Granted Patent B2

US 12,392,744 · App. 17/457,752 · Granted Aug 19, 2025

Inventors: Julia Isabel Perez Barraza (Unterhaching, DE); Matthias Eberl (Taufkirchen, DE); Francesco Solazzi (Villach, AT)

Assignee: Infineon Technologies AG

G01N27/122G01N27/129G01N33/005H01L2924/0002

Abstract

Claims (82)

1. A sensor for measuring a gas property, the sensor comprising:

a semiconductor die that defines a reference cavity and a measuring cavity,

wherein the reference cavity is sealed from an ambient gas,

wherein the measuring cavity is fluidly connected to the ambient gas, and

wherein the semiconductor die includes:

a plurality of reference sensor elements arranged in the reference cavity; and

a plurality of measuring sensor elements arranged in the measuring cavity,

wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are conductive regions formed within the semiconductor die,

wherein the plurality of reference sensor elements include a first reference sensor element and one or more second reference sensor elements, and

wherein the plurality of measuring sensor elements include a first measuring sensor element and one or more second measuring sensor elements;

a first catalytic layer arranged on the first reference sensor element and configured to react with gas molecules of a gas to induce a modification of one or more electrical properties of the first reference sensor element; and

a second catalytic layer arranged on the first measuring sensor element and configured to react with the gas molecules of the gas to induce a modification of one or more electrical properties of the first measuring sensor element,

wherein the first reference sensor element and the first measuring sensor element are configured to measure a gas concentration of the gas based on catalytic combustion of the first catalytic layer and the second catalytic layer, respectively,

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are configured to measure the gas concentration of the gas based on a thermal conductivity of the one or more second reference sensor elements and the one or more second measuring sensor elements being modified by an interaction with the gas molecules of the gas,

wherein the first reference sensor element and the first measuring sensor element are electrically connected to form a half bridge circuit, the half bridge circuit configured to provide a first readout signal representative of the gas concentration of the gas, and

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are electrically connected to form a bridge circuit, the bridge circuit configured to provide a second readout signal representative of the gas concentration of the gas.

2. The sensor of claim 1 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are formed as one piece with the semiconductor die.

3. The sensor of claim 1 , wherein the reference cavity is filled with a reference gas.

4. The sensor of claim 1 , wherein the first reference sensor element and the first measuring sensor element have a same geometric structure.

5. The sensor of claim 1 , wherein the semiconductor die comprises an integrated circuit, and

wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are part of the integrated circuit.

6. The sensor of claim 1 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are formed as corresponding membranes.

7. The sensor of claim 1 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are formed as corresponding wires.

8. The sensor of claim 1 , wherein the first catalytic layer and the second catalytic layer are made of a noble metal.

9. The sensor of claim 1 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are conductive regions formed from conductive material deposited within the semiconductor die.

10. The sensor of claim 1 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are conductive regions formed from semiconductor material within the semiconductor die.

11. The sensor of claim 10 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are formed as one piece with the semiconductor die, and

wherein the plurality of reference sensor elements and the plurality of measuring sensor elements have a first doping type opposite to a second doping type of a body of the semiconductor die.

12. The sensor of claim 1 , wherein the plurality of reference sensor elements are formed in a first membrane of the semiconductor die, and

wherein the plurality of measuring sensor elements are formed in a second membrane of the semiconductor die.

13. The sensor of claim 1 , wherein the one or more second reference sensor elements include at least two second reference sensor elements,

wherein the one or more second measuring sensor elements include at least two second measuring sensor elements, and

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are electrically connected to form a full bridge circuit.

14. The sensor of claim 13 , wherein a first one of the one or more second reference sensor elements and a first one of the one or more second measuring sensor elements are electrically connected to form a first half bridge circuit of the full bridge circuit, and

wherein a second one of the one or more second reference sensor elements and a second one of the one or more second measuring sensor elements are electrically connected to form a second half bridge circuit of the full bridge circuit.

15. The sensor of claim 1 , further comprising:

a first covering wafer bonded to a first surface of the semiconductor die; and

a second covering wafer bonded to a second surface of the semiconductor die opposite to the first surface of the semiconductor die,

wherein the first covering wafer and the second covering wafer enclose the reference cavity, and

wherein the first covering wafer and the second covering wafer partially enclose the measuring cavity.

