Substrate alloy influence compensation
A method for compensating for substrate variation in measurement of material quantity of a material positioned on a substrate is described. The method includes receiving a detected X-ray signal for a measurement of the material at a position on a surface of the substrate; and determining a material quantity based on the received X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate.
1. A method for compensating for substrate variation in measurement of a material positioned on a substrate, the method comprising:
receiving a detected X-ray signal for a measurement of the material at a position on a surface of the substrate; and
determining a material quantity based on the received X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate, wherein the surface of the substrate has a substantially cylindrical shape, each position on the surface of the substrate being defined by a position along a width of the substrate surface and a rotational angle of the substrate.
2. The method of claim 1 , wherein the material quantity indicates a material weight and/or basis weight.
3. The method according to claim 1 , wherein the material quantity indicates a deposition or coating weight, basis weight or thickness.
4. The method of claim 1 , wherein the detected X-ray signal comprises a sensor output, either voltage sampled or charge integrated, and time-averaged over a measurement time period.
5. The method of claim 1 , wherein the steps of receiving and determining are repeated for multiple positions on the surface of the substrate.
6. The method of claim 1 , wherein the step of determining a material quantity comprises adjusting the received X-ray measurement signal according to the set of compensation parameters and correlating the adjusted X-ray measurement signal with material quantity according to a calibration relationship.
7. The method of claim 6 , wherein the set of compensation parameters comprises a predetermined shutter open signal for the substrate and adjusting the received X-ray measurement signal comprises normalizing the received X-ray measurement signal according to the predetermined shutter open signal.
8. The method of claim 6 , wherein the set of compensation parameters comprises a predetermined temperature compensation coefficient and adjusting the received X-ray measurement signal comprises compensating the received X-ray measurement signal for temperature and applying the predetermined temperature compensation coefficient.
9. The method of claim 1 , wherein the set of compensation parameters comprises a predetermined spectral adjustment coefficient and determining a material quantity comprises applying the predetermined spectral adjustment coefficient to a material quantity determined by correlating according to the calibration relationship.
10. A computer readable medium comprising a computer program, the computer program being configured when executed by a processor to carry out the method out the method of claim 1 .
11. A method for determining compensation parameters for substrate variation in measurement of material quantity of a material positioned on a substrate, the method comprising:
obtaining at least one detected X-ray signal for each of a plurality of positions on a surface of the substrate; and
establishing a set of compensation parameters for each position on the surface of the substrate, based on the respective at least one detected X-ray signal, wherein the surface of the substrate has a substantially cylindrical shape, each position on the surface of the substrate being defined by a position along a width of the substrate surface and a rotational angle of the substrate.
12. The method of claim 11 , wherein the set of compensation parameters comprises a shutter open signal for the substrate, the at least one detected X-ray signal comprises an X-ray signal obtained for each position on the surface of the substrate when no material is positioned on the substrate at a first temperature and establishing the set of compensation parameters comprises defining the shutter open signal for each position on the surface of the substrate by the respective obtained at least one detected X-ray signal.
13. The method of claim 11 , wherein the set of compensation parameters comprises a spectral adjustment coefficient for the substrate, the at least one detected X-ray signal comprises an X-ray signal obtained for each position on the surface of the substrate when a material of a known material quantity is positioned at a predetermined position relative to an X-ray sensor and establishing the set of compensation parameters comprises establishing the spectral adjustment coefficient for each position on the surface of the substrate by identifying a material quantity for the respective position from correlating an X-ray measurement signal derived from the obtained at least one detected X-ray signal for the respective position with the material quantity according to a calibration relationship and comparing the identified material quantity with the known material quantity.
14. The method of claim 12 , wherein X-ray measurement signal obtained for each position derived from the obtained at least one detected X-ray measurement signal comprises the obtained at least one detected X-ray measurement signal for the respective position by the shutter open signal for the respective position.
15. The method of claim 11 , wherein the set of compensation parameters comprises a temperature compensation coefficient for the substrate at a first temperature, the at least one detected X-ray signal comprises an X-ray signal obtained for each position on the surface of the substrate when no material is positioned on the substrate at a second temperature and establishing the set of compensation parameters comprises calculating a temperature compensation coefficient for the substrate at the second temperature and establishing a temperature compensation coefficient for each position on the surface of the substrate by comparing an X-ray signal obtained for the respective position at the first temperature adjusted by the temperature compensation factor with the obtained X-ray signal obtained for the respective position at the second temperature.
16. A method for compensating for substrate variation in measurement of a material positioned on a substrate, the method comprising:
obtaining at least one detected X-ray signal for each of a plurality of positions on a surface of the substrate; and
establishing a set of compensation parameters for each position on the surface of the substrate, based on the respective at least one detected X-ray signal;
receiving a detected X-ray signal of the material at a position on a surface of the substrate; and
determining a material quantity based on the received X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate, wherein the surface of the substrate has a substantially cylindrical shape, each position on the surface of the substrate being defined by a position along a width of the substrate surface and a rotational angle of the substrate.
17. An X-ray analysis system for measurement of material quantity of a material positioned on a substrate, the system comprising:
an X-ray sensor, configured for detecting an X-ray signal for a measurement of the material at a position on a surface of the substrate; and
a processor for compensating for substrate variation in the measurement, the processor being configured to determine a material quantity based on the detected X-ray measurement signal and a pre-determined set of compensation parameters for the substrate, the set of compensation parameters varying according to the position on the surface of the substrate, wherein the surface of the substrate has a substantially cylindrical shape, each position on the surface of the substrate being defined by a position along a width of the substrate surface and a rotational angle of the substrate.