IP Library › Granted Patent US 12,404,850
Granted Patent B2
US 12,404,850 · App. 17/097,826 · Granted Sep 2, 2025

Method for producing a micropump with mechanically biased diaphragm actuator

Inventors: Siegfried Röhl (Munich, DE); Yuecel Congar (Munich, DE); Martin Wackerle (Munich, DE); Martin Richter (Munich, DE); Christoph Kutter (Munich, DE)
Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
F04B43/046B01L3/502707B01L3/50273B23P15/00B29C65/4835B01L2200/12Y10T29/49236
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Quick Facts
Patent No.
US 12,404,850
App. No.
17/097,826
Granted
Sep 2, 2025
Kind
B2
Abstract

A method for producing a micropump includes, among others, a step of providing a substrate, wherein the substrate includes at least one pump diaphragm for the micropump. Additionally, a diaphragm actuator for moving the pump diaphragm is provided, wherein the diaphragm actuator is arranged in an holding device. The holding device is aligned relative to the substrate such that the diaphragm actuator is arranged opposite to the pump diaphragm and the pump diaphragm is deflected in the direction of the diaphragm actuator by means of a fluid pressure that is higher than the ambient pressure. Additionally, the diaphragm actuator is mounted on the pump diaphragm.

Claims (23)

1. A method for producing a micropump, the method comprising:

providing a substrate comprising at least one pump diaphragm for the micropump,

providing a piezo diaphragm actuator for actuating the pump diaphragm by deflecting the pump diaphragm,

temporarily arranging, during the production of the micropump, the piezo diaphragm actuator in a holding device,

aligning the holding device relative to the substrate such that the piezo diaphragm actuator is arranged opposite to the pump diaphragm,

temporarily applying, during the production of the micropump, a fluid pressure that is higher than an ambient pressure so as to move the pump diaphragm towards the piezo diaphragm actuator, such that the pump diaphragm comes into contact with the piezo diaphragm actuator, until both the pump diaphragm and the piezo diaphragm actuator exhibit a dome-shaped deformation facing a same direction, and

adhering the deformed piezo diaphragm actuator to the deformed pump diaphragm.

2. The method according to claim 1 , wherein the dome-shaped deformation of the piezo diaphragm actuator causes the piezo diaphragm actuator to be mechanically biased.

3. The method according to claim 1 , wherein the step of arranging the piezo diaphragm actuator into the holding device comprises:

inserting the piezo diaphragm actuator in the holding device and applying a mechanical force on the piezo diaphragm actuator such that the piezo diaphragm actuator inserted in the holding device is deformed in a direction away from the pump diaphragm, thereby causing the piezo diaphragm actuator to be mechanically biased.

4. The method according to claim 1 , wherein the step of arranging the piezo diaphragm actuator in the holding device comprises:

generating a negative pressure between the holding device and the piezo diaphragm actuator, whereby the piezo diaphragm actuator is sucked into the holding device and is deformed in a direction away from the pump diaphragm.

5. The method according to claim 1 , wherein the pump diaphragm is deflected so far in a direction of the piezo diaphragm actuator that the pump diaphragm clings to the piezo diaphragm actuator that is inserted in the holding device and is deformed as well as mechanically biased.

6. The method according to claim 1 , wherein the pump diaphragm is deflected in a direction of the piezo diaphragm actuator such that the pump diaphragm touches the piezo diaphragm actuator inserted in the holding device, and such that the pump diaphragm and the piezo diaphragm actuator are deflected together, causing the piezo diaphragm actuator to be deformed and mechanically biased.

7. The method according to claim 1 , wherein the step of providing the substrate comprises:

arranging the substrate on a substrate holder,

providing a fluid-tight connection between the substrate and the substrate holder and providing a fluidic connection between the substrate holder and the pump diaphragm, and

generating the fluid pressure within the fluidic connection such that a pressurized fluid flows through the fluidic connection to the pump diaphragm, thus causing the pump diaphragm to be deflected in a direction of the piezo diaphragm actuator.

8. The method according to claim 1 , wherein the fluid pressure comprises an overpressure with respect to the ambient pressure of 0.5 bar to 5 bar.

9. The method according to claim 1 , wherein the step of mounting the piezo diaphragm actuator on the pump diaphragm comprises:

arranging a joining agent on a side of the pump diaphragm facing the piezo diaphragm actuator or on a side of the piezo diaphragm actuator facing the pump diaphragm.

10. The method according to claim 9 , wherein the joining agent is a thermosetting joining agent and wherein the step of mounting the piezo diaphragm actuator on the pump diaphragm comprises:

heating the piezo diaphragm actuator or the pump diaphragm below a Curie temperature of the piezo diaphragm actuator to thermally activate the joining agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2021
From: RÖHL, SIEGFRIED; CONGAR, YUECEL; WACKERLE, MARTIN; RICHTER, MARTIN; KUTTER, CHRISTOPH
To: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Reel/Frame 054796/0681 →
Priority Claims (1)
DE 10 2018 207 858.0 · May 18, 2018 · national
Continuity (2)
Continuation PCTEP2019062199 · May 13, 2019
Related Publication 20210060553A1 · Mar 4, 2021
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