IP Library › Granted Patent US 12,379,151
Granted Patent B2
US 12,379,151 · App. 18/095,658 · Granted Aug 5, 2025

Vacuum adiabatic body and refrigerator

Inventors: Wonyeong Jung (Seoul, KR); Deokhyun Youn (Seoul, KR); Daewoong Kim (Seoul, KR)
Assignee: LG ELECTRONICS INC.
F25D23/062F16L59/065F25D19/006F25D23/028F25D23/085F25D23/087F25D2201/14
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,379,151
App. No.
18/095,658
Granted
Aug 5, 2025
Kind
B2
Abstract

A vacuum adiabatic body includes a first plate; a second plate; a seal; a support; a heat resistance unit; and an exhaust port, wherein the heat resistance unit includes a conductive resistance sheet having one end connected to the first plate member, the conductive resistance sheet resisting heat conduction flowing along a wall for the third space, the heat resistance unit further includes a side frame connected to the conductive resistance sheet, the side frame defining at least one portion of the wall for the third space, the side frame includes a first mounting surface connected to the conductive resistance sheet and a second mounting surface connected to the second plate, and the second mounting surface is supported by the support.

Claims (49)

1. A vacuum adiabatic body comprising:

a first plate to have a first temperature;

a second plate to have a second temperature different from the first temperature;

a vacuum space to be provided between the first plate and the second plate, and the vacuum space to be provided in a vacuum state, the vacuum space having a thickness in a first direction;

a conductive resistance sheet configured to resist heat transfer between the first plate and the second plate, a portion of the conductive resistance sheet being connected to at least one of the first plate or the second plate; and

a side frame having a first mounting surface connected to the first plate and a portion extending in the first direction,

wherein the side frame includes a portion defining at least one portion of a wall for the vacuum space.

2. The vacuum adiabatic body according to claim 1 , wherein the side frame includes a connection wall connecting the first mounting surface and a second mounting surface to each other, the connection wall is provided to a main portion of the vacuum adiabatic body without being provided to an edge portion of the vacuum adiabatic body, wherein the main portion of the vacuum adiabatic body is disposed at an inner side of the vacuum adiabatic body than the edge portion of the vacuum adiabatic body.

3. The vacuum adiabatic body according to claim 1 , wherein the side frame having the first mounting surface connected to the first plate,

wherein the first mounting surface is provided to a main portion of the vacuum adiabatic body without being provided to an edge portion of the vacuum adiabatic body, wherein the main portion of the vacuum adiabatic body is disposed at an inner side of the vacuum adiabatic body than the edge portion of the vacuum adiabatic body.

4. The vacuum adiabatic body according to claim 1 , wherein the side frame having a second mounting surface connected to the second plate,

wherein the second mounting surface is provided to an edge portion of the vacuum adiabatic body without being provided to a main portion of the vacuum adiabatic body, wherein the main portion of the vacuum adiabatic body is disposed at an inner side of the vacuum adiabatic body than the edge portion of the vacuum adiabatic body.

5. The vacuum adiabatic body according to claim 1 , further comprising a radiation resistance sheet configured to reduce heat radiation between the first plate and the second plate through the vacuum space.

6. A vacuum adiabatic body comprising:

a first plate to have a first temperature;

a second plate to have a second temperature different from the first temperature;

a vacuum space to be provided between the first plate and the second plate, and the vacuum space to be provided in a vacuum state, the vacuum space having a thickness in a first direction;

a conductive resistance sheet configured to resist heat transfer between the first plate and the second plate, a portion of the conductive resistance sheet being connected to at least one of the first plate or the second plate; and

a side frame having a first mounting surface connected to the first plate and a portion extending in the first direction,

wherein the side frame includes a second mounting surface and a connection wall connecting the first mounting surface and the second mounting surface to each other, and

wherein the side frame includes a portion defining at least one portion of a wall for the vacuum space.

7. The vacuum adiabatic body according to claim 6 , wherein a heat conduction distance of the side frame is be provided longer than a linear distance of the first and second plate such that a heat conduction transferring via the side frame is reduced.

8. The vacuum adiabatic body according to the claim 6 , wherein the first and second mounting surface extends in a different direction from each other.

9. The vacuum adiabatic body according to the claim 8 , wherein the first and second mounting surface extends in an opposite direction from each other.

10. The vacuum adiabatic body according to the claim 6 , wherein the first mounting surface have a different height from the second mounting surface.

11. The vacuum adiabatic body according to the claim 10 , wherein the first mounting surface have a higher height from the second mounting surface.

