IP Library › Granted Patent US 12,400,932
Granted Patent B2
US 12,400,932 · App. 18/027,456 · Granted Aug 26, 2025

Power conversion device with refrigerant

Inventors: Kyota Asai (Tokyo, JP); Takeshi Tokuyama (Tokyo, JP)
Assignee: HITACHI, LTD.
H01L23/473H01L23/49531H01L23/49575H01L24/32H01L24/48H01L25/0657H05K7/20927H01L2224/32225H01L2224/48237H01L2924/1205H01L2924/13055H01L2924/1811H01L2924/30107
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Quick Facts
Patent No.
US 12,400,932
App. No.
18/027,456
Granted
Aug 26, 2025
Kind
B2
Abstract

This power conversion device comprises: first and second power circuit units each having a power semiconductor element and a plurality of conductors that hold the power semiconductor element therebetween and that are connected to an emitter and a collector of the power semiconductor element; and a flow channel forming body which houses the first and second power circuit units and through which a refrigerant flows. A conductor at the emitter side of the first power circuit unit is disposed so as to face a conductor at the collector side of the second power circuit unit. The conductor at the emitter side of the first power circuit unit and the conductor at the collector side of the second power circuit unit are connected to each other via a plurality of conductive fins which are in contact with the refrigerant.

Claims (17)

1. A power conversion device comprising:

first and second power circuit units each including a power semiconductor element and a plurality of conductors that hold the power semiconductor element therebetween and that are connected to an emitter and a collector of the power semiconductor element; and

a flow channel forming body which houses the first and second power circuit units and through which a refrigerant flows, wherein

the conductor at an emitter side of the first power circuit unit is disposed so as to face the conductor at a collector side of the second power circuit unit, and

the conductor at the emitter side of the first power circuit unit and the conductor at the collector side of the second power circuit unit are connected to each other via a plurality of conductive fins which are in contact with the refrigerant.

2. The power conversion device according to claim 1 , wherein

the power semiconductor element includes an IGBT and a diode, the IGBT of the first power circuit unit is disposed to face the diode of the second power circuit unit, and the diode of the first power circuit unit is disposed to face the IGBT of the second power circuit unit.

3. The power conversion device according to claim 1 , wherein

the flow channel forming body includes an upper-surface flow channel forming body that forms a flow channel on an upper surface of the first power circuit unit, a lower-surface flow channel forming body that forms a flow channel on a lower surface of the second power circuit unit, and an intermediate flow channel forming body that forms a flow channel between the first and second power circuit units.

4. The power conversion device according to claim 1 , wherein

the first and second power circuit units are mounted respectively on a first board and a second board each including a conductor layer electrically connected to the conductor.

5. The power conversion device according to claim 4 , wherein

the first board and the second board are configured in a same shape.

6. The power conversion device according to claim 5 , wherein

the conductor layers of the first board and the second board are disposed to face each other, and are connected respectively to a positive electrode terminal and a negative electrode terminal of a capacitor disposed outside the flow channel forming body.

7. The power conversion device according to claim 3 , wherein

flow channels in the upper-surface flow channel forming body and the lower-surface flow channel forming body are electrically connected to each other via a flow channel in the intermediate flow channel forming body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2023
From: ASAI, KYOTA; TOKUYAMA, TAKESHI
To: HITACHI, LTD.
Reel/Frame 063045/0155 →
Priority Claims (1)
JP 2020-189578 · Nov 13, 2020 · national
Continuity (1)
Related Publication 20230378025A1 · Nov 23, 2023
References Cited (5)
US 20120228757A1 · Kitami · 2012 [cited by examiner]
US 20250079275A1 · Scholz · 2025 [cited by examiner]
JP 2007235060A · 2007 [cited by examiner]
WO 2011064841A1 · 2011 [cited by applicant]
International Search Report of PCT/JP2021/039709 dated Dec. 28, 2021. [cited by applicant]
Cited By (1)
US 12,684,734