Modular physiologic monitoring systems, kits, and methods
Systems, devices, methods, and kits for monitoring one or more physiologic and/or physical signals from a subject are disclosed. A system including patches and corresponding modules for wirelessly monitoring physiologic and/or physical signals is disclosed. A service system for managing the collection of physiologic data from a customer is disclosed. An isolating patch for providing a barrier between a handheld monitoring device with a plurality of contact pads and a subject is disclosed.
1. A patch interface, comprising:
a substrate, the substrate having a first surface and a second surface opposite the first surface;
an adhesive comprising a first surface and a second surface, the first surface of the adhesive being coupled to the second surface of the substrate, the second surface of the adhesive being formulated for attachment to the skin of a subject;
one or more rivet studs coupled through a thickness of the substrate between the first surface and the second surface, at least one of the one or more rivet studs comprising a cap holding said at least one of the one or more rivet studs to the substrate;
one or more patch interconnects coupled to the substrate, the one or more patch interconnects providing an electrically conducting interface;
one or more electrically conducting traces arranged between the second surface of the substrate and the first surface of the adhesive; and
at least one of one or more sensors and one or more electrodes;
wherein the one or more stretchable electrically conducting traces couple at least one of the sensors or electrodes with one or more of the patch interconnects.
2. The patch interface of claim 1 , wherein said at least one of the one or more sensors and the one or more electrodes are arranged, configured and dimensioned to interface with the subject when the second surface of the adhesive is attached to the skin of the subject.
3. The patch interface of claim 1 , wherein the patch interface is configured to monitor at least one of physiologic, physical and electrophysiological signals from the subject utilizing said at least one of the one or more sensors and the one or more electrodes.
4. The patch interface of claim 1 , wherein at least one of the one or more electrically conducting traces comprises an electrically conducting ink printed onto the second surface of the substrate.
5. The patch interface of claim 1 , wherein the one or more patch interconnects are configured for attachment of the patch interface to a module comprising one or more microcircuits.
6. The patch interface of claim 1 , wherein the substrate, the adhesive, the one or more patch interconnects and the one or more electrically conducting traces are stretchable.
7. The patch interface of claim 1 , wherein the substrate, the adhesive, the one or more patch interconnects and the one or more electrically conducting traces each comprise a moisture permeable material.
8. The patch interface of claim 1 , wherein the patch interface is physically frail such that it cannot retain a predetermined shape in a free standing state, and further comprising a temporary stiffening member attached to the substrate to provide retention of the patch interface in the predetermined shape prior to attachment of the patch interface to the subject, the temporary stiffening member being removable from the substrate after attachment of the patch interface to the subject.
9. The patch interface of claim 1 , further comprising a conducting layer between the cap and the substrate.
10. The patch interface of claim 1 , wherein said at least one of the one or more rivet studs comprises one of the electrodes.
11. The patch interface of claim 1 , further comprising a conducting layer coating said at least one of the one or more rivet studs.
12. The patch interface of claim 1 , wherein a given one of the one or more rivet studs comprises a given one of the one or more patch interconnects at a first end proximate the first surface of the substrate.
13. The patch interface of claim 12 , wherein the given rivet stud is configured for attachment of the patch interface to a module.
14. The patch interface of claim 13 , wherein the given rivet stud comprises a button top proximate a first surface of the substrate configured for interfacing with a module interconnect of the module.
15. The patch interface of claim 13 , wherein the given rivet stud comprises a snap interconnect top proximate a first surface of the substrate configured for interfacing with a module interconnect of the module.
16. The patch interface of claim 13 , wherein the given microstud is configured for mating with a given module interconnect of the module, the given module interconnect being integrated into a printed circuit board of the module.
17. The patch interface of claim 16 , wherein the printed circuit board of the module comprises at least one of an undercoating and a gasket that isolates the given module interconnect and the given microstud from surroundings during use.
18. The patch interface of claim 1 , wherein at least a portion of said at least one of the one or more rivet studs proximate the second surface of the substrate comprises an electroconducting gel coating.
19. The patch interface of claim 18 , wherein the electroconducting gel coating is configured for providing charge transfer with an adjacent surface.
20. The patch interface of claim 1 , further comprising:
a conducting layer surrounding the cap holding said at least one of the one or more rivet studs and a portion of a first surface of the substrate; and
a gel coating surrounding an end of said at least one of the one or more rivet studs and a portion of a second surface of the adhesive.