Raised and recessed frames on bottom and top plates of a BAW resonator
A film bulk acoustic wave resonator comprising a piezoelectric film having a central region defining a main active domain in which a main acoustic wave is generated during operation, an upper electrode disposed on a top surface of the piezoelectric film, a lower electrode disposed on a lower surface of the piezoelectric film, a dielectric material layer disposed on a lower surface of the lower electrode, and lower recessed frame regions disposed laterally on opposite sides of the central region, the lower recessed frame regions defined by regions of one of the dielectric material or of the lower electrode having a lesser thickness than the thickness of the one of the dielectric material layer or of the lower electrode in the central region.
1. A film bulk acoustic wave resonator comprising:
a piezoelectric film having a central region defining a main active domain in which a main acoustic wave is generated during operation;
an upper electrode disposed on a top surface of the piezoelectric film;
a lower electrode disposed on a lower surface of the piezoelectric film;
a dielectric material layer disposed on a lower surface of the lower electrode;
a carrier substrate disposed below a lower surface of the dielectric material layer;
lower recessed frame regions disposed laterally on opposite sides of the central region, the dielectric material layer disposed on the lower surface of the lower electrode throughout the central region, the lower recessed frame regions, and throughout areas extending between the central region and the lower recessed frame regions, the lower recessed frame regions defined by regions of the dielectric material layer having a lesser thickness than a thickness of the dielectric material layer in the central region; and
lower raised frame regions disposed laterally on opposite sides of the lower recessed frame regions from the central region, the lower raised frame regions defined by regions of the lower electrode having a greater thickness than a thickness of the lower electrode in the central region, the dielectric material layer extending throughout the lower raised frame regions and having a thickness in the lower raised frame regions less than the thickness of the dielectric material layer in the central region.
2. The film bulk acoustic wave resonator of claim 1 included in a radio frequency filter.
3. The film bulk acoustic wave resonator of claim 2 included in an electronic device module.
4. The film bulk acoustic wave resonator of claim 3 included in an electronic device.
5. The film bulk acoustic wave resonator of claim 1 wherein widths of the lower raised frame regions are linearly apodized across a width of the film bulk acoustic wave resonator in a plane defined by the top surface of the piezoelectric film.
6. The film bulk acoustic wave resonator of claim 5 wherein apodization of the lower raised frame regions is between first and second widths on both of a first side of the film bulk acoustic wave resonator and on a second side of the film bulk acoustic wave resonator opposite the first side.
7. The film bulk acoustic wave resonator of claim 5 wherein apodization of the lower raised frame regions is between first and second widths on a first side of the film bulk acoustic wave resonator and between third and fourth widths on a second side of the film bulk acoustic wave resonator opposite the first side, at least one of the third and fourth widths being different from each of the first and second widths.
8. The film bulk acoustic wave resonator of claim 1 wherein widths of the lower recessed frame regions are linearly apodized across a width of the film bulk acoustic wave resonator in a plane defined by the top surface of the piezoelectric film.
9. The film bulk acoustic wave resonator of claim 8 wherein apodization of the lower recessed frame regions is between first and second widths on both of a first side of the film bulk acoustic wave resonator and on a second side of the film bulk acoustic wave resonator opposite the first side.
10. The film bulk acoustic wave resonator of claim 8 wherein apodization of the lower recessed frame regions is between first and second widths on a first side of the film bulk acoustic wave resonator and between third and fourth widths on a second side of the film bulk acoustic wave resonator opposite the first side, at least one of the third and fourth widths being different from each of the first and second widths.
11. The film bulk acoustic wave resonator of claim 1 further comprising an upper dielectric material layer disposed on an upper surface of the upper electrode and upper recessed frame regions including regions of the upper dielectric material layer having a lesser thickness than a thickness of the upper dielectric material layer in the central region.
12. The film bulk acoustic wave resonator of claim 11 further comprising upper raised frame regions including regions of the upper dielectric material layer having a greater thickness than the thickness of the upper dielectric material layer in the central region.
13. The film bulk acoustic wave resonator of claim 1 wherein the thickness of the lower electrode in the lower raised frame regions is greater than the thickness of the lower electrode in the lower recessed frame regions and greater than the thickness of the lower electrode in the central region.
14. The film bulk acoustic wave resonator of claim 1 further comprising upper raised frame regions including regions of the upper electrode having a greater thickness than the thickness of the upper electrode in the central region.
15. The film bulk acoustic wave resonator of claim 1 further comprising an upper dielectric material disposed on an upper surface of the upper electrode, and upper raised frame regions including regions of the upper dielectric material having a greater thickness than a thickness of the upper dielectric material in the central region.
16. A film bulk acoustic wave resonator comprising:
a piezoelectric film having a central region defining a main active domain in which a main acoustic wave is generated during operation;
an upper electrode disposed on a top surface of the piezoelectric film;
a lower electrode disposed on a lower surface of the piezoelectric film;
a dielectric material layer disposed on a lower surface of the lower electrode;
a carrier substrate disposed below the lower surface of the dielectric material layer;
lower recessed frame regions disposed laterally on opposite sides of the central region, the dielectric material layer disposed on the lower surface of the lower electrode throughout the central region, the lower recessed frame regions, and throughout areas extending between the central region and the lower recessed frame regions; and
lower raised frame regions disposed laterally on opposite sides of the lower recessed frame regions from the central region, the lower raised frame regions defined by regions of the lower electrode having a greater thickness than a thickness of the lower electrode in the central region, the dielectric material layer extending throughout the lower raised frame regions and having a thickness in the lower raised frame regions less than the thickness of the dielectric material layer in the central region.
17. The film bulk acoustic wave resonator of claim 16 wherein the lower recessed frame regions are defined by regions of one of the dielectric material layer having a lesser thickness than the thickness of the dielectric material layer in the central region or of the lower electrode having a lesser thickness than a thickness of the lower electrode in the central region.