12. The vacuum adiabatic body according to the claim 6 , comprising a support configured to maintain a distance between the first plate and second plate, wherein the first mounting surface is not supported by the support but the second mounting surface is supported by the support.

13. The vacuum adiabatic body according to claim 6 , wherein a portion of the side frame are connected with a portion of the conductive resistance sheet, after the side frame and the conductive resistance sheet are manufactured respectively so that the side frame and the conductive resistance sheet may be provided as a separate component each other.

14. The vacuum adiabatic body according to claim 13 , wherein the other portion of the side frame is connected to the second plate.

15. The vacuum adiabatic body according to claim 13 , wherein the other portion of the conductive resistance sheet is connected to the first plate.

16. A vacuum adiabatic body comprising:

a first plate to have a first temperature;

a second plate to have a second temperature different from the first temperature;

a vacuum space to be provided between the first plate and the second plate, and the vacuum space to be provided in a vacuum state, the vacuum space having a thickness in a first direction;

a conductive resistance sheet configured to resist heat transfer between the first plate and the second plate, a portion of the conductive resistance sheet being connected to at least one of the first plate or the second plate;

a side frame having a first mounting surface connected to the first plate and a portion extending in the first direction;

wherein the side frame includes a portion having a less thickness than at least one of the first plate or the second plate such that a heat conduction transferring via the side frame is reduced, and

wherein the side frame includes a portion defining at least one portion of a wall for the vacuum space.

17. The vacuum adiabatic body according to claim 6 , further comprising a radiation resistance sheet configured to reduce heat radiation between the first plate and the second plate through the vacuum space.

18. The vacuum adiabatic body according to claim 16 , further comprising a radiation resistance sheet configured to reduce heat radiation between the first plate and the second plate through the vacuum space.

19. A vacuum adiabatic body comprising:

a first plate to have a first temperature;

a second plate to have a second temperature different from the first temperature;

a vacuum space to be provided between the first plate and the second plate, and the vacuum space to be provided in a vacuum state, the vacuum space having a thickness in a first direction;

a conductive resistance sheet configured to resist heat transfer between the first plate and the second plate, a portion of the conductive resistance sheet being connected to at least one of the first plate or the second plate; and

a side frame having a first mounting surface connected to the first plate and a portion extending in the first direction,

wherein the side frame has a bent shape and a heat conduction distance of the side frame is provided longer than a linear distance of the first and second plate such that a heat conduction transferring via the side frame is reduced, and

wherein the side frame includes a portion defining at least one portion of a wall for the vacuum space.

20. The vacuum adiabatic body according to claim 19 , further comprising a radiation resistance sheet configured to reduce heat radiation between the first plate and the second plate through the vacuum space.

