Granted Patent B2

US 12,386,253 · App. 17/762,157 · Granted Aug 12, 2025

Inventors: Sven Olle Krabbenborg (Münster, DE); Tim Buscher (Münster, DE); Joerg Duennewald (Münster, DE)

Assignee: BASF COATINGS GMBH

G03F7/0002B05D5/00C09D183/06

Abstract

Claims (52)

1. A method for transferring an embossed structure to at least a part of a surface of a coating composition (C2a) using a composite (S1C1), said method comprising at least the steps (1), (2-i) and (3-i) or (2-ii) and (3-ii), and also at least step (4) and optionally step (5-i) or (5-ii)

(1) providing a composite (S1C1) composed of a substrate (S1) and an at least partially embossed and at least partially cured coating (C1);

and

(2-i) applying at least one coating composition (C2a) to at least a part of a surface of a substrate (S2) to provide composite (S2C2a);

(3-i) at least partially embossing the coating composition (C2a) of the composite (S2C2a) using composite (S1C1) to provide composite (S1C1C2aS2);

or

(2-ii) applying at least one coating composition (C2a) to at least a part of an at least partially embossed and at least partially cured surface of composite (S1C1) and at least partially embossing the coating composition (C2a) using composite (S1C1) to provide composite (S1C1C2a);

(3-ii) optionally applying a substrate (S2) to at least a part of the surface, formed by coating composition (C2a), of the composite (S1C1C2a) to give a composite (S1C1C2aS2);

and

(4) at least partially curing the at least partially embossed coating composition (C2a) optionally applied to a substrate (S2) which throughout the duration of the at least partial curing is in contact with the composite (S1C1) to provide a composite (S1C1C2) or (S1C1C2S2);

and

(5-i) optionally removing composite (C2S2) within the composite (S1C1C2S2) from the composite (S1C1) to restore the composite (S1C1) provided in step (1);

or

(5-ii) optionally removing coating (C2) within the composite (S1C1C2) from the composite (S1C1) to restore the composite (S1C1) provided in step (1);

wherein a coating composition (C1a) used for producing the at least partially embossed and at least partially cured coating (C1) of the composite (S1C1) used in step (1) and restored in step (5-i) or step (5-ii) is a radiation-curable coating composition, comprising

(a) 5 to 45 weight % of at least one crosslinkable polymer and/or oligomer,

(b) 40 to 95 weight % of at least one reactive diluent,

(c) 0.01 to 15 weight % of at least one photoinitiator, and

(d) 0 to 5 weight % of at least one additive;

where (i) the stated total amounts of the components (a), (b), (c), and (d) are each based on the total weight of the coating composition (Cla), and (ii) the total amounts of all components present in the coating composition (Cla) add up to 100 weight %;

wherein the at least one crosslinkable polymer and/or oligomer (a) comprises a total amount of at least 25 weight % based on the total weight of all crosslinkable polymer and/or oligomer comprised in the coating composition (Cla), of at least one silicone (meth)acrylate oligomer.

2. The method according to claim 1 , wherein the radiation-curable coating composition (C1a) comprises 50 to 95 weight %, or 50 to 85 weight %, or 50 to 83 weight %, of at least one reactive diluent, based on the total weight of the coating composition (C1a).

3. The method according to claim 1 , wherein the embossed structure to be transferred is a microstructure and/or nanostructure.

4. The method according to claim 1 , wherein at least one adhesive is applied to the other surface of the substrate (S2) not to be coated with coating composition (C2a).

5. The method according to claim 1 , wherein removing composite (C2S2) from the composite (S1C1) comprises the following steps:

5-i-a) applying at least one adhesive layer (AL) on the surface of the substrate (S2) not being in contact with the at least partially embossed coating (C2) providing a composite (S1C1C2S2AL);

5-i-b) optionally, at least partially attaching the composite (S1C1C2S2AL) to an object (O1);

5-i-c) removing composite (S1C1) from the composite (C2S2AL) optionally at least partially attached to an object (O1), or vice versa;

or

5-ii-a) applying at least one adhesive layer (AL) on at least a part of the unstructured surface of the at least partially embossed coating (C2) providing a composite (S1C1C2AL);

5-ii-b) optionally, at least partially attaching the composite (S1C1C2AL) to an object (O1);

5-ii-c) removing composite (S1C1) from the composite (C2S2AL) optionally at least partially attached to an object (O1), or vice versa.

