Tip dresser
A chip collection unit is provided under a body case. The unit includes a chip guiding member on one lateral side of a chip falling area that is downward of the lower communication hole, and a first air discharge unit on another lateral side of the chip falling area. The member includes at one end a chip collection port located corresponding to the chip falling area, and is connected at another end to a chip collector capable of collecting the chips. The first air discharge unit includes an air nozzle configured to discharge compressed air towards the chip collection port.
1. A tip dresser comprising:
a housing case including a hollow part located therein and upper and lower communication holes opposing one another, the upper and lower communication holes communicating with the hollow part;
a rotary holder located in the hollow part between the upper and lower communication holes and axially and rotatably supported in the housing case, wherein the rotary holder includes a pair of curved recesses corresponding to the respective upper and lower communication holes and a penetrating part extending through along an axis of rotation;
a cutting member attached to an inner face of the penetrating part,
wherein the tip dresser is configured so that one of a pair of opposing electrode tips for spot welding is inserted into one of the curved recesses through the upper communication hole and another of the pair of the electrode tips is inserted into another of the curved recesses through the lower communication hole in the state that the rotary holder is being rotated, and thereby the cutting member cuts respective distal ends of the electrode tips;
a chip collection unit is-provided under the housing case,
wherein the chip collection unit is configured to collect chips produced in the penetrating part during a cutting operation and falling downwardly through the lower communication hole,
wherein the chip collection unit includes a chip guiding member provided on a bottom surface of the housing case on one lateral side of a chip falling area that is located downwardly of the lower communication hole,
wherein the chip guiding member includes a chip guiding passage for guiding the chips therein, and a first air discharge unit provided on a bottom surface of the housing case on another lateral side of the chip falling area,
wherein the chip guiding member further includes at one end thereof a chip collection port located corresponding to the chip falling area and communicating with the chip guiding passage,
wherein the chip guiding member is connected at another end thereof to a chip collector capable of collecting the chips,
wherein the first air discharge unit includes an air nozzle having a plurality of air discharge holes, the air nozzle being configured to discharge compressed air towards the chip collection port,
wherein the air nozzle is a block member having a triangular shape in a front view so that a vertical dimension progressively narrows in a direction towards the chip guiding member,
wherein each of the air discharge holes is arranged in parallel in a range corresponding to the chip falling area in a horizontal direction orthogonal to a direction in which the first air discharge unit and the chip guiding member are arranged in parallel, and is formed extending towards the chip collection port, and
wherein the chip collection port and a discharge opening of the air discharge holes are each located on an open peripheral edge of the lower communication hole, and each horizontally opposed to one another across the chip falling area.
2. The tip dresser according to claim 1 , further comprising:
a second air discharge unit that is placed in close proximity above the housing case,
wherein the second air discharge unit is configured to discharge compressed air towards the rotary holder.
3. The tip dresser according to claim 2 , wherein the air discharge holes each extend downwardly at an angle from a location near a bottom surface of the housing case towards the chip collection port.
4. The tip dresser according to claim 1 , wherein the air discharge holes each extend downwardly at an angle from a location near a bottom surface of the housing case towards the chip collection port.