Radio-frequency module and communication apparatus
A radio-frequency module includes: a module substrate having major faces; a first circuit component disposed over the major face; a second circuit component disposed over the major face: external connection terminals disposed over the major face; and a metal shield plate extending perpendicularly from the major face and set to a ground potential. The external connection terminals include a first external connection terminal and a second external connection terminal, the first external connection terminal being an external connection terminal through which a first radio-frequency signal is inputted or outputted, the second external connection terminal being an external connection terminal through which one of a power supply signal, a control signal, and a second radio-frequency signal is inputted or outputted. The metal shield plate has a recess in an end portion.
1. A radio-frequency module comprising:
a module substrate having a first major face and a second major face, the first major face and the second major face being opposite to each other;
a first circuit component disposed over the first major face;
a second circuit component disposed over the second major face;
a plurality of external connection terminals disposed over the second major face; and
a metal shield plate disposed over the second major face and extending in a direction perpendicular to the second major face, the metal shield plate being set to a ground potential,
wherein the plurality of external connection terminals include a first external connection terminal and a second external connection terminal, the first external connection terminal being an external connection terminal through which a first radio-frequency signal is inputted or outputted, the second external connection terminal being an external connection terminal through which one of a power supply signal, a control signal, and a second radio-frequency signal is inputted or outputted,
wherein the metal shield plate has a recess in at least one of end portions being opposite to each other in the direction perpendicular to the second major face, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal, or between the second external connection terminal and the second circuit component.
2. The radio-frequency module according to claim 1 , further comprising
a via-conductor disposed inside the module substrate, the via-conductor extending in a direction crossing the second major face, the via-conductor being set to a ground potential,
wherein the metal shield plate is connected at the second major face with the via-conductor, and
wherein the via-conductor has an outside diameter greater than or equal to a thickness of the metal shield plate.
3. The radio-frequency module according to claim 2 , further comprising:
a resin component covering the first major face, and at least part of the first circuit component; and
a metal shield layer covering a surface of the resin component, the metal shield layer being set to a ground potential,
wherein the metal shield plate is thicker than the metal shield layer.
4. The radio-frequency module according to claim 2 ,
wherein the metal shield plate has a height from the second major face being greater than or equal to a height of the second external connection terminal from the second major face.
5. The radio-frequency module according to claim 2 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the second external connection terminal is a transmit input terminal connected with an input terminal of the power amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the second external connection terminal and the second circuit component.
6. The radio-frequency module according to claim 2 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the radio-frequency module further comprises
an antenna connection terminal, and
a switch configured to switch whether to connect the antenna connection terminal and the power amplifier with each other, and switch whether to connect the antenna connection terminal and the low-noise amplifier with each other,
wherein the first external connection terminal is the antenna connection terminal,
wherein the second external connection terminal is a transmit input terminal or a receive output terminal, the transmit input terminal being connected with an input terminal of the power amplifier, the receive output terminal being connected with an output terminal of the low-noise amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal.
7. The radio-frequency module according to claim 2 ,
wherein the metal shield plate includes
a body part extending in the direction perpendicular to the second major face, and
a joint part extending in parallel to the second major face, the joint part being connected at the second major face with the via-conductor.
8. The radio-frequency module according to claim 7 , further comprising:
a resin component covering the first major face, and at least part of the first circuit component; and
a metal shield layer covering a surface of the resin component, the metal shield layer being set to a ground potential,
wherein the metal shield plate is thicker than the metal shield layer.
9. The radio-frequency module according to claim 7 ,
wherein the metal shield plate has a height from the second major face being greater than or equal to a height of the second external connection terminal from the second major face.
10. The radio-frequency module according to claim 7 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the second external connection terminal is a transmit input terminal connected with an input terminal of the power amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the second external connection terminal and the second circuit component.
11. The radio-frequency module according to claim 7 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the radio-frequency module further comprises
an antenna connection terminal, and
a switch configured to switch whether to connect the antenna connection terminal and the power amplifier with each other, and switch whether to connect the antenna connection terminal and the low-noise amplifier with each other,
wherein the first external connection terminal is the antenna connection terminal,
wherein the second external connection terminal is a transmit input terminal or a receive output terminal, the transmit input terminal being connected with an input terminal of the power amplifier, the receive output terminal being connected with an output terminal of the low-noise amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal.
12. The radio-frequency module according to claim 1 , further comprising:
a resin component covering the first major face, and at least part of the first circuit component; and
a metal shield layer covering a surface of the resin component, the metal shield layer being set to a ground potential,
wherein the metal shield plate is thicker than the metal shield layer.
13. The radio-frequency module according to claim 12 ,
wherein the metal shield plate has a height from the second major face being greater than or equal to a height of the second external connection terminal from the second major face.
14. The radio-frequency module according to claim 12 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the second external connection terminal is a transmit input terminal connected with an input terminal of the power amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the second external connection terminal and the second circuit component.
15. The radio-frequency module according to claim 12 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the radio-frequency module further comprises
an antenna connection terminal, and
a switch configured to switch whether to connect the antenna connection terminal and the power amplifier with each other, and switch whether to connect the antenna connection terminal and the low-noise amplifier with each other,
wherein the first external connection terminal is the antenna connection terminal,
wherein the second external connection terminal is a transmit input terminal or a receive output terminal, the transmit input terminal being connected with an input terminal of the power amplifier, the receive output terminal being connected with an output terminal of the low-noise amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal.
16. The radio-frequency module according to claim 1 ,
wherein the metal shield plate has a height from the second major face being greater than or equal to a height of the second external connection terminal from the second major face.
17. The radio-frequency module according to claim 16 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the second external connection terminal is a transmit input terminal connected with an input terminal of the power amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the second external connection terminal and the second circuit component.
18. The radio-frequency module according to claim 1 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the second external connection terminal is a transmit input terminal connected with an input terminal of the power amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the second external connection terminal and the second circuit component.
19. The radio-frequency module according to claim 1 ,
wherein the first circuit component is a power amplifier,
wherein the second circuit component is a low-noise amplifier,
wherein the radio-frequency module further comprises
an antenna connection terminal, and
a switch configured to switch whether to connect the antenna connection terminal and the power amplifier with each other, and switch whether to connect the antenna connection terminal and the low-noise amplifier with each other,
wherein the first external connection terminal is the antenna connection terminal,
wherein the second external connection terminal is a transmit input terminal or a receive output terminal, the transmit input terminal being connected with an input terminal of the power amplifier, the receive output terminal being connected with an output terminal of the low-noise amplifier, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal.
20. A communication apparatus comprising:
a radio-frequency integrated circuit configured to process a radio-frequency signal transmitted and received by an antenna; and
the radio-frequency module according to claim 1 configured to propagate the radio-frequency signal between the antenna and the radio-frequency integrated circuit.