Priority Claims (1)
KR 10-2015-0109625 · Aug 3, 2015 · national
Continuity (3)
Continuation 16929523 · Jul 15, 2020
Continuation 15749140
Related Publication 20230168025A1 · Jun 1, 2023
References Cited (400)
US 1413169A · Lawton · 1922 [cited by applicant]
US 1588707A · Csiga · 1926 [cited by applicant]
US 1845353A · Snell · 1932 [cited by applicant]
US 1898977A · Comstock · 1933 [cited by applicant]
US 2000882A · Comstock · 1935 [cited by applicant]
US 2550040A · Clar · 1951 [cited by applicant]
US 2708774A · Seelen · 1955 [cited by applicant]
US 2715976A · Whitmore · 1955 [cited by applicant]
US 2729863A · Kurtz · 1956 [cited by applicant]
US 2768046A · Evans · 1956 [cited by applicant]
US 2786241A · Garvey et al. · 1957 [cited by applicant]
US 3091946A · Kesling · 1963 [cited by applicant]
US 3161265A · Matsch et al. · 1964 [cited by applicant]
US 3289423A · Berner et al. · 1966 [cited by applicant]
US 3370740A · Anderson · 1968 [cited by applicant]
US 3520581A · Borghi · 1970 [cited by applicant]
US 4056211A · Zumwalt · 1977 [cited by applicant]
US 4646934A · McAllister · 1987 [cited by applicant]
US 4822117A · Boston, Jr. · 1989 [cited by applicant]
US 4959111A · Kruck et al. · 1990 [cited by applicant]
US 5011729A · Mcallister · 1991 [cited by applicant]
US 5018328A · Cur · 1991 [cited by applicant]
US 5033803A · Katsuyoshi et al. · 1991 [cited by applicant]
US 5185981A · Martinez · 1993 [cited by applicant]
US 5200015A · Schilf · 1993 [cited by applicant]
US 5361598A · Roseen · 1994 [cited by applicant]
US 5512345A · Tsutsumi · 1996 [cited by examiner]
US 5532034A · Kirby et al. · 1996 [cited by applicant]
US 5694789A · Do · 1997 [cited by applicant]
US 5795639A · Lin · 1998 [cited by applicant]
US 5843353A · De Vos et al. · 1998 [cited by applicant]
US 5947479A · Ostrowski · 1999 [cited by applicant]
US 5966888A · Richardson · 1999 [cited by examiner]
US 6001890A · Hamilton · 1999 [cited by applicant]
US 6029846A · Hirath et al. · 2000 [cited by applicant]
US 6038830A · Hirath et al. · 2000 [cited by applicant]
US 6109712A · Haworth et al. · 2000 [cited by applicant]
US 6168040B1 · Sautner et al. · 2001 [cited by applicant]
US 6192703B1 · Salyer et al. · 2001 [cited by applicant]
US 6244458B1 · Frysinger et al. · 2001 [cited by applicant]
US 6280814B1 · Offermann · 2001 [cited by examiner]
US 6338536B1 · Ueno et al. · 2002 [cited by applicant]
US 6427945B1 · Bansemir · 2002 [cited by examiner]
US 6485122B2 · Wolf · 2002 [cited by applicant]
US 6485805B1 · Smith · 2002 [cited by examiner]
US 6739104B2 · Tokonabe · 2004 [cited by examiner]
US 6860082B1 · Yamamoto · 2005 [cited by examiner]
US 7001656B2 · Maignan · 2006 [cited by examiner]
US 7111752B2 · Bucher · 2006 [cited by examiner]
US 7169459B2 · Lichodziejewski · 2007 [cited by examiner]
US 7288326B2 · Elzey · 2007 [cited by examiner]
US 7954301B2 · Mills · 2011 [cited by examiner]
US 8383225B2 · Rotter · 2013 [cited by applicant]
US 8857931B2 · Jung et al. · 2014 [cited by applicant]
US 8881398B2 · Hanley et al. · 2014 [cited by applicant]
US 8943770B2 · Sanders · 2015 [cited by applicant]
US 8944541B2 · Allard et al. · 2015 [cited by applicant]
US 9182158B2 · Wu · 2015 [cited by applicant]
US 9328951B2 · Shin · 2016 [cited by applicant]
US 9441779B1 · Alshourbagy et al. · 2016 [cited by applicant]
US 9463918B2 · Reid · 2016 [cited by applicant]
US 9752818B2 · Naik · 2017 [cited by applicant]
US 9791204B2 · Kim · 2017 [cited by applicant]
US 9945600B2 · Kang · 2018 [cited by applicant]
US 10082328B2 · Jung et al. · 2018 [cited by applicant]
US 10274247B2 · Jeong et al. · 2019 [cited by applicant]
US 20020041134A1 · Wolf et al. · 2002 [cited by applicant]
US 20020100250A1 · Hirath et al. · 2002 [cited by applicant]
US 20020170265A1 · Tokonabe et al. · 2002 [cited by applicant]
US 20030080126A1 · Voute et al. · 2003 [cited by applicant]
US 20030115838A1 · Rouanet et al. · 2003 [cited by applicant]
US 20030207075A1 · Maignan et al. · 2003 [cited by applicant]
US 20040051427A1 · Cittadini et al. · 2004 [cited by applicant]
US 20040091688A1 · Gaku · 2004 [cited by applicant]
US 20040226956A1 · Brooks · 2004 [cited by examiner]
