IP Library Granted Patent US 12,389,094
Granted Patent B2
US 12,389,094 · App. 17/952,030 · Granted Aug 12, 2025

Sensor temperature reducer for a sensor shift camera architecture

Inventors: Nitin Kumar Chennupati (Mountain View, CA); Nicholas D. Smyth (San Jose, CA); Julien C. Vittu (Saratoga, CA)
Assignee: Apple Inc.
H04N23/52G03B17/55H05K7/20409
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Quick Facts
Patent No.
US 12,389,094
App. No.
17/952,030
Granted
Aug 12, 2025
Kind
B2
Abstract

A camera comprising: a camera enclosure; an optomechanical assembly fixedly coupled to the camera enclosure; an image sensor assembly movably coupled to the camera enclosure, the image sensor assembly comprising: a substrate, an image sensor coupled to the substrate, a flexible printed circuit board coupled to the substrate, a conductive stiffener plate coupled to the flexible printed circuit board, and a passive heat exchanger thermally coupled to the image sensor to dissipate heat away from the image sensor.

Claims (17)

1. A camera comprising:

a camera enclosure;

an optomechanical assembly fixedly coupled to the camera enclosure;

an image sensor assembly movably coupled to the camera enclosure, the image sensor assembly comprising:

a substrate,

an image sensor coupled to the substrate,

a flexible printed circuit board coupled to the substrate,

a conductive stiffener plate coupled to the flexible printed circuit board, and

a passive heat exchanger comprising a thermally conductive gel contacting the image sensor and the conductive stiffener plate to form a conductive pathway that dissipates heat away from the image sensor.

2. The camera of claim 1 wherein the passive heat exchanger contacts a bottom side of the image sensor and a top side of the conductive stiffener plate.

3. A camera image sensor assembly comprising:

a substrate movably coupled to a camera enclosure;

an image sensor coupled to the substrate and having a bottom side suspended over an interior side of the camera enclosure;

a flexible printed circuit board coupled to the substrate;

a stiffener plate coupled to the flexible printed circuit board; and

a passive heat exchanger comprising a thermally conductive gel contacting the image sensor and the stiffener plate to dissipate heat away from the image sensor.

4. The camera image sensor assembly of claim 3 wherein the stiffener plate comprises a conductive portion that at least partially overlaps the bottom side of the image sensor and the thermally conductive gel is positioned between the conductive portion of the stiffener plate and the bottom side of the image sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2022
From: CHENNUPATI, NITIN KUMAR; SMYTH, NICHOLAS D.; VITTU, JULIEN C.
To: APPLE INC.
Reel/Frame 061199/0360 →
Continuity (1)
Related Publication 20240107138A1 · Mar 28, 2024
References Cited (12)
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