Electromagnetic wave shielding film and shielded printed wiring board
An electromagnetic wave shielding film includes an electroconductive adhesive layer having high peel strength and high connection reliability and suppresses cracks in an insulating layer on the electroconductive adhesive layer. The electromagnetic wave shielding film includes an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition and an insulating layer on the electroconductive adhesive layer. The electroconductive particles include high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles, and the high melting point electroconductive particles include high melting point flaky particles and high melting point spherical particles, and the content of the high melting point flaky particles is 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and the low melting point electroconductive particles.
1. An electromagnetic wave shielding film comprising:
an electroconductive adhesive layer comprising electroconductive particles and an adhesive resin composition; and
an insulating layer layered on the electroconductive adhesive layer,
the electroconductive particles comprising high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles,
the high melting point electroconductive particles comprising high melting point flaky particles and high melting point spherical particles,
a content of the high melting point flaky particles being 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and
the low melting point electroconductive particles.
2. The electromagnetic wave shielding film according to claim 1 , further comprising a metal layer between the insulating layer and the electroconductive adhesive layer.
3. The electromagnetic wave shielding film according to claim 1 , wherein a weight ratio of the high melting point spherical particles to the low melting point electroconductive particles, [high melting point spherical particles]/[low melting point electroconductive particles], is 0.5 to 29.
4. The electromagnetic wave shielding film according to claim 1 , wherein the electroconductive adhesive layer further comprises flux, and a content of the flux in the electroconductive adhesive layer is less than 4% by weight.
5. The electromagnetic wave shielding film according to claim 1 , wherein the low melting point electroconductive particles have a melting point of 120° C. to 190° C.
6. The electromagnetic wave shielding film according to claim 1 , wherein the high melting point electroconductive particles have a melting point of 300° C. to 1500° C.
7. A shielded printed wiring board, comprising:
a printed wiring board including a base film, a printed circuit arranged on the base film, and a coverlay arranged so as to cover the printed circuit; and
an electromagnetic wave shielding film including:
an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition; and
an insulating layer layered on the electroconductive adhesive layer,
the electromagnetic wave shielding film being arranged on the printed wiring board such that the electroconductive adhesive layer is in contact with the coverlay,
the electroconductive particles including high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles,
the high melting point electroconductive particles including high melting point flaky particles and high melting point spherical particles,
a content of the high melting point flaky particles being 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and
the low melting point electroconductive particles.
8. The shielded printed wiring board according to claim 7 , wherein the electromagnetic wave shielding film comprises a metal layer between the insulating layer and the electroconductive adhesive layer.
9. The shielded printed wiring board according to claim 7 ,
wherein the printed circuit comprises a ground circuit,
the coverlay has an opening formed therein for exposing the ground circuit, and
the electroconductive adhesive layer fills the opening and is contact with the ground circuit.