Curable composition for imprinting, method for producing curable composition for imprinting, cured product, pattern producing method, and method for manufacturing semiconductor element
Provided are a curable composition for imprinting including a polymerizable compound, a photopolymerization initiator, and a particulate metal which has a particle diameter of 1 nm or larger, as measured by a single particle ICP-MASS method, and includes at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 100 ppt by mass to 30 ppb by mass with respect to a solid content of the composition; a method for producing the curable composition for imprinting; a cured product using the curable composition for imprinting; a pattern producing method; and a method for manufacturing a semiconductor element.
1. A curable composition for imprinting comprising:
a polymerizable compound having a polymerizable group with a (meth)acryloyl group;
a photopolymerization initiator which is selected from the group consisting of an acetophenone-based compound, an acylphosphine oxide-based compound, an oxime ester-based compound and an oxime compound having a fluorine atom; and
a particulate metal which has a particle diameter of 1 nm or larger, as measured by a single particle ICP-MASS method, and includes at least one kind of iron, copper, titanium, or lead,
wherein a content of the particulate metal is 100 ppt by mass to 30 ppb by mass with respect to a solid content of the composition;
an amine value of the curable composition is 0.001 mmol/g or more and 1 mmol/g or less; and
an acid value of the curable composition is 0.001 mmol/g or more and 1 mmol/g or less.
2. The curable composition for imprinting according to claim 1 , further comprising a particulate metal which is other than the aforementioned particulate metal, has a particle diameter of 1 nm or larger, as measured by the single particle ICP-MASS method, and contains at least one kind of sodium, potassium, calcium, magnesium, manganese, aluminum, lithium, chromium, nickel, tin, zinc, arsenic, silver, gold, cadmium, cobalt, vanadium, or tungsten,
wherein a total amount of the particulate metal which has a particle diameter of 1 nm or larger, as measured by the single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead and the particulate metal which is other than the aforementioned particulate metal, has a particle diameter of 1 nm or larger, as measured by the single particle ICP-MASS method, and contains at least one kind of sodium, potassium, calcium, magnesium, manganese, aluminum, lithium, chromium, nickel, tin, zinc, arsenic, silver, gold, cadmium, cobalt, vanadium, or tungsten is 250 ppt by mass to 40 ppb by mass with respect to the solid content of the composition.
3. The curable composition for imprinting according to claim 1 ,
wherein a solvent is not substantially contained.
4. The curable composition for imprinting according to claim 1 ,
wherein a polymer having a weight-average molecular weight of 2,000 or greater is not substantially contained.
5. The curable composition for imprinting according to claim 1 ,
wherein a silicon atom is not substantially contained.
6. The curable composition for imprinting according to claim 5 , further comprising a release agent.
7. The curable composition for imprinting according to claim 1 ,
wherein a content of the polymerizable compound in the composition is 80% by mass or greater.
8. A method for producing the curable composition for imprinting according to claim 1 , comprising using raw materials subjected to at least one of a distillation treatment or an acid cleaning treatment.
9. The method for producing the curable composition for imprinting according to claim 8 , further comprising mixing the raw materials of the composition and then subjecting the mixture to a filtration treatment with a filter containing polyamide.
10. A cured product formed of the curable composition for imprinting according to claim 1 .
11. A pattern producing method comprising applying the curable composition for imprinting according to claim 1 onto a substrate or a mold and irradiating the curable composition for imprinting with light in a state of being sandwiched between the mold and the substrate.
12. The pattern producing method according to claim 11 ,
wherein a pattern has at least one shape of a line having a line width of 100 nm or less or a hole having a hole diameter of 100 nm or less.
13. A method for manufacturing a semiconductor element, comprising the pattern producing method according to claim 11 .
14. The method for manufacturing a semiconductor element, comprising performing etching using a pattern obtained by the pattern producing method according to claim 11 as a mask.