US 20050175809A1 · Hirai et al. · 2005 [cited by applicant]
US 20050235682A1 · Hirai et al. · 2005 [cited by applicant]
US 20070089989A1 · Hoagland · 2007 [cited by examiner]
US 20070152551A1 · Kim et al. · 2007 [cited by applicant]
US 20070204648A1 · Smale et al. · 2007 [cited by applicant]
US 20070243358A1 · Gandini · 2007 [cited by applicant]
US 20080110128A1 · Hirath · 2008 [cited by applicant]
US 20080289898A1 · Rickards · 2008 [cited by applicant]
US 20090031659A1 · Kalfon · 2009 [cited by applicant]
US 20090113899A1 · Dain et al. · 2009 [cited by applicant]
US 20100104923A1 · Takeguchi et al. · 2010 [cited by applicant]
US 20100178439A1 · Bettger et al. · 2010 [cited by applicant]
US 20100283359A1 · Hottmann · 2010 [cited by applicant]
US 20110089802A1 · Cording · 2011 [cited by applicant]
US 20110146333A1 · Koo et al. · 2011 [cited by applicant]
US 20110241513A1 · Nomura · 2011 [cited by applicant]
US 20110296797A1 · Stark et al. · 2011 [cited by applicant]
US 20120103006A1 · Jung et al. · 2012 [cited by applicant]
US 20120104923A1 · Jung et al. · 2012 [cited by applicant]
US 20120118002A1 · Kim · 2012 [cited by examiner]
US 20120125039A1 · Hwang · 2012 [cited by applicant]
US 20120128920A1 · Yoon et al. · 2012 [cited by applicant]
US 20120231204A1 · Jeon et al. · 2012 [cited by applicant]
US 20120269996A1 · Jäger · 2012 [cited by applicant]
US 20120326587A1 · Jeong et al. · 2012 [cited by applicant]
US 20130008309A1 · Hashida · 2013 [cited by applicant]
US 20130026900A1 · Oh et al. · 2013 [cited by applicant]
US 20130099650A1 · Lee et al. · 2013 [cited by applicant]
US 20130105494A1 · Jung · 2013 [cited by applicant]
US 20130105495A1 · Jung · 2013 [cited by applicant]
US 20130105496A1 · Jung · 2013 [cited by applicant]
US 20130195544A1 · Sanders et al. · 2013 [cited by applicant]
US 20130255304A1 · Cur et al. · 2013 [cited by applicant]
US 20130257257A1 · Cur · 2013 [cited by applicant]
US 20130293080A1 · Kim · 2013 [cited by applicant]
US 20140103791A1 · Cheon · 2014 [cited by applicant]
US 20140132142A1 · Kim et al. · 2014 [cited by applicant]
US 20140216100A1 · Toshimitsu et al. · 2014 [cited by applicant]
US 20140272208A1 · Song et al. · 2014 [cited by applicant]
US 20140315011A1 · Lee et al. · 2014 [cited by applicant]
US 20140346942A1 · Kim et al. · 2014 [cited by applicant]
US 20150030800A1 · Jung et al. · 2015 [cited by applicant]
US 20150068401A1 · Hashida · 2015 [cited by applicant]
US 20150192356A1 · Kang et al. · 2015 [cited by applicant]
US 20150360842A1 · Bessho et al. · 2015 [cited by applicant]
US 20160108659A1 · Stark et al. · 2016 [cited by applicant]
US 20160109172A1 · Kim et al. · 2016 [cited by applicant]
US 20160356542A1 · Kim et al. · 2016 [cited by applicant]
US 20170325634A1 · Cai et al. · 2017 [cited by applicant]
US 20180266620A1 · Kawarazaki et al. · 2018 [cited by applicant]
US 20180299060A1 · Song et al. · 2018 [cited by applicant]
US 20180313492A1 · Kitano et al. · 2018 [cited by applicant]
US 20190101320A1 · Dherde et al. · 2019 [cited by applicant]
US 20190128593A1 · Deka et al. · 2019 [cited by applicant]
CN 1132346 · 1996 [cited by applicant]
CN 1191959 · 1998 [cited by applicant]
CN 1276052 · 2000 [cited by applicant]
CN 1286386 · 2001 [cited by applicant]
CN 15151857 · 2004 [cited by applicant]
CN 1576678 · 2005 [cited by applicant]
CN 2700790 · 2005 [cited by applicant]
CN 1666071 · 2005 [cited by applicant]
CN 2748848 · 2005 [cited by applicant]
CN 1731053 · 2006 [cited by applicant]
CN 1820173 · 2006 [cited by applicant]
CN 1896657 · 2007 [cited by applicant]
CN 101072968 · 2007 [cited by applicant]
CN 101171472 · 2008 [cited by applicant]
CN 101349493 · 2009 [cited by applicant]
CN 201191121 · 2009 [cited by applicant]
CN 201428906 · 2010 [cited by applicant]
CN 201764779 · 2011 [cited by applicant]
CN 102032736 · 2011 [cited by applicant]
CN 201811526 · 2011 [cited by applicant]
CN 102099646 · 2011 [cited by applicant]
CN 102116402 · 2011 [cited by applicant]
CN 102261470 · 2011 [cited by applicant]
CN 102455103 · 2012 [cited by applicant]
CN 102455104 · 2012 [cited by applicant]
CN 102455105 · 2012 [cited by applicant]
CN 102735013 · 2012 [cited by applicant]
