IP Library Granted Patent US 12,392,673
Granted Patent B2
US 12,392,673 · App. 17/618,258 · Granted Aug 19, 2025

Composite structure for a pressure sensor and pressure sensor

Inventors: Chee Keong Tee (Singapore, SG); Haicheng Yao (Singapore, SG); Pengju Li (Singapore, SG); Wen Cheng (Singapore, SG)
Assignee: NATIONAL UNIVERSITY OF SINGAPORE
G01L1/205G01L1/146G01L1/18G01L5/228
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Quick Facts
Patent No.
US 12,392,673
App. No.
17/618,258
Granted
Aug 19, 2025
Kind
B2
Abstract

A composite structure for a pressure sensor, a pressure sensor, a method of pressure sensing using the pressure sensor, and a method of fabricating a composite structure for a pressure sensor. The method of fabricating a composite structure for a pressure sensor comprises the steps of forming an array of microstructures made from an elastomeric material; and forming a flexible conductive coating on the array of microstructures such that a surface morphology of microstructures is substantially maintained for the coated array of the microstructures; wherein the conductive coating exhibits a Young's modulus that is higher than that of the elastomeric material.

Claims (30)

1. A composite structure for a pressure sensor, the composite structure comprising:

an array of microstructures made from an elastomeric material; and

a flexible conductive coating formed on the array of microstructures such that a surface morphology of the array of microstructures is substantially the same as for the coated array of the microstructures;

wherein the flexible conductive coating exhibits a Young's modulus that is higher than that of the elastomeric material;

wherein the flexible conductive coating comprises a low dimensional electronically active material formed on an intermediate uniform layer between the array of microstructures and the low dimensional electronically active material; and

the composite structure further comprising electrodes disposed on the coated array of microstructures and configured for measuring a change in contact resistance between the low dimensional electronically active material and the electrodes as a result of pressure on the composite structure.

2. The composite structure of claim 1 , wherein the Young's modulus of the conductive coating is about one order of magnitude higher than that of the elastomeric material, or more.

3. The composite structure of claim 1 , wherein the flexible conductive coating comprises an electronically active material exhibiting electron tunneling properties.

4. The composite structure of claim 3 , wherein the electronically active material comprises a uniform layer or nanoflakes.

5. The composite structure of claim 1 , further comprising a substrate for the array of microstructures.

6. A pressure sensor comprising the composite structure of claim 1 .

7. The pressure sensor of claim 6 , exhibiting a reduced hysteresis based on elastic properties of the composite structure compared to viscoelastic properties of the elastomeric material of the array of microstructures.

8. The pressure sensor of claim 6 , exhibiting a substantially frequency independent output as a function of applied pressure.

9. The pressure sensor of claim 6 , exhibiting a substantially temperature independent output as a function of applied pressure.

10. The pressure sensor of claim 6 , exhibiting a substantially humidity independent output as a function of applied pressure.

11. The pressure sensor of claim 6 , wherein the electrodes are disposed on an opposite side of the flexible conductive coating compared to the array of microstructures.

12. The pressure sensor of claim 11 , wherein the flexible conductive coating comprises an electronically active material exhibiting electron tunneling properties.

13. The pressure sensor of claim 11 , wherein the electrodes comprise two interdigital electrodes.

14. A method of pressure sensing using the pressure sensor of claim 6 .

15. A method of fabricating a composite structure for a pressure sensor, the method comprising the steps of:

forming an array of microstructures made from an elastomeric material; and

forming a flexible conductive coating on the array of microstructures such that a surface morphology of microstructures is substantially the same as the coated array of the microstructures;

wherein the flexible conductive coating exhibits a Young's modulus that is higher than that of the elastomeric material; and

wherein forming the flexible conductive coating comprises forming an intermediate uniform layer on the array of microstructures and providing a low dimensional electronically active material on the intermediate uniform layer;

the method further comprising disposing electrodes on the coated array of microstructures and configured for measuring a change in contact resistance between the low dimensional electronically active material and the electrodes as a result of pressure on the composite structure.

16. The method of claim 15 , wherein forming the flexible coating comprises drop casting the low dimensional electronically active material onto the intermediate uniform layer.

17. The method of claim 16 , comprising blading the intermediate uniform layer onto the array of microstructures prior to drop casting the low dimensional electronically active material.

18. The method of claim 15 , wherein the flexible conductive coating comprises an electronically active material exhibiting electron tunneling properties.

19. The method of claim 18 , wherein the electronically active material comprises a uniform layer or nanoflakes.

20. The method of claim 15 , further comprising disposing electrodes on an opposite side of the flexible conductive coating compared to the array of microstructures.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2021
From: TEE, CHEE KEONG; YAO, HAICHENG; LI, PENGJU; CHENG, WEN
To: NATIONAL UNIVERSITY OF SINGAPORE
Reel/Frame 058449/0980 →
Priority Claims (1)
SG 10201905267P · Jun 10, 2019 · national
Continuity (1)
Related Publication 20220299385A1 · Sep 22, 2022
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