16. The sensor of claim 15 , wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are arranged at the first surface, and

wherein the second covering wafer includes a conduit for providing the ambient gas to the measuring cavity.

17. The sensor of claim 1 , wherein the first reference sensor element is encapsulated such that the first reference sensor element is not directly exposed to the reference cavity, the first reference sensor element being at least partially encapsulated by the first catalytic layer,

wherein the first measuring sensor element is encapsulated such that the first measuring sensor element is not directly exposed to the measuring cavity, the first measuring sensor element being at least partially encapsulated by the second catalytic layer,

wherein the one or more second reference sensor elements are directly exposed to the reference cavity, and

wherein the one or more second measuring sensor elements are directly exposed to the measuring cavity for direct exposure to the ambient gas.

18. A sensor for measuring a gas property, the sensor comprising:

a semiconductor die that defines a reference cavity and a measuring cavity,

wherein the reference cavity is sealed from an ambient gas,

wherein the measuring cavity is fluidly connected to the ambient gas,

wherein the semiconductor die includes:

a plurality of reference sensor elements arranged in the reference cavity; and

a plurality of measuring sensor elements arranged in the measuring cavity,

wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are conductive regions formed from semiconductor material within the semiconductor die,

wherein the plurality of reference sensor elements include a first reference sensor element and one or more second reference sensor elements,

wherein the plurality of measuring sensor elements include a first measuring sensor element and one or more second measuring sensor elements,

wherein the first reference sensor element and the first measuring sensor element are configured to utilize catalytic combustion to sense gas molecules of the gas,

wherein the first reference sensor element and the first measuring sensor element have one or more electrical properties that are modified based on the catalytic combustion caused by an interaction with the gas molecules of the gas,

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are configured to utilize thermal conductivity to sense the gas molecules of the gas,

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements have a thermal conductivity property that is modified based on an interaction with the gas molecules of the gas,

wherein the first reference sensor element and the first measuring sensor element are electrically connected to form a half bridge circuit, the half bridge circuit configured to provide a first readout signal representative of a gas concentration of the gas, and

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are electrically connected to form a bridge circuit, the bridge circuit configured to provide a second readout signal representative of the gas concentration of the gas.

19. The sensor of claim 18 , wherein the sensor is configured to determine the gas concentration of the gas based on the first readout signal and the second readout signal.

20. The sensor of claim 18 , wherein the one or more second reference sensor elements include at least two second reference sensor elements,

wherein the one or more second measuring sensor elements include at least two second measuring sensor elements, and

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are electrically connected to form a full bridge circuit.

21. The sensor of claim 20 , wherein a first one of the one or more second reference sensor elements and a first one of the one or more second measuring sensor elements are electrically connected to form a first half bridge circuit of the full bridge circuit, and

wherein a second one of the one or more second reference sensor elements and a second one of the one or more second measuring sensor elements are electrically connected to form a second half bridge circuit of the full bridge circuit.

22. A sensor for measuring a gas property, the sensor comprising:

a semiconductor die that defines a reference cavity and a measuring cavity,

wherein the reference cavity is sealed from an ambient gas,

wherein the measuring cavity is fluidly connected to the ambient gas,

wherein the semiconductor die includes:

a plurality of reference sensor elements arranged in the reference cavity; and

a plurality of measuring sensor elements arranged in the measuring cavity,

wherein the plurality of reference sensor elements and the plurality of measuring sensor elements are conductive regions formed from semiconductor material within the semiconductor die,

wherein the plurality of reference sensor elements include a first reference sensor element and one or more second reference sensor elements,

wherein the plurality of measuring sensor elements include a first measuring sensor element and one or more second measuring sensor elements,

wherein the first reference sensor element and the first measuring sensor element are configured to utilize catalytic combustion to sense gas molecules of the gas,

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are configured to utilize thermal conductivity to sense the gas molecules of the gas,

wherein the first reference sensor element and the first measuring sensor element are electrically connected to form a half bridge circuit, the half bridge circuit configured to provide a first readout signal representative of a gas concentration of the gas, and

wherein the one or more second reference sensor elements and the one or more second measuring sensor elements are electrically connected to form a bridge circuit, the bridge circuit configured to provide a second readout signal representative of the gas concentration of the gas.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (22)