Semiconductor memory device, method for fabricating the same and electronic system including the same
A semiconductor memory device includes a cell substrate, a mold structure including a plurality of gate electrodes stacked on the cell substrate, the gate electrodes including a first ground selection line, a second ground selection line and a plurality of word lines, which are sequentially stacked, a channel structure that extends in a vertical direction that crosses an upper surface of the cell substrate and penetrates the mold structure, a partial isolation region that extends in a first direction that is parallel with the upper surface of the cell substrate and partially separates the mold structure, and a ground isolation structure that connects two partial isolation regions adjacent to each other in the first direction, extends in the vertical direction and penetrates the first ground selection line and the second ground selection line, wherein a width of the ground isolation structure increases with distance from the cell substrate.
1. A semiconductor memory device comprising:
a cell substrate;
a mold structure comprising a plurality of gate electrodes stacked on the cell substrate, the gate electrodes comprising a first ground selection line, a second ground selection line, and a plurality of word lines, which are sequentially stacked;
a channel structure that extends in a vertical direction, and penetrates the mold structure, the vertical direction crossing an upper surface of the cell substrate;
a partial isolation region that extends in a first direction that is parallel with the upper surface of the cell substrate and partially separates the mold structure; and
a ground isolation structure that connects two partial isolation regions adjacent to each other in the first direction, extends in the vertical direction, and penetrates the first ground selection line and the second ground selection line,
wherein a width of the ground isolation structure increases with distance from the cell substrate.
2. The semiconductor memory device of claim 1 , wherein the partial isolation region and the ground isolation structure are alternately arranged along the first direction.
3. The semiconductor memory device of claim 1 , wherein the ground isolation structure does not pass through the plurality of word lines.
4. The semiconductor memory device of claim 1 ,
wherein the ground isolation structure comprises a first insulating pattern that penetrates the first ground selection line and a second insulating pattern that penetrates the second ground selection line, and
wherein a width in the first direction of the second insulating pattern is greater than a width in the first direction of the first insulating pattern.
5. The semiconductor memory device of claim 1 , wherein the ground isolation structure comprises a stepwise side.
6. The semiconductor memory device of claim 1 ,
wherein a side of the first ground selection line adjacent the ground isolation structure is at a first acute angle with a lower surface of the first ground selection line, and
wherein a side of the second ground selection line adjacent the ground isolation structure is at a second acute angle with a lower surface of the second ground selection line.
7. The semiconductor memory device of claim 6 , wherein each of the first acute angle and the second acute angle is 85° or less.
8. The semiconductor memory device of claim 1 , wherein the ground isolation structure comprises silicon oxide.
9. The semiconductor memory device of claim 1 , further comprising:
a bit line that extends in a second direction, which is parallel with the upper surface of the cell substrate and intersects the first direction, and is connected to the channel structure.
10. A semiconductor memory device comprising:
a cell substrate;
a mold structure comprising mold insulating layers and gate electrodes, which are alternately stacked on the cell substrate, the gate electrodes comprising a first ground selection line, a second ground selection line, a plurality of word lines, and a string selection line, which are sequentially stacked;
a channel structure that intersects the respective gate electrodes and penetrates the mold structure;
a partial isolation region that extends in a first direction that is parallel with an upper surface of the cell substrate and partially separate the mold structure; and
a bit line that extends in a second direction, which is parallel with the upper surface of the cell substrate and intersects the first direction, and electrically connects to the channel structure,
wherein the mold structure comprises a first cell block and a second cell block, which are separated from each other by the partial isolation region, and a bridge region that connects the first cell block with the second cell block,
wherein the first ground selection line comprises a first cutting opening formed as the bridge region of the first ground selection line was removed,
wherein the second ground selection line comprises a second cutting opening formed as the bridge region of the second ground selection line was removed, and
wherein a size of the second cutting opening is greater than a size of the first cutting opening.
11. The semiconductor memory device of claim 10 , wherein the second cutting opening encompasses the first cutting opening in a plan view.
12. The semiconductor memory device of claim 10 , wherein each of the word lines is electrically connected along the first cell block, the bridge region and the second cell block.
13. The semiconductor memory device of claim 10 , further comprising a ground isolation structure in the first cutting opening and the second cutting opening.
14. The semiconductor memory device of claim 10 , wherein the partial isolation region and the bridge region are alternately arranged along the first direction.
15. The semiconductor memory device of claim 10 ,
wherein a side of the first ground selection line adjacent the first cutting opening forms a first acute angle with a lower surface of the first ground selection line, and
wherein a side of the second ground selection line adjacent the second cutting opening forms a second acute angle with a lower surface of the second ground selection line.
16. The semiconductor memory device of claim 15 , wherein each of the first acute angle and the second acute angle is 85° or less.
17. The semiconductor memory device of claim 10 , further comprising:
a peripheral circuit board;
a peripheral circuit element on the peripheral circuit board;
an interconnection insulating layer on the peripheral circuit element; and
a wiring structure in the interconnection insulating layer,
wherein the cell substrate is stacked on the interconnection insulating layer.
18. An electronic system comprising:
a main board;
a semiconductor memory device on the main board; and
a controller electrically connected with the semiconductor memory device on the main board,
wherein the semiconductor memory device includes:
a cell substrate;
a mold structure comprising a plurality of gate electrodes stacked on the cell substrate and respectively connected with the controller;
a channel structure that extends in a vertical direction and penetrates the mold structure, the vertical direction crossing an upper surface of the cell substrate;
a partial isolation region that extends in a first direction and partially separate the mold structure; and
a bit line that extends in a second direction that intersects the first direction, and connects the channel structure with the controller,
wherein the mold structure comprises a first cell block and a second cell block, which are separated from each other by the partial isolation region, and a bridge region that connects the first cell block with the second cell block,
wherein the gate electrodes comprise a first ground selection line, a second ground selection line, and a plurality of word lines, which are sequentially stacked,
wherein the first ground selection line comprises a first cutting opening formed as the bridge region of the first ground selection line was removed, and
wherein the second ground selection line comprises a second cutting opening formed as the bridge region of the second ground selection line was removed, and
wherein a size of the second cutting opening is greater than a size of the first cutting opening.
19. The electronic system of claim 18 , wherein the controller is configured to separately control the first ground selection line of the first cell block and the first ground selection line of the second cell block, and separately control the second ground selection line of the first cell block and the second ground selection line of the second cell block.
20. The electronic system of claim 18 , wherein the semiconductor memory device further comprises a ground isolation structure in the first cutting opening and the second cutting opening.