CN 102818421 · 2012 [cited by applicant]
CN 102840729 · 2012 [cited by applicant]
CN 102927740 · 2013 [cited by applicant]
CN 103062981 · 2013 [cited by applicant]
CN 103090615 · 2013 [cited by applicant]
CN 103090616 · 2013 [cited by applicant]
CN 103140640 · 2013 [cited by applicant]
CN 103154648 · 2013 [cited by applicant]
CN 103189696 · 2013 [cited by applicant]
CN 103228851 · 2013 [cited by applicant]
CN 203095854 · 2013 [cited by applicant]
CN 103363764 · 2013 [cited by applicant]
CN 103370587 · 2013 [cited by applicant]
CN 103542660 · 2014 [cited by applicant]
CN 103575038 · 2014 [cited by applicant]
CN 103649658 · 2014 [cited by applicant]
CN 103968196 · 2014 [cited by applicant]
CN 104180595 · 2014 [cited by applicant]
CN 104204646 · 2014 [cited by applicant]
CN 104254749 · 2014 [cited by applicant]
CN 104344653 · 2015 [cited by applicant]
CN 104457117A · 2015 [cited by applicant]
CN 104482707 · 2015 [cited by applicant]
CN 104567215 · 2015 [cited by applicant]
CN 104634047 · 2015 [cited by applicant]
CN 104696669 · 2015 [cited by applicant]
CN 104729201 · 2015 [cited by applicant]
CN 104746690 · 2015 [cited by applicant]
CN 105546923 · 2016 [cited by applicant]
CN 108354755 · 2018 [cited by applicant]
DE 956899 · 1957 [cited by applicant]
DE 2802910 · 1978 [cited by applicant]
DE 2939878 · 1981 [cited by applicant]
DE 3121351 · 1982 [cited by applicant]
DE 9204365 · 1992 [cited by applicant]
DE 19745825 · 1999 [cited by applicant]
DE 19803908 · 1999 [cited by applicant]
DE 29912917 · 1999 [cited by applicant]
DE 19907182 · 2000 [cited by applicant]
DE 102011050473 · 2011 [cited by applicant]
DE 102011014302 · 2012 [cited by applicant]
DE 102011079209 · 2013 [cited by applicant]
DE 102012100490 · 2013 [cited by applicant]
DE 102012223539 · 2014 [cited by applicant]
EP 0071090 · 1983 [cited by applicant]
EP 0658716 · 1995 [cited by applicant]
EP 0658733 · 1995 [cited by applicant]
EP 0892120 · 1999 [cited by applicant]
EP 1477752 · 2004 [cited by applicant]
EP 1484563 · 2004 [cited by applicant]
EP 1614954 · 2006 [cited by applicant]
EP 2333179 · 2011 [cited by applicant]
EP 2447639 · 2012 [cited by applicant]
EP 2806239 · 2014 [cited by applicant]
EP 2824405 · 2015 [cited by applicant]
EP 2829827 · 2015 [cited by applicant]
EP 2936013 · 2015 [cited by applicant]
EP 2952839 · 2015 [cited by applicant]
EP 2952838 · 2015 [cited by applicant]
EP 2789951 · 2020 [cited by applicant]
GB 890372 · 1962 [cited by applicant]
GB 2446053 · 2008 [cited by applicant]
JP H04341694 · 1992 [cited by applicant]
JP H0510494 · 1993 [cited by applicant]
JP H07234067 · 1995 [cited by applicant]
JP H09145241 · 1997 [cited by applicant]
JP 11211334 · 1999 [cited by applicant]
JP H11335114 · 1999 [cited by applicant]
JP 2002243091A · 2002 [cited by applicant]
JP 2002340280 · 2002 [cited by applicant]
JP 2003106760 · 2003 [cited by applicant]
JP 2003269688 · 2003 [cited by applicant]
JP 2004044980 · 2004 [cited by applicant]
JP 2004196411 · 2004 [cited by applicant]
JP 2005214372A · 2005 [cited by applicant]
JP 2007218509 · 2007 [cited by applicant]
JP 2008045580 · 2008 [cited by applicant]
JP 2008249003 · 2008 [cited by applicant]
JP 2009078261A · 2009 [cited by applicant]
JP 2010008011 · 2010 [cited by applicant]
JP 2012087993 · 2012 [cited by applicant]
JP 2012255607 · 2012 [cited by applicant]
JP 2013119966A · 2013 [cited by applicant]
JP 2013195009 · 2013 [cited by applicant]
JP 2014037931 · 2014 [cited by applicant]
KR 1019920703942 · 1992 [cited by applicant]
KR 1020010073363 · 2001 [cited by applicant]
KR 100343719 · 2002 [cited by applicant]
KR 100411841 · 2003 [cited by applicant]
KR 1020050065088 · 2005 [cited by applicant]
KR 20070052156 · 2007 [cited by applicant]
KR 1020090111632 · 2009 [cited by applicant]
KR 1020100097410 · 2010 [cited by applicant]
KR 1020100099629 · 2010 [cited by applicant]
KR 1020100119937 · 2010 [cited by applicant]
KR 1020100136614 · 2010 [cited by applicant]
KR 1020110015322 · 2011 [cited by applicant]
KR 1020110015325 · 2011 [cited by applicant]
KR 1020110015327 · 2011 [cited by applicant]
KR 101041086 · 2011 [cited by applicant]
KR 1020110100440 · 2011 [cited by applicant]
