Image sensor
An image sensor includes a substrate having a plurality of pixel sections. The substrate has first and second surfaces that are opposite to each other. A photoelectric conversion region is in each of the pixel sections. A first isolation pattern is disposed in the substrate and is positioned between the pixel sections. A gate electrode is on the photoelectric conversion region. A lower portion of the gate electrode is inserted into the substrate. An upper portion of the gate electrode protrudes beyond the first surface of the substrate. A floating diffusion region is on the photoelectric conversion region. The floating diffusion region is positioned on one side of the gate electrode. The floating diffusion region includes a doping pad and a first impurity region. The first impurity region surrounds a lower portion of the doping pad. The doping pad is horizontally spaced apart from the first isolation pattern.
1. An image sensor, comprising:
a substrate including a plurality of pixel sections, the substrate having a first surface and a second surface that are opposite to each other;
a photoelectric conversion region in each of the pixel sections;
a first isolation trench disposed in the substrate and positioned between the pixel sections, the first isolation trench comprises a dielectric pattern that is in contact with the first surface of the substrate, a separation pattern disposed on a sidewall of the first isolation trench, and a pattern on the separation pattern;
a gate electrode comprising a lower portion inserted into the substrate and an upper portion protruding beyond the first surface of the substrate;
a floating diffusion region on the photoelectric conversion region positioned on one side of the gate electrode; and
a contact plug connected to the floating diffusion region,
wherein the floating diffusion region includes a doping pad on the first surface and a first impurity region on the doping pad, the first impurity region surrounds a lower portion of the doping pad,
wherein the contact plug is connected to an upper portion of the doping pad, the upper portion of the doping pad is opposing the lower portion of the doping pad, and
wherein the contact plug, the doping pad, and the first impurity region are vertically arranged.
2. The image sensor of claim 1 , wherein a height of the doping pad from the first surface of the substrate to the lower portion of the doping pad in a first direction perpendicular to the first surface of the substrate is smaller than a height of the first impurity region from the first surface of the substrate to a lower portion of the first impurity region in the first direction.
3. The image sensor of claim 2 , wherein the upper portion of the doping pad is at a level that is higher than a level of the first surface of the substrate.
4. The image sensor of claim 2 , wherein the separation pattern comprises metal oxide.
5. The image sensor of claim 2 , wherein the height of the first impurity region from the first surface of the substrate to a lower portion of the first impurity region in the first direction is smaller than a height of the dielectric pattern from the first surface of the substrate to a lower portion of the dielectric pattern in the first direction.
6. The image sensor of claim 5 , wherein the dielectric pattern comprises silicon oxide.
7. The image sensor of claim 6 , wherein a lower portion of the dielectric pattern has an uneven shape, and
wherein the lower portion of the dielectric pattern is spaced apart from the first surface of the substrate.
8. The image sensor of claim 2 , wherein the height of the first impurity region from the first surface of the substrate to a lower portion of the first impurity region in the first direction is smaller than a height of the gate electrode from the first surface of the substrate to the lower portion of the gate electrode in the first direction.
9. The image sensor of claim 2 , wherein the doping pad includes at least one selected from doped epitaxial silicon and doped polysilicon.
10. The image sensor of claim 1 , wherein the first impurity region fully surrounds a lower portion of the doping pad.
11. The image sensor of claim 10 , further comprises:
a device isolation layer on the first surface of the substrate and disposed adjacent to the first isolation trench.
12. An image sensor, comprising:
a substrate having a first surface and a second surface that are opposite to each other;
a first isolation trench disposed in the substrate and positioned between the pixel sections, the first isolation trench comprises a dielectric pattern that is in contact with the first surface of the substrate, a separation pattern disposed on a sidewall of the first isolation trench, and a pattern on the separation pattern; a photoelectric conversion region in the pixel section;
a gate electrode comprising a lower portion inserted into the substrate and an upper portion protruding beyond the first surface of the substrate;
a floating diffusion region on the photoelectric conversion region, the floating diffusion region is positioned on one side of the gate electrode;
a contact plug connected to the floating diffusion region,
wherein the floating diffusion region includes an impurity region and a doping pad disposed on the impurity region,
wherein the contact plug, the doping pad, and the impurity region are vertically arranged,
wherein a lower portion of the dielectric pattern has an uneven shape,
wherein the first isolation trench is in contact with the first surface of the substrate and the second surface of the substrate, and
wherein the lower portion of the dielectric pattern is spaced apart from the first surface of the substrate.
13. The image sensor of claim 12 , wherein:
the substrate has a first conductivity type; and
each of the impurity region and the doping pad has a second conductivity type that is different from the first conductivity type.
14. The image sensor of claim 12 , wherein a height of the doping pad from the first surface of the substrate to the lower portion of the doping pad in a first direction perpendicular to the first surface of the substrate is smaller than a height of the impurity region from the first surface of the substrate to a lower portion of the impurity region in the first direction.
15. The image sensor of claim 12 , wherein the impurity region fully surrounds a lower portion of the doping pad.
16. The image sensor of claim 15 , wherein a width of the doping pad in a second direction parallel to the first surface of the substrate is smaller than a width of the impurity region in the second direction.
17. The image sensor of claim 15 , wherein an upper portion of the doping pad is at a level that is higher than a level of the first surface of the substrate, and
wherein the upper portion of the doping pad is opposite to the lower portion of the doping pad.
18. An image sensor, comprising:
a substrate that has a first surface and a second surface that are opposite to each other;
a first isolation trench disposed in the substrate and positioned between the pixel sections, the first isolation trench comprises a dielectric pattern that is in contact with the first surface of the substrate, a separation pattern disposed on a sidewall of the first isolation trench, and a pattern on the separation pattern; a photoelectric conversion region in the pixel section;
a gate electrode comprising a lower portion inserted into the substrate and an upper portion protruding beyond the first surface of the substrate;
a floating diffusion region on the photoelectric conversion region, the floating diffusion region is positioned on one side of the gate electrode, the floating diffusion region including an impurity region and a doping pad on the impurity region;
a contact plug on the first surface of the substrate and electrically connected to the doping pad;
a microlens on the second surface of the substrate; and
a plurality of color filters between the substrate and the microlens,
wherein the contact plug, the doping pad, and the impurity region are vertically arranged, and wherein the impurity region fully surrounds a lower portion of the doping pad.
19. The image sensor of claim 18 , wherein a width of the doping pad in a first direction parallel to the first surface of the substrate is smaller than a width of the impurity region in the first direction.
20. The image sensor of claim 19 , wherein a height of the doping pad from the first surface of the substrate to the lower portion of the doping pad in a second direction perpendicular to the first direction is smaller than a height of the impurity region from the first surface of the substrate to a lower portion of the impurity region in the second direction.