Multiple back side/buried power rail (BPR) cell including field-effect transistors with air void between two adjacent BPR cells
A semiconductor device includes a semiconductor substrate. The semiconductor device includes a first fin protruding from the semiconductor substrate and extending along a first direction. The semiconductor device includes a second fin protruding from the semiconductor substrate and extending along the first direction. A first epitaxial source/drain region coupled to the first fin and a second epitaxial source/drain region coupled to the second fin are laterally spaced apart from each other by an air void.
1. A semiconductor device, comprising:
a first cell formed on a substrate, and comprising at least one first active region extending along a first direction and a plurality of first gate structures extending along a second direction; and
a second cell formed on the substrate, and comprising at least one second active region extending along the first direction and a plurality of second gate structures extending along the second direction; and
an air void interposed between the first cell and the second cell along the second direction, and further interposed between each of the plurality of first gate structures and a corresponding one of the plurality of second gate structures,
wherein a ratio of a width of the air void along the second direction to a height of the air void along a third direction perpendicular to the first and second directions ranges from about ⅓ to about 1/15.
2. The semiconductor device of claim 1 , wherein the air void partially extends into the substrate.
3. The semiconductor device of claim 1 , wherein the at least one first active region further comprises a plurality of first epitaxial source/drain regions, and the at least one second active region comprises a plurality of second epitaxial source/drain regions.
4. The semiconductor device of claim 3 , wherein the air void is interposed between each of the plurality of first epitaxial source/drain regions and a corresponding one of the plurality of second epitaxial source/drain regions.
5. The semiconductor device of claim 1 , wherein the first and second cells are disposed on a first side of the semiconductor substrate.
6. The semiconductor device of claim 5 , further comprising at least one conductive power rail disposed on a second side of the semiconductor substrate, the second side being opposite to the first side.
7. The semiconductor device of claim 1 , wherein a height of the air void is between about 30 nanometers (nm) and about 150 nm.
8. The semiconductor device of claim 1 , wherein the first cell further comprises a first dummy region disposed opposite the at least one first active region from the air void along the second direction, and the second cell further comprises a second dummy region disposed opposite the at least one second active region from the air void along the second direction.
9. The semiconductor device of claim 8 , wherein the plurality of first gate structures traverse the first dummy region, and the plurality of second gate structures traverse the second dummy region.
10. A semiconductor device, comprising:
a first cell formed on a substrate, and comprising at least one first active region extending along a first direction and a plurality of first gate structures extending along a second direction; and
a second cell formed on the substrate, and comprising at least one second active region extending along the first direction and a plurality of second gate structures extending along the second direction; and
an air void interposed between the first cell and the second cell along the second direction, and further interposed between each of the plurality of first gate structures and a corresponding one of the plurality of second gate structures;
wherein the air void partially extends into the substrate and wherein a height of the air void is between about 30 nanometers (nm) and about 150 nm.
11. The semiconductor device of claim 10 , wherein the at least one first active region further comprises a plurality of first epitaxial source/drain regions, and the at least one second active region comprises a plurality of second epitaxial source/drain regions.
12. The semiconductor device of claim 11 , wherein the air void is interposed between each of the plurality of first epitaxial source/drain regions and a corresponding one of the plurality of second epitaxial source/drain regions.
13. The semiconductor device of claim 10 , wherein a ratio of a width of the air void along the second direction to a height of the air void along a third direction perpendicular to the first and second directions ranges from about ⅓ to about 1/15.
14. The semiconductor device of claim 10 , wherein the first and second cells are disposed on a first side of the semiconductor substrate.
15. The semiconductor device of claim 14 , further comprising at least one conductive power rail disposed on a second side of the semiconductor substrate, the second side being opposite to the first side.
16. A semiconductor device, comprising:
a first cell formed on a first side of a substrate, and comprising:
a first active region extending along a first direction;
a plurality of first gate structures extending along a second direction; and
a first dummy region disposed next to the first active region along the second direction;
a second cell formed on the first side of the substrate, and comprising:
a second active region extending along the first direction;
a plurality of second gate structures extending along the second direction; and
a second dummy region disposed next to the second active region along the second direction; and
an air void interposed between the first active region and the second active region along the second direction, and further interposed between each of the plurality of first gate structures and a corresponding one of the plurality of second gate structures.
17. The semiconductor device of claim 16 , wherein the air void partially extends into the substrate.
18. The semiconductor device of claim 16 , further comprising at least one conductive power rail disposed on a second side of the semiconductor substrate, the second side being opposite to the first side.
19. The semiconductor device of claim 16 , wherein a ratio of a width of the air void along the second direction to a height of the air void along a third direction perpendicular to the first and second directions ranges from about ⅓ to about 1/15.
20. The semiconductor device of claim 16 , wherein a height of the air void is between about 30 nanometers (nm) and about 150 nm.