Bulk acoustic wave resonator and method for manufacturing the same
A bulk acoustic wave (BAW) resonator includes a piezoelectric layer, a first electrode layer disposed on a first side of the piezoelectric layer and including a first electrode and an additional electrode electrically isolated from each other, a second electrode layer disposed on a second side of the piezoelectric layer and including a second electrode, one or more conductive pads disposed on the second side of the piezoelectric layer and at least including an interconnection pad electrically connected to the second electrode and the additional electrode, a carrier structure disposed on the first side of the piezoelectric layer, a cover structure disposed on the second side of the piezoelectric layer and including a cover bonding layer and a cover substrate. A first cavity is disposed between the carrier structure and the piezoelectric layer. A second cavity is disposed between the cover structure and the piezoelectric layer.
1. A bulk acoustic wave resonator, comprising:
a piezoelectric layer, having a first side and a second side opposite to each other in a first direction;
a first electrode layer, disposed on the first side of the piezoelectric layer and comprising a first electrode and an additional electrode electrically isolated from each other;
a second electrode layer, disposed on the second side of the piezoelectric layer and comprising a second electrode;
one or more conductive pads, disposed on the second side of the piezoelectric layer and at least comprising an interconnection pad, wherein the interconnection pad is electrically connected to the second electrode and extends through the second electrode and the piezoelectric layer to be electrically connected to the additional electrode;
a carrier structure, disposed on the first side of the piezoelectric layer and a first side of the first electrode layer away from the second electrode layer, wherein a first cavity is disposed between the carrier structure and the piezoelectric layer, and a portion of the first electrode is located in the first cavity;
a cover structure, disposed on the second side of the piezoelectric layer and comprising a cover bonding layer and a cover substrate, wherein the cover bonding layer is disposed between the cover substrate and the piezoelectric layer in the first direction, wherein a second cavity is disposed between the cover structure and the piezoelectric layer, and a portion of the second electrode layer is located in the second cavity; and
a first conductive connector and a second conductive connector, disposed on the first side of the piezoelectric layer away from the cover structure, wherein the first conductive connector extends through the carrier structure to be electrically connected to the first electrode, wherein the second conductive connector extends through the carrier structure to be electrically connected to the additional electrode, and further electrically connected to the second electrode through the additional electrode and the interconnection pad.
2. The bulk acoustic wave resonator of claim 1 , wherein
the one or more conductive pads include a bonding pad, and
the cover substrate is bonded with the piezoelectric layer by the bonding pad and the cover bonding layer.
3. The bulk acoustic wave resonator of claim 2 , wherein the cover bonding layer and the one or more conductive pads include a same material.
4. The bulk acoustic wave resonator of claim 3 , wherein the cover bonding layer and the one or more conductive pads include gold (Au).
5. The bulk acoustic wave resonator of claim 2 , wherein
the cover bonding layer includes organic materials, and
the one or more conductive pads include conductive materials.
6. The bulk acoustic wave resonator of claim 5 , wherein
the cover bonding layer includes dry film, and
the one or more conductive pads include metal.
7. The bulk acoustic wave resonator of claim 1 , wherein the cover substrate includes silicon (Si).
8. The bulk acoustic wave resonator of claim 1 , wherein the carrier structure comprises:
a carrier substrate;
a supporting dielectric layer disposed between the carrier substrate and the piezoelectric layer; and
a carrier bonding layer disposed between the carrier substrate and the supporting dielectric layer.
9. The bulk acoustic wave resonator of claim 8 , wherein the first cavity is formed in the supporting dielectric layer.
10. The bulk acoustic wave resonator of claim 9 , wherein
the carrier bonding layer comprises a bonding protrusion protruding towards the piezoelectric layer and surrounding the first cavity, and
the bulk acoustic wave resonator further comprises a cavity boundary layer overlying at least the bonding protrusion.
11. The bulk acoustic wave resonator of claim 10 , wherein the cavity boundary layer overlays the bonding protrusion and a portion of the carrier bonding layer surrounded by the bonding protrusion.
12. The bulk acoustic wave resonator of claim 10 , wherein the cavity boundary layer overlays the entire carrier bonding layer.
13. The bulk acoustic wave resonator of claim 10 , wherein the cavity boundary layer contacts at least one of the piezoelectric layer or the first electrode.
14. The bulk acoustic wave resonator of claim 9 , wherein an edge of the first electrode is located inside the first cavity.
15. The bulk acoustic wave resonator of claim 1 , wherein
the first conductive connector includes a first conductive bump disposed below a bottom surface of the carrier structure, and electrically connected to, the first electrode, and
the second conductive connector includes a second conductive bump disposed below the bottom surface of the carrier structure, and electrically connected to, the second electrode.
16. The bulk acoustic wave resonator of claim 15 , further comprising:
a first connection via hole extending through the carrier structure, and exposing a portion of the first electrode; and
a second connection via hole extending through the carrier structure, and exposing the additional electrode.
17. The bulk acoustic wave resonator of claim 16 , wherein
the first conductive connector includes a first redistribution layer portion disposed below the bottom surface of the carrier structure and within the first connection via hole and contacting the exposed portion of the first electrode, and
the first conductive connector includes a second redistribution layer portion disposed below the bottom surface of the carrier structure and within the second connection via hole and contacting the exposed portion of the additional electrode.
18. The bulk acoustic wave resonator of claim 17 , wherein
the first conductive bump is electrically connected to the first redistribution layer portion, and
the second conductive bump is electrically connected to the second redistribution layer portion.
19. The bulk acoustic wave resonator of claim 15 , wherein
the piezoelectric layer includes an additional piezoelectric via hole exposing a portion of the additional electrode, and
the interconnection pad is disposed in the additional piezoelectric via hole and electrically connecting the second electrode and the additional electrode.
20. The bulk acoustic wave resonator of claim 2 , wherein the second cavity is surrounded by the cover bonding layer and the bonding pad.