Flexible electronic structures
A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.
1. A flexible electronic structure, comprising:
a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer; and
a component, comprising:
a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side;
a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact; and
a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact,
wherein the component is disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer, and
wherein the flexible substrate is a power-generating substrate.
2. The flexible electronic structure of claim 1 , wherein the electrically conductive top substrate layer and the electrically conductive bottom substrate layer are or comprise triboelectric layers.
3. The flexible electronic structure of claim 2 , wherein the electrically conductive top substrate layer comprises an electrically conductive top substrate conductive layer and a top substrate power-generating layer.
4. The flexible electronic structure of claim 3 , wherein the top substrate conductive layer is on a side of the top substrate power-generating layer opposite the component.
5. The flexible electronic structure of claim 3 , wherein the top substrate power-generating layer is on a side of the top substrate conductive layer opposite the component.
6. The flexible electronic structure of claim 2 , wherein the electrically conductive bottom substrate layer comprises an electrically conductive bottom substrate conductive layer and a bottom substrate power-generating layer.
7. The flexible electronic structure of claim 6 , wherein the bottom substrate conductive layer is on a side of the bottom substrate power-generating layer opposite the component.
8. The flexible electronic structure of claim 6 , wherein the bottom substrate power-generating layer is on a side of the bottom substrate conductive layer opposite the component.
9. The flexible electronic structure of claim 1 , wherein the flexible substrate comprises a spacer between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.
10. The flexible electronic structure of claim 9 , wherein the spacer comprises holes where no spacer material is present.
11. The flexible electronic structure of claim 1 , wherein the electrically conductive top substrate layer and the electrically conductive bottom substrate layer are a triboelectric power-generating pair.
12. The flexible electronic structure of claim 1 , wherein the component is relatively rigid compared to the flexible substrate.
13. The flexible electronic structure of claim 1 , wherein the component substrate comprises a crystalline semiconductor substrate.
14. The flexible electronic structure of claim 1 , wherein the component has a thickness no greater than one hundred microns.
15. The flexible electronic structure of claim 1 , wherein an area of the component top electrode has an area that is no less than 50% of an area of the component substrate top side.
16. The flexible electronic structure of claim 1 , wherein an area of the component bottom electrode has an area that is no less than 50% of an area of the component substrate bottom side.
17. The flexible electronic structure of claim 1 , wherein the component is an electronic or optoelectronic component.
18. The flexible electronic structure of claim 17 , wherein the component comprises a light-emitting diode.
19. The flexible electronic structure of claim 18 , wherein (i) the electrically conductive top substrate layer is transparent or comprises transparent openings through which the light-emitting diode can emit light, (ii) the electrically conductive bottom substrate layer is transparent or comprises openings through which the light-emitting diode can emit light, or (iii) both (i) and (ii).