KR 1020120044558A · 2012 [cited by applicant]
KR 1020120139648 · 2012 [cited by applicant]
KR 101227516 · 2013 [cited by applicant]
KR 1020130048528 · 2013 [cited by applicant]
KR 1020130048530A · 2013 [cited by applicant]
KR 1020130054213 · 2013 [cited by applicant]
KR 1020140129552 · 2014 [cited by applicant]
KR 1020150012712 · 2015 [cited by applicant]
KR 101506413 · 2015 [cited by applicant]
NL 1005962 · 1998 [cited by applicant]
RU 129188 · 2013 [cited by applicant]
WO WO9325843 · 1993 [cited by applicant]
WO WO2006003199 · 2006 [cited by applicant]
WO WO2012084874 · 2012 [cited by applicant]
WO WO2012176880 · 2012 [cited by applicant]
WO WO2013007568 · 2013 [cited by applicant]
WO WO2014049969 · 2014 [cited by applicant]
WO WO2014175639 · 2014 [cited by applicant]
WO WO2016208193A1 · 2016 [cited by applicant]
WO WO2017023095 · 2017 [cited by applicant]
WO WO2017192121 · 2017 [cited by applicant]
WO WO2018044274 · 2018 [cited by applicant]
U.S. Office Action dated Mar. 18, 2024, issued in U.S. Appl. No. 18/237,531. [cited by applicant]
U.S. Appl. No. 17/411,659, filed Aug. 25, 2021. [cited by applicant]
U.S. Appl. No. 18/091,203, filed Dec. 29, 2022. [cited by applicant]
U.S. Appl. No. 17/170,005, filed Feb. 8, 2021. [cited by applicant]
U.S. Appl. No. 17/939,507, filed Sep. 7, 2022. [cited by applicant]
U.S. Appl. No. 17/749,679, filed May 20, 2022. [cited by applicant]
U.S. Appl. No. 17/582,596, filed Jan. 24, 2022. [cited by applicant]
U.S. Appl. No. 18/508,279, filed Nov. 14, 2023. [cited by applicant]
U.S. Appl. No. 18/095,658, filed Jan. 11, 2023. [cited by applicant]
U.S. Appl. No. 18/237,531, filed Aug. 24, 2023. [cited by applicant]
U.S. Appl. No. 17/980,088, filed Nov. 3, 2022. [cited by applicant]
U.S. Appl. No. 18/416,453, filed Jan. 18, 2024. [cited by applicant]
U.S. Appl. No. 18/091,040, filed Dec. 29, 2022. [cited by applicant]
Korean Office Action dated Jul. 31, 2023 issued in Application 10-2023-0020717. [cited by applicant]
U.S. Office Action dated Mar. 20, 2023 issued in co-pending related U.S. Appl. No. 17/030,806. [cited by applicant]
Machine translation of EP 2 952 839. [cited by applicant]
Korean Office Action dated Nov. 13, 2023 issued in Application No. 10-2023-0014241. [cited by applicant]
U.S. Appl. No. 18/640,367, filed Apr. 19, 2024. [cited by applicant]
Korean Office Action dated Apr. 4, 2024 issued in Application No. 10-2023-0036738. [cited by applicant]
U.S. Office Action dated Apr. 27, 2023 issued in U.S. Appl. No. 17/072,231. [cited by applicant]
U.S. Notice of Allowance dated Mar. 23, 2023 issued in U.S. Appl. No. 16/953,846. [cited by applicant]
International Search Report and Written Opinion dated Oct. 12, 2016 issued in Application No. PCT/KR2016/008465. [cited by applicant]
International Search Report and Written Opinion dated Oct. 12, 2016 issued in Application No. PCT/KR2016/008507. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008466. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008468. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008469. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008470. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008501. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008502. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008505. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008519. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008523. [cited by applicant]
International Search Report and Written Opinion dated Dec. 7, 2016 issued in Application No. PCT/KR2016/008516. [cited by applicant]
International Search Report and Written Opinion dated Dec. 23, 2016 issued in Application No. PCT/KR2016/008512. [cited by applicant]
International Search Report and Written Opinion dated Dec. 23, 2016 issued in Application No. PCT/KR2016/008514. [cited by applicant]
Russian Office Action dated Sep. 25, 2018 issued in RU Application No. 2018107646. [cited by applicant]
European Search Report dated Dec. 21, 2018 issued in EP Application No. 16833330.0. [cited by applicant]
European Search Report dated Feb. 13, 2019 issued in EP Application No. 16833309.4. [cited by applicant]
