IP Library › Granted Patent US 12,396,098
Granted Patent B2
US 12,396,098 · App. 18/107,916 · Granted Aug 19, 2025

Optical communication module

Inventors: Hyun Sik Lee (Gwangju, KR); Hee Dae Kim (Gwangju, KR)
Assignee: OPTICIS CO., LTD.
H05K1/117H05K1/118H05K2201/051H05K2201/09236
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,396,098
App. No.
18/107,916
Granted
Aug 19, 2025
Kind
B2
Abstract

An optical communication module is provided, including an input/output connector on one end through which a multi-signal including a video signal is input/output, an optical sub assembly (OSA) package on another end for converting the multi-signal into an optical signal, and a first connection end folded in a curved form so that a connection surface as one surface on which a first contact point is formed forms an outer circumference and a non-connection surface as another surface on which the first contact point is not formed forms an inner circumference to form upper and lower double-sided contacts with the input/output connector. The optical communication module may simplify a contact point structure with an input/output connector and reduce its manufacturing costs, by improving the contact point structure with an input/output connector, and may provide a high-speed transmission line having a relatively-low dielectric loss with respect to a video signal requiring high-speed transmission in synchronization with a high-speed clock signal and also have an improved structure favorable to mounting of an integrated circuit for signal processing with respect to an auxiliary signal or a peripheral circuit device connected to the integrated circuit.

Claims (18)

1. An optical communication module comprising:

an input/output connector on one end through which a multi-signal including a video signal is input/output;

an optical sub assembly (OSA) package on another end for converting the multi-signal into an optical signal; and

a first connection end folded in a curved form so that a connection surface as one surface on which a first contact point is formed forms an outer circumference and a non-connection surface as another surface on which the first contact point is not formed forms an inner circumference to form upper and lower double-sided contacts with the input/output connector,

wherein, among multi-signal lines, a second group of signal lines comprises a detour transmission path between a location deviating from a flexible circuit board and a location re-entering the flexible circuit board between the first contact point and a second contact point.

2. The optical communication module of claim 1 , wherein, along the outer circumference of the connection surface, a group of upper first contact points and a group of lower first contact points are respectively formed on upper and lower sides that are opposite to each other, and a separation gap forming a curved portion is interposed between the group of upper first contact points and the group of lower first contact points.

3. The optical communication module of claim 2 , wherein the group of lower first contact points comprises different lower first contact contacts each formed on connection surfaces separated from each other along the outer circumference of the connection surface.

4. The optical communication module of claim 1 , further comprising a second connection end forming a contact point with the OSA package and bent so that the connection surface on which the second contact point is formed stands to face the OSA package.

5. The optical communication module of claim 4 , wherein

the first and second connection ends are formed as one end and another end of a flexible circuit board, and

the multi-signal lines each extend between the first and second contact points by using the first contact point of the first connection end and the second contact point of the second connection end as the one end and the other end, respectively.

6. The optical communication module of claim 4 , wherein the flexible circuit board continuously extends between the first and second connection ends.

7. The optical communication module of claim 1 , wherein, among the multi-signal lines, a first group of signal lines is completely formed on the flexible circuit board so as not to deviate from the flexible circuit board between the first contact point and the second contact point with the OSA package.

8. The optical communication module of claim 7 , wherein the first group of signal lines transmit video signals.

9. The optical communication module of claim 1 , wherein the second group of signal lines transmits an auxiliary signal including information about at least one of a source device and a sink device through which the optical communication module provides a communication channel.

10. The optical communication module of claim 1 , wherein the detour transmission path is provided as a rigid circuit board.

11. The optical communication module of claim 1 , wherein the second group of signal lines comprises a transmission path of the flexible circuit board from the first contact point to deviating location, a detour transmission path of a rigid circuit board from the deviating location to re-entering location, and a transmission path of the flexible circuit board from the re-entering location to the second contact point.

12. The optical communication module of claim 1 , wherein an integrated circuit chip is connected on the detour transmission path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2023
From: LEE, HYUN SIK; KIM, HEE DAE
To: OPTICIS CO., LTD.
Reel/Frame 062646/0423 →
Priority Claims (1)
KR 10-2022-0018329 · Feb 11, 2022 · national
Continuity (1)
Related Publication 20230262894A1 · Aug 17, 2023
References Cited (26)
US 7264405B2 · Ikeuchi · 2007 [cited by applicant]
US 7751660B2 · Ueno et al. · 2010 [cited by applicant]
US 7948760B2 · Kawauchi et al. · 2011 [cited by applicant]
US 10129983B2 · Uchida et al. · 2018 [cited by applicant]
US 20030235012A1 · Nishizawa · 2003 [cited by applicant]
US 20050245103A1 · Ellison · 2005 [cited by applicant]
US 20070058976A1 · Tatum · 2007 [cited by examiner]
US 20140029900A1 · Logan, Jr. et al. · 2014 [cited by applicant]
US 20220006222A1 · Moll et al. · 2022 [cited by applicant]
US 20240126029A1 · Blanc · 2024 [cited by examiner]
JP 03004465 · 1991 [cited by applicant]
JP H0636385B2 · 1994 [cited by applicant]
JP H06208873A · 1994 [cited by applicant]
JP 2004039543A · 2004 [cited by applicant]
JP 2005123055 · 2005 [cited by applicant]
JP 2005217284 · 2005 [cited by applicant]
JP 2006086433A · 2006 [cited by applicant]
JP 2014021462 · 2014 [cited by applicant]
JP 2018133478 · 2018 [cited by applicant]
KR 20020033922 · 2002 [cited by applicant]
KR 20080059018 · 2008 [cited by applicant]
Korean Office Action for App. No. 2022-0018329, mailed Dec. 20, 2023 (13 pages). [cited by applicant]
Extended European Search Report for App. No. 23156078.0, mailed Jun. 21, 2023 (9 pages). [cited by applicant]
Japanese Office Action for App. No. 2023-018171, mailed Jan. 23, 2024 (8 pages). [cited by applicant]
Japanese Office Action for App. No. 2023-018171, mailed May 31, 2024 (9 pages) [English Translated]. [cited by applicant]
European Office Action for European App No. 23 156 078.0, mailed Jun. 6, 2025, (10 pages). [cited by applicant]