High voltage conductor and methods of fabrication
A method of fabricating an HVRM conductor is disclosed. The method may include wrapping a conductor bundle with a resin-rich mica tape to form a wrapped bundle and placing the wrapped bundle in a sleeve comprising a liquid-impermeable material to form a covered bundle. The method may also include at least partially submerging the covered bundle in a vat of liquid, and thereafter placing the conductor bundle in a press.
1. A method of fabricating an HVRM conductor, comprising:
wrapping a conductor bundle with a resin-rich mica tape to form a wrapped bundle;
placing the wrapped bundle in a sleeve comprising a liquid-impermeable material to form a covered bundle;
at least partially submerging the covered bundle in a vat of liquid; and
thereafter placing the conductor bundle in a press.
2. The method of claim 1 , wherein the resin-rich mica tape is a high-reactivity resin tape.
3. The method of claim 1 , further including heating the liquid to about 60-100° C.
4. The method of claim 3 , wherein the liquid is primarily water.
5. The method of claim 3 , further including sealing any open ends of the sleeve.
6. The method of claim 5 , further including evacuating the sleeve prior to at least partially submerging the covered bundle.
7. The method of claim 5 , wherein at least partially submerging includes fully submerging the covered bundle in the vat of liquid.
8. The method of claim 5 , further including pressurizing the vat of liquid after the covered bundle has been at least partially submerged in the vat of liquid.
9. The method of claim 8 , wherein:
the press is heated and dynamic; and
the method further includes shaping the conductor bundle and curing a resin in the resin-rich mica tape within the heated and dynamic press.
10. The method of claim 8 , wherein pressurizing the vat of liquid includes pressurizing the vat of liquid inside of an autoclave.
11. The method of claim 8 , wherein placing the conductor bundle in the press includes placing the conductor bundle in the press after removing the covered bundle from the vat of liquid and the autoclave and after removing the sleeve from the covered bundle.
12. The method of claim 1 , further including pressurizing the vat of liquid after the covered bundle has been at least partially submerged in the vat of liquid.
13. The method of claim 12 , wherein:
the press is heated and dynamic; and
the method further includes shaping the conductor bundle and curing a resin in the resin-rich mica tape within the heated and dynamic press.
14. The method of claim 1 , further including:
causing the press to press on the conductor bundle and thereby shape the conductor bundle; and
causing the press to heat the conductor bundle and thereby cure a resin in the resin-rich mica tape within the heated and dynamic press.
15. A method of fabricating an HVRM conductor, comprising:
spiral wrapping a conductor bundle with a resin-rich mica tape to form a wrapped bundle;
placing the wrapped bundle within a sleeve comprising a liquid-impermeable material to form a covered bundle;
sealing any open end of the sleeve;
evacuating the sleeve;
thereafter fully submerging the covered bundle in a vat of primarily water heated to about 60-100° C.; and
thereafter placing the conductor bundle in a dynamic press heated to about 130-180° C. to shape the conductor bundle and cure a resin in the resin-rich mica tape.
16. The method of claim 15 , further including pressurizing the vat of water after the covered bundle has been fully submerged in the vat of water.
17. The method of claim 16 , wherein pressurizing the vat of water includes placing the vat of liquid inside of an autoclave.
18. The method of claim 16 , wherein placing the conductor bundle in the press includes placing the conductor bundle in the press after removing the covered bundle from the vat of water and the autoclave and after removing the sleeve from the covered bundle.
19. An HVRM conductor fabricated via the method of claim 1 .
20. A method of fabricating an HVRM conductor, comprising:
spiral wrapping a conductor bundle with a resin-rich mica tape to form a wrapped bundle;
placing the wrapped bundle within a sleeve comprising a liquid-impermeable material to form a covered bundle;
sealing any open end of the sleeve;
evacuating the sleeve;
thereafter fully submerging the covered bundle in a vat of primarily water heated to about 60-100° C.;
pressurizing the vat of water in an autoclave after the covered bundle has been fully submerged; and
thereafter placing the conductor bundle in a dynamic press heated to about 130-180° C. to shape the conductor bundle and cure a resin in the resin-rich mica tape.