European Search Report dated Feb. 13, 2019 issued in EP Application No. 16833311.0. [cited by applicant]
European Search Report dated Feb. 20, 2019 issued in EP Application No. 16833313.6. [cited by applicant]
European Search Report dated Feb. 22, 2019 issued in EP Application No. 16833312.8. [cited by applicant]
European Search Report dated Feb. 26, 2019 issued in EP Application No. 16833324.3. [cited by applicant]
European Search Report dated Feb. 26, 2019 issued in EP Application No. 16833336.7. [cited by applicant]
European Search Report dated Mar. 1, 2019 issued in EP Application No. 16833323.5. [cited by applicant]
European Search Report dated Mar. 1, 2019 issued in EP Application No. 16833338.3. [cited by applicant]
European Search Report dated Mar. 13, 2019 issued in EP Application No. 16833331.8. [cited by applicant]
European Search Report dated Mar. 15, 2019 issued in EP Application No. 16833326.8. [cited by applicant]
European Search Report dated Apr. 3, 2019 issued in EP Application No. 16833325.0. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,139. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,142. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,136. [cited by applicant]
Chinese Office Action (with English translation) dated Jul. 15, 2019 issued in CN Application No. 201680045949.0. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045869.5. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045899.6. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045908.1. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045935.9. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680046042.6. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680046048.3. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 13, 2019 issued in CN Application No. 201680045950.3. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680045897. 7. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680045898.1. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680046047.9. [cited by applicant]
U.S. Office Action dated Sep. 20, 2019 issued in U.S. Appl. No. 15/749,149. [cited by applicant]
U.S. Office Action dated Oct. 4, 2019 issued in related U.S. Appl. No. 15/749,140. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in U.S. Appl. No. 15/749,143. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in U.S. Appl. No. 15/749,162. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in parent U.S. Appl. No. 15/749,147. [cited by applicant]
U.S. Office Action dated Dec. 10, 2019 issued in U.S. Appl. No. 15/749,132. [cited by applicant]
U.S. Office Action dated Feb. 18, 2020 issued in co-pending related U.S. Appl. No. 15/749,146. [cited by applicant]
U.S. Office Action dated Mar. 20, 2020 issued in co-pending related U.S. Appl. No. 15/749,162. [cited by applicant]
U.S. Office Action dated Mar. 24, 2020 issued in co-pending related U.S. Appl. No. 15/749,154. [cited by applicant]
U.S. Office Action dated Mar. 27, 2020 issued in co-pending related U.S. Appl. No. 15/749,149. [cited by applicant]
U.S. Office Action dated Apr. 15, 2020 issued in co-pending related U.S. Appl. No. 15/749,136. [cited by applicant]
U.S. Notice of Allowance dated Apr. 15, 2020 issued in co-pending related U.S. Appl. No. 15/749,140. [cited by applicant]
U.S. Office Action dated May 25, 2020 issued in co-pending related U.S. Appl. No. 15/749,156. [cited by applicant]
Korean Office Action dated Jun. 5, 2020 issued in Application 10-2017-0093784. [cited by applicant]
Extended European Search Report dated Jul. 10, 2020 issued in Application 20168389.3. [cited by applicant]
European Office Action dated Jan. 11, 2021 issued in Application 16 833 313.6. [cited by applicant]
United States Office Action dated Feb. 5, 2021 issued in related co-pending U.S. Appl. No. 15/749,156. [cited by applicant]
U.S. Office Action dated Mar. 31, 2021 issued in co-pending U.S. Appl. No. 15/749,132. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248772.2. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248789.8. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248791.5. [cited by applicant]
