Granted Patent B2

US 12,382,582 · App. 18/628,945 · Granted Aug 5, 2025

Inventor: Won Suk Jung (Seoul, KR)

Assignee: LG INNOTEK CO., LTD.

H05K1/115H05K1/0306H05K1/185H05K2201/096

Abstract

Claims (26)

1. A circuit board comprising:

a first insulating layer including a cavity;

a connection member embedded in the cavity of the first insulating layer; and

a second insulating layer disposed on the first insulating layer and the connection member,

wherein the first insulating layer includes a lower insulating layer overlapping the connection member in a horizontal direction, and an upper insulating layer disposed on the lower insulating layer and overlapping the connection member in the horizontal direction,

wherein the second insulating layer includes a portion disposed on an upper surface of the upper insulating layer,

wherein a thickness of the portion of the second insulating layer in a vertical direction is smaller than a thickness of the lower insulating layer in the vertical direction and a thickness of the upper insulating layer in the vertical direction.

2. The circuit board of claim 1 , comprising:

a first via electrode passing through at least a portion of the lower insulating layer and overlapping the connection member in the horizontal direction, and

a second via electrode passing through at least a portion of the upper insulating layer and including a portion overlapping the connection member along the horizontal direction.

3. The circuit board of claim 2 , wherein the first via electrode has a side surface inclined in an inclined direction in which a width in the horizontal direction changes toward the second insulating layer, and

wherein a side surface of the portion of the second via electrode is inclined in a same direction as the side surface of the first via electrode is inclined.

4. The circuit board of claim 2 , comprising:

an intermediate wiring layer disposed between the first via electrode and the portion of the second electrode, and

wherein the intermediate wiring layer overlaps the connection member along the horizontal direction.

5. The circuit board of claim 2 , comprising:

a third via electrode passing through at least a portion of the second insulating layer and overlapping the connection member along the vertical direction, and

wherein a width of the third via electrode in the horizontal direction is different from a width of the first via electrode in the horizontal direction and a width of the portion of the second via electrode in the horizontal direction.

6. The circuit board of claim 5 , wherein the width of the third via electrode in the horizontal direction is smaller than the width of the first via electrode in the horizontal direction and the width of the portion of the second via electrode in the horizontal direction.

7. The circuit board of claim 5 , comprising:

a fourth via electrode passing through at least a portion of the portion of the second insulating layer and overlapping the third via electrode in the horizontal direction, and

wherein a width of the fourth via electrode in the horizontal direction is different from a width of the third via electrode in the horizontal direction.

8. The circuit board of claim 7 , wherein the width of the fourth via electrode in the horizontal direction is larger than the width of the third via electrode in the horizontal direction.

9. The circuit board of claim 5 , wherein the connection member includes a connection electrode, and

wherein a lower surface of the third via electrode is in direct contact with an upper surface of the connection electrode.

10. The circuit board of claim 1 , wherein the second insulating layer includes an insulating material different from insulating materials of the upper insulating layer and the lower insulating layer.

Priority Claims (1)

Continuity (3)

References Cited (40)

Cited By (1)

US 12,696,384