Electronic device including vent structure and heat dissipation structure
A wearable electronic device according to various embodiments disclosed herein may include: a housing, a printed circuit board on which a processor is disposed, a display module including a display, a vent hole disposed at the housing, a connection member comprising a conductor and including a vent region facing the vent hole and electrically connecting the printed circuit board and the display module, a heat dissipation member comprising a material having high thermal conductivity and disposed at the connection member and at least a part of which covers at least a part of the vent region, and a vent bracket including a vent channel connected to the vent hole and is disposed between the heat dissipation member and the vent hole.
1. A wearable electronic device comprising:
a housing;
a printed circuit board on which a processor is disposed;
a display module;
a vent hole formed in the housing;
a connection member comprising a conductor and including a vent region facing the vent hole and electrically connecting the printed circuit board and the display module;
a heat dissipation member comprising a thermally conductive material disposed at the connection member and at least a part of which covers at least a part of the vent region; and
a vent bracket including a vent channel connected to the vent hole and disposed between the heat dissipation member and the vent hole,
wherein the heat dissipation member is disposed on at least one of one surface of the connection member and an other surface opposite to the one surface.
2. The wearable electronic device of claim 1 , further comprising an internal hole disposed in the heat dissipation member and the vent region of the connection member,
wherein the vent channel of the vent bracket connects the vent hole and the internal hole.
3. The wearable electronic device of claim 1 , wherein the vent bracket further includes a connection hole connecting the vent channel and an internal space of the wearable electronic device.
4. The wearable electronic device of claim 1 , wherein the vent bracket is adhered and fixed to the heat dissipation member by an adhesive member comprising an adhesive material and having high thermal conductivity.
5. The wearable electronic device of claim 1 , further comprising a waterproof member comprising a waterproof material disposed between the vent hole and the vent bracket configured to block foreign matter and moisture introduced through the vent hole.
6. The wearable electronic device of claim 1 , wherein the vent bracket comprises a material having high thermal conductivity and has corrugations arranged on at least one of an inner surface and an outer surface of the vent bracket configured to increase the surface area of the vent bracket.
7. The wearable electronic device of claim 1 , wherein the connection member includes a flexible printed circuit board.
8. The wearable electronic device of claim 1 , further comprising:
a temple in which the printed circuit board is disposed; and
a hinge device including a hinge rotatably connecting the temple and the housing,
wherein the connection member is configured to extend from the temple to the housing.
9. The wearable electronic device of claim 1 , further comprising an optical unit including a visor supported by the housing and configured to transfer the light generated by the display module to the eye.
10. The wearable electronic device of claim 9 , wherein the vent hole is disposed to face in a direction substantially perpendicular to a direction in which the optical unit faces.
11. The wearable electronic device of claim 1 , wherein the housing is configured to be inclined in one direction, and
wherein the vent bracket is configured to be inclined to correspond to the direction in which the housing is inclined.
12. The wearable electronic device of claim 1 , wherein the heat dissipation member is configured to cover at least a part of the printed circuit board.
13. The wearable electronic device of claim 1 , further comprising a shield can disposed on the printed circuit board to cover the processor disposed on the printed circuit board,
wherein the heat dissipation member is configured to cover the shield can.
14. An electronic device comprising:
a housing;
a printed circuit board on which a processor is disposed;
an electronic component disposed to be spaced apart from the printed circuit board;
a vent hole formed in the housing;
a connection member comprising a conductor and including a vent region facing the vent hole and electrically connecting the printed circuit board and the electronic component;
a heat dissipation member comprising a thermally conductive material and disposed at the connection member and at least a part of which covers at least a part of the vent region; and
a vent bracket including a vent channel connected to the vent hole and is disposed between the heat dissipation member and the vent hole,
wherein the heat dissipation member is disposed on at least one of one surface of the connection member and an other surface opposite to the one surface.
15. The electronic device of claim 14 , further comprising an internal hole disposed in the heat dissipation member and the vent region of the connection member,
wherein the vent channel of the vent bracket connects the vent hole and the internal hole.
16. The electronic device of claim 14 , wherein the vent bracket further includes a connection hole configured to connect the vent channel and the internal space of the electronic device.
17. The electronic device of claim 14 , wherein the vent bracket is adhered and fixed to the heat dissipation member by an adhesive member comprising an adhesive and having high thermal conductivity.
18. The electronic device of claim 14 , further comprising a waterproof member comprising a waterproof material disposed between the vent hole and the vent bracket configured to block foreign matter and moisture introduced through the vent hole.