6. The method according to claim 1 , wherein the composite (S1C1) provided in step (1) is used as embossing mold (e2) of an embossing tool (E2) to transfer the embossed structure of the coating (C1) as embossed structure to the coating composition (C2a) in step (3-i), and in steps (2-ii) and (3-ii),

wherein the mirror image of the structured surface of the coating (C1) of composite (S1C1) used as embossing mold (e2) is embossed into the surface of the at least partially embossed and at least partially cured coating (C2) optionally applied on a substrate (S2).

7. The method according to claim 1 , wherein the substrate (S1) is a film web.

8. The method according to claim 1 , wherein the composite (S1C1) that is used in step (3-i) and steps (2-ii) and (3-ii) is reusable and can be used repeatedly for transferring at least one embossed structure when step (5-i) or (5-ii) of the method is carried out.

9. The method according to claim 1 , wherein the composite (S1C1) provided in step (1) is obtained by

(6) applying the radiation-curable coating composition (C1a) to at least a part of the surface of a substrate (S1) to provide a composite (S1C1a);

(7) at least partially embossing the coating composition (C1a) applied at least partly to the surface of the substrate (S1) by means of at least one embossing tool (E1) comprising at least one embossing mold (e1);

(8) at least partially curing the at least partially embossed coating composition (C1a) applied at least partially to a substrate (S1) which throughout the duration of the at least partial curing is in contact with the at least one embossing mold (e1) of the embossing tool (E1); and

(9) removing the composite (S1C1) from the embossing mold (e1) of the embossing tool (E1) to provide the at least partially embossed and at least partially cured composite (S1C1), or vice versa.

10. The method according to claim 1 , wherein the coating composition (C1a) comprises a total amount of at least 50 weight % based on the total weight of all crosslinkable polymer and/or oligomer comprised in the coating composition (C1a), of at least one silicone (meth)acrylate oligomer.

11. The method according to claim 1 , wherein the coating composition (C1a) comprises as reactive diluent free-radically polymerizable monomers.

12. The method according to claim 1 , wherein the coating composition (C1a) comprises at least one reactive diluent selected from the group consisting of hexane diol diacrylate and compounds comprising at least two structural units which may be different from each other or at least partially identical, of the general formula (I)

wherein

the radicals R1, independently of each other, are C2-C8 alkylene groups,

the radicals R2, independently of each other, are H or methyl, and

the parameters m, independently of each other, are an integral number in a range from 1 to 15, but with the proviso that in at least one of the structural units of the formula (I) the parameter m is at least 2.

13. The method according to claim 1 , wherein the coating composition (C1a) comprises a total amount of 50 to 85 weight % based on the total weight of the coating composition (C1a), of the at least one reactive diluent.

14. The method according to claim 1 wherein the photoinitiator comprised in the coating composition (C1a) is selected from the group consisting of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, ethyl (2,4,6-trimethylbenzoyl)phenylphosphinate, phenylbis (2,4,6-trimethylbenzoyl)-phosphine oxide, benzophenone, 1-benzoylcyclohexan-1-ol, 2-hydroxy-2,2-dimethylacetophenone and 2,2-dimethoxy-2-phenylacetophenone and mixtures thereof.

15. The method according to claim 1 , wherein the embossed structure to be transferred is a microstructure and/or nanostructure having a structure width in a range from 10 nm to 500 μm.

16. The method according to claim 1 , wherein the embossed structure to be transferred is a microstructure and/or nanostructure having a structure height in a range from 10 nm to 500 μm.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (30)