Chinese Office Action dated Apr. 8, 2021 issued in CN Application No. 202010248891.8. [cited by applicant]
Chinese Office Action dated Jun. 2, 2021 issued in CN Application No. 202010634146.7. [cited by applicant]
Chinese Office Action dated Jun. 23, 2021 issued in CN Application No. 202010669915.7. [cited by applicant]
Chinese Office Action dated Jun. 24, 2021 issued in CN Application No. 202010669926.5. [cited by applicant]
United States Office Action dated Jun. 28, 2021 issued in co-pending related U.S. Appl. No. 15/749,156. [cited by applicant]
Chinese Office Action and Search Report dated Jul. 20, 2021 issued in Application 20101067100.X. [cited by applicant]
Korean Office Action dated Aug. 1, 2021 issued in KR Application No. 10-2021-0085731. [cited by applicant]
Chinese Office Action dated Aug. 2, 2021 issued in CN Application No. 202010972409.5. [cited by applicant]
Chinese Office Action dated Aug. 3, 2021 issued in CN Application No. 202010972419.9. [cited by applicant]
Chinese Office Action dated Aug. 4, 2021 issued in CN Application No. 202010972442.8. [cited by applicant]
United States Office Action dated Oct. 5, 2021 issued in co-pending related U.S. Appl. No. 16/942,262. [cited by applicant]
European Search Report dated Oct. 11, 2021 issued in EP Application No. 21185349.4. [cited by applicant]
European Search Report dated Oct. 11, 2021 issued in EP Application No. 21185362.7. [cited by applicant]
United States Office Action dated Oct. 22, 2021 issued in co-pending related U.S. Appl. No. 17/021,582. [cited by applicant]
United States Office Action dated Oct. 26, 2021 issued in co-pending related U.S. Appl. No. 16/942,213. [cited by applicant]
Chinese Office Action dated Dec. 3, 2021 issued in CN Application No. 202110032077.7. [cited by applicant]
European Search Report dated Feb. 8, 2022 issued in EP Application No. 21203498.7. [cited by applicant]
Chinese Office Action dated Feb. 15, 2022 issued in CN Application No. 202010671000.X. [cited by applicant]
Chinese Office Action dated Feb. 18, 2022 issued in CN Application No. 202010975466.9. [cited by applicant]
United States Office Action dated Mar. 2, 2022 issued in co-pending related U.S. Appl. No. 17/170,005. [cited by applicant]
United States Office Action dated Mar. 31, 2022 issued in co-pending related U.S. Appl. No. 16/929,523. [cited by applicant]
Chinese Office Action dated May 18, 2022 issued in CN Application No. 202110718315.X. [cited by applicant]
Chinese Notice of Allowance dated Jun. 1, 2022 issued in CN Application No. 202110032072.4. [cited by applicant]
Korean Notice of Allowance dated Jun. 1, 2022 issued in KR Application No. 10-2021-0085731. [cited by applicant]
United States Office Action dated Jun. 10, 2022 issued in co-pending related U.S. Appl. No. 16/942,213. [cited by applicant]
United States Office Action dated Jul. 7, 2022 issued in co-pending related U.S. Appl. No. 16/710,720. [cited by applicant]
United States Office Action dated Jul. 13, 2022 issued in co-pending related U.S. Appl. No. 17/134,911. [cited by applicant]
United States Office Action dated Jul. 26, 2022 issued in co-pending related U.S. Appl. No. 17/030,806. [cited by applicant]
Korean Office Action dated Aug. 8, 2022 issued in KR Application No. 10-2015-0109622. [cited by applicant]
United States Office Action dated Oct. 6, 2022 issued in co-pending related U.S. Appl. No. 17/072,231. [cited by applicant]
Korean Notice of Allowance dated Nov. 2, 2022 issued in Application 10-2015-0109720. [cited by applicant]
European Search Report dated Nov. 3, 2022 issued in EP Application No. 22151005.0. [cited by applicant]
European Office Action dated Nov. 21, 2022 issued in EP Application No. 20168389.3. [cited by applicant]
United States Office Action dated Nov. 25, 2022 issued in co-pending related U.S. Appl. No. 17/411,659. [cited by applicant]
United States Office Action dated Dec. 22, 2022 issued in co-pending related U.S. Appl. No. 16/953,846. [cited by applicant]
U.S. Appl. No. 16/942,213, filed Jul. 29, 2020. [cited by applicant]
U.S. Appl. No. 17/030,806, filed Sep. 24, 2020. [cited by applicant]
U.S. Appl. No. 16/710,720, filed Dec. 11, 2019. [cited by applicant]