IP Library › Granted Patent US 12,416,867
Granted Patent B2
US 12,416,867 · App. 17/961,575 · Granted Sep 16, 2025

Overlay target and overlay method

Inventor: Hui Liu (Singapore, SG)
Assignee: United Microelectronics Corp.
G03F7/70633H01L23/544H01L2223/54426
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Quick Facts
Patent No.
US 12,416,867
App. No.
17/961,575
Granted
Sep 16, 2025
Kind
B2
Abstract

An overlay target includes a plurality of working zones, a plurality of holes in each of the working zones, and a first layer filling in the plurality of holes. The plurality of holes are not filled up by the first layer, and a plurality of spaces are reserved in the plurality of holes.

Claims (16)

1. An overlay method, used to determine an overlay error of a device structure formed in a semiconductor manufacturing process, comprising:

forming a first overlay target, comprising:

providing a plurality of working zones;

forming a plurality of holes in a first sub-zone of each of the working zones; and

forming a first layer in the holes, wherein the holes are not filled up by the first layer, and a plurality of spaces are reserved, the spaces have a plurality of first diameters and a plurality of second diameters greater than the first diameters;

taking a plurality of midpoints of the second diameters of the spaces as a plurality of calibration center points;

forming a second overlay target, comprising forming a plurality of line segments in a second sub-zone of each of the working zones; and

determining the overlay error of the device structure by using the calibration center points and a plurality of centers of the line segments.

2. The overlay method according to claim 1 , wherein the first layer is an opaque layer.

3. The overlay method according to claim 1 , wherein the opaque layer comprises a metal layer.

4. The overlay method according to claim 1 , wherein the first layer is a deposition layer formed on a second layer and filled in a plurality of openings of the second layer.

5. The overlay method according to claim 4 , further comprising that the spaces are asymmetric.

6. The overlay method according to claim 1 , wherein a maximum thickness of the first layer in the holes is less than a radius of the holes.

7. The overlay method according to claim 1 , wherein a thickness of the first layer in the holes is not uniform.

8. The overlay method according to claim 1 , wherein shapes of the spaces are different from shapes of the holes.

9. The overlay method according to claim 8 , wherein the holes are circular and the spaces are off-axis football-shaped.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2022
From: LIU, HUI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 061384/0779 →
Priority Claims (1)
TW 111135839 · Sep 22, 2022 · national
Continuity (1)
Related Publication 20240103383A1 · Mar 28, 2024
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