Granted Patent B2

US 12,374,628 · App. 17/532,423 · Granted Jul 29, 2025

Inventor: Effendi Leobandung (Stormville, NY)

Assignee: International Business Machines Corporation

H01L23/544H01L21/30604H01L21/308H01L21/561H01L24/18H01L25/0655H01L23/3128H01L2223/54426H01L2223/54453H01L2223/54486

Abstract

Claims (22)

1. An aggregate die comprising:

a wafer substrate with a first surface, wherein the first surface comprises a first set of substrate alignment guides and a second set of substrate alignment guides, and a shape of the first set of substrate alignment guides is different than a shape of the second set of substrate alignment guides; and

a first sub die attached to the first surface, wherein the first sub die comprises a second surface on which a first set of sub die alignment guides has been etched, wherein the first set of sub die alignment guides interface with the first set of substrate alignment guides,

wherein the first set of sub die alignment guides are adapted to seat the first sub die into the wafer substrate.

2. The aggregate die of claim 1 , wherein a pitch of the first set of substrate alignment guides is different than a pitch of the second set of substrate alignment guides.

3. The aggregate die of claim 1 , wherein the first set of substrate alignment guides forms a first pattern, and the second set of substrate alignment guides forms a second pattern that is different from the first pattern.

4. The aggregate die of claim 1 , wherein a first substrate alignment guide in the first set of substrate alignment guides has a rounded shape.

5. The aggregate die of claim 4 , wherein a second substrate alignment guide in the first set of substrate alignment guides has a pointed shape.

6. The aggregate die of claim 1 , wherein a size of the first set of substrate alignment guides is different than a size of the second set of substrate alignment guides.

7. The aggregate die of claim 1 , wherein a size of a first sub die alignment guide in the first set of sub die alignment guides is different than a size of a second sub die alignment guide in the first set of sub die alignment guides.

8. The aggregate die of claim 1 , wherein a first substrate alignment guide in the first set of substrate alignment guides is convex and a second substrate alignment guide in the first set of substrate alignment guides is concave.

9. The aggregate die of claim 1 , further comprising a second sub die attached to the first surface, wherein a material composition of the first sub die is different than a material composition of the second sub die.

10. The aggregate die of claim 1 , further comprising:

a second sub die attached to the first surface; and

a wire within the aggregate die that connects a contact on the first sub die to a contact on the second sub die.

11. A sub die comprising:

a first surface on which a set of pointed sub die alignment guides has been etched, wherein the pointed sub die alignment guides take a form of pointed bumps on the first surface, wherein the pointed sub die alignment guides are adapted to seat the sub die into a wafer substrate; and

a second surface with a set of sub die contacts, wherein the second surface is opposite the first surface.

12. An aggregate die comprising:

a wafer substrate with a first surface, wherein the first surface comprises a first set of substrate alignment guides and a second set of substrate alignment guides, and a size of the first set of substrate alignment guides is different than a size of the second set of substrate alignment guides; and

a first sub die attached to the first surface, wherein the first sub die comprises a second surface on which a first set of sub die alignment guides has been etched, wherein the first set of sub die alignment guides interface with the first set of substrate alignment guides,

wherein the first set of sub die alignment guides are adapted to seat the first sub die into the wafer substrate.

Assignments (1)

Continuity (1)

References Cited (10)