolation layer.
19. The heating body of claim 18 , wherein a thermal conductivity of the isolation layer ranges from 0.01 W/mK to 2 W/mK, and a thickness of the isolation layer ranges from 0.1 μm to 100 μm.
20. The heating body of claim 18 , wherein the isolation layer comprises a porous material comprising nano-alumina, nano-zirconia, or nano-cerium oxide.
21. The heating body of claim 1 , wherein a temperature field of the heating layer exhibits a gradient change in a direction from a middle to a periphery.
22. A vaporizer, comprising:
an accommodating cavity;
an aerosol generation substrate accommodated in the accommodating cavity; and
the heating body of claim 1 ,
wherein ends of the plurality of through holes close to the second surface are fluidly connected to the aerosol generation substrate.
23. The vaporizer of claim 22 , wherein a surface tension of the aerosol generation substrate ranges from 10 mN/m to 75 mN/m.
24. An electronic vaporization device, comprising:
an accommodating cavity;
an aerosol generation substrate accommodated in the accommodating cavity;
the heating body of claim 1 ; and
a power supply device electrically connected to the heating body,
wherein ends of the plurality of through holes close to the second surface are fluidly connected to the aerosol substrate.
25. The electronic vaporization device of claim 24 , wherein a viscosity of the aerosol generation substrate ranges from 40 cP to 1000 cP,
wherein a working temperature on a side of the heating body away from the aerosol generation substrate ranges from 100° C. to 350° C., and
wherein a working temperature on a side of the heating body close to the aerosol generation substrate ranges from 22° C. to 100° C.
26. The electronic vaporization device of claim 24 , wherein a viscosity of the aerosol generation substrate ranges from 1000 cP to 10000 cP,
wherein a working temperature on a side of the heating body away from the aerosol generation substrate ranges from 150° C. to 250° C., and
wherein a working temperature on a side of the heating body close to the aerosol generation substrate ranges from 80° C. to 150° C.
27. The electronic vaporization device of claim 24 , wherein a viscosity of the aerosol generation substrate ranges from 0.1 cP to 40 cP,
wherein a working temperature on a side of the heating body away from the aerosol generation substrate ranges from 70° C. to 150° C., and
wherein a working temperature on a side of the heating body close to the aerosol generation substrate ranges from 22° C. to 40° C.
28. The electronic vaporization device of claim 24 , wherein a surface tension of the aerosol generation substrate ranges from 10 mN/m to 75 mN/m.
29. The heating body of claim 1 , wherein the heating body comprises at least two regions, and
wherein pore sizes of the through holes of each region of the at least two regions are different.
30. The heating body of claim 29 , wherein each region corresponds to a different surface temperature.