Condition selectable backside gas
Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.
1. A method of semiconductor processing, the method comprising:
performing a process on a semiconductor substrate, the semiconductor substrate seated on a substrate support positioned within a processing region of a semiconductor processing chamber;
subsequent to performing the process on the semiconductor substrate, wherein the process is performed while maintaining the substrate support at a temperature below or about −50° C.:
i) separating the semiconductor substrate from the substrate support and supporting the semiconductor substrate on lift pins extending through the substrate support;
ii) subsequent to separating the semiconductor substrate from the substrate support, flowing a first backside gas up a stem of the substrate support and through the substrate support into the processing region;
iii) subsequent to separating the semiconductor substrate from the substrate support, raising a temperature of the semiconductor substrate;
iv) subsequent to raising the temperature of the semiconductor substrate, removing the semiconductor substrate from the processing region of the semiconductor processing chamber;
v) performing a plasma cleaning operation within the processing region of the semiconductor processing chamber, wherein the plasma cleaning operation generates plasma byproducts; and
vi) flowing a second backside gas up the stem of the substrate support and through the substrate support into the processing region, wherein at least a portion of the second backside gas flows into the processing region through accesses in the substrate support, and wherein the second backside gas is a non-reactive species.
2. The method of semiconductor processing of claim 1 , wherein the plasma cleaning operation comprises an oxygen-containing precursor or a halogen-containing precursor.
3. The method of semiconductor processing of claim 1 , wherein the first backside gas is a non-reactive species.
4. The method of semiconductor processing of claim 1 , wherein the first backside gas comprises helium, and wherein the second backside gas is nitrogen or a noble gas.
5. The method of semiconductor processing of claim 1 , wherein the first backside gas comprises helium and at least one of argon or nitrogen.
6. The method of semiconductor processing of claim 1 , wherein the first backside gas is characterized by a first flow rate less than or about 10 sccm.
7. The method of semiconductor processing of claim 1 , wherein a flow rate of the second backside gas provides contact of plasma byproducts during the plasma cleaning operation with the substrate support about the accesses of the substrate support.
8. The method of semiconductor processing of claim 2 , wherein a flow rate of the second backside gas limits ingress of plasma byproducts into the accesses in the substrate support.
9. A method of semiconductor processing, the method comprising:
flowing a first backside gas at a first flow rate up a stem of a substrate support and through the substrate support in a processing region of a semiconductor processing chamber while performing a process on a semiconductor substrate seated on the substrate support, wherein the process is performed while maintaining the substrate support at a temperature below or about −100° C.;
removing the semiconductor substrate from the semiconductor processing chamber;
performing a plasma cleaning operation within the processing region of the semiconductor processing chamber; and
flowing a second backside gas up the stem of a substrate support and through the substrate support at a second flow rate greater than the first flow rate while performing the plasma cleaning operation, wherein at least a portion of the second backside gas flows into the processing region through accesses in the substrate support.
10. The method of semiconductor processing of claim 9 , wherein the plasma cleaning operation comprises an oxygen-containing precursor or a halogen-containing precursor.
11. The method of semiconductor processing of claim 9 , wherein the first backside gas and the second backside gas are non-reactive species.
12. The method of semiconductor processing of claim 11 , wherein the first backside gas comprises helium, and wherein the second backside gas comprises non-reactive species including at least one of nitrogen or a noble gas.
13. The method of semiconductor processing of claim 12 , wherein the first backside gas comprises helium and at least one of argon or nitrogen.
14. The method of semiconductor processing of claim 12 , wherein the first flow rate is less than or about 10 sccm.
15. A method of semiconductor processing, the method comprising:
performing a process on a semiconductor substrate, the semiconductor substrate seated on a substrate support within a processing region of a semiconductor processing chamber, wherein the process is performed while maintaining the substrate support at a temperature below or about −50° C.;
raising the semiconductor substrate from the substrate support;
forming a plasma of a post-treatment precursor within the processing region of the semiconductor processing chamber;
flowing a non-reactive backside gas through the substrate support and between the semiconductor substrate and the substrate support; and
increasing a temperature of the semiconductor substrate.
16. The method of semiconductor processing of claim 15 , wherein raising the semiconductor substrate comprises separating the semiconductor substrate from the substrate support and supporting the semiconductor substrate on lift pins extending through the substrate support.
17. The method of semiconductor processing of claim 15 , wherein the process is performed while maintaining the substrate support at a temperature below or about −100° C.
18. The method of semiconductor processing of claim 15 , wherein the non-reactive backside gas comprises nitrogen or a noble gas.
19. The method of semiconductor processing of claim 15 , wherein the non-reactive backside gas is flowed at a flow rate to limit ingress of particles between the semiconductor substrate and the substrate support.