IP Library Granted Patent US 12,378,664
Granted Patent B2
US 12,378,664 · App. 17/703,385 · Granted Aug 5, 2025

Metal surface layer treating method, metal assembly and electronic device

Inventor: Bing Liu (Beijing, CN)
Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
C23C16/36C23C16/50C23C16/56G04B37/223G04G17/08
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Quick Facts
Patent No.
US 12,378,664
App. No.
17/703,385
Granted
Aug 5, 2025
Kind
B2
Abstract

The disclosure provides a metal surface layer treating method, a metal assembly and an electronic device. The metal surface layer treating method includes: putting metal into a vacuum chamber, and vacuumizing the vacuum chamber to a first vacuum degree; adding a mixed gas of acetylene, nitrogen and hydrogen into the vacuum chamber; and heating the vacuum chamber to a temperature above an ambient temperature. In response to the temperature in the vacuum chamber reaching a first temperature value above the ambient temperature and a gas pressure of the vacuum chamber reaching a first pressure value, performing glow discharge so that a carbon-nitrogen gradient hardening layer is formed on a surface layer of the metal. The method includes removing part of a carbon layer of the surface layer of the carbon-nitrogen gradient hardening layer.

Claims (18)

1. A metal assembly comprising:

a metal body; and

a carbon-nitrogen gradient hardening layer covering the metal body, wherein

a hardness of the carbon-nitrogen gradient hardening layer is gradually reduced in a direction from an outside surface to an inside surface thereof,

a thickness of the carbon-nitrogen gradient hardening layer is in the range of 3 μm to 35 μm, and

the carbon-nitrogen gradient hardening layer has a hardness of 896 HV0.01 to 852 HV0.01 at a distance of 0 to 5 μm from a surface thereof.

2. The metal assembly according to claim 1 , wherein a carbon-nitrogen ratio in the carbon-nitrogen gradient hardening layer is 15:1.

3. The metal assembly according to claim 1 , wherein the carbon-nitrogen gradient hardening layer has a hardness of 811 HV0.01 to 437 HV0.01 at a distance of 10 μm to 15 μm from the surface thereof.

4. The metal assembly according to claim 3 , wherein the carbon-nitrogen gradient hardening layer has a hardness of 326 HV0.01 to 229 HV0.01 at a distance of 20 μm to 25 μm from the surface thereof.

5. The metal assembly according to claim 4 , wherein the carbon-nitrogen gradient hardening layer has a hardness of 195 HV0.01 to 152 HV0.01 at a distance of 30 μm to 35 μm from the surface thereof.

6. The metal assembly according to claim 1 , wherein a thickness of the carbon-nitrogen gradient hardening layer is 20 μm, and a hardness of an outermost layer of the carbon-nitrogen gradient hardening layer is in the range of 900 HV50gf to 1000 HV50gf.

7. The metal assembly according to claim 1 , further comprising:

a housing which is at least partially ring-shaped and has the carbon-nitrogen gradient hardening layer on an outer side thereof.

8. A metal assembly comprising:

a metal body; and

a carbon-nitrogen gradient hardening layer covering the metal body, wherein

a hardness of the carbon-nitrogen gradient hardening layer is gradually reduced in a direction from an outside surface to an inside surface thereof, and

a carbon-nitrogen ratio in the carbon-nitrogen gradient hardening layer is 15:1.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2022
From: LIU, BING
To: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
Reel/Frame 059392/0349 →
Priority Claims (1)
CN 202111138545.5 · Sep 27, 2021 · national
Continuity (1)
Related Publication 20230097354A1 · Mar 30, 2023
References Cited (8)
CN 101289735A · 2008 [cited by examiner]
CN 105839046A · 2016 [cited by applicant]
CN 108070817A · 2018 [cited by applicant]
CN 109983147A · 2019 [cited by applicant]
CN 111270198A · 2020 [cited by applicant]
GB 2261227B · 1995 [cited by applicant]
JP 2005097651A · 2005 [cited by applicant]
JP 2007016273A · 2007 [cited by applicant]