Capless semiconductor package with a micro-electromechanical system (mems)
A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.
1. A method, comprising:
coupling a MEMS die to a surface of a substrate utilizing a sacrificial layer on a first surface of the MEMS die facing the surface of the substrate;
forming a molding compound covering a plurality of first sidewalls of the MEMS die and a plurality of second sidewalls of the sacrificial layer;
after the MEMS die has been coupled to the surface of the substrate with the sacrificial layer and after the molding compound has been formed, forming an opening that extends through the substrate to the sacrificial layer and exposes the sacrificial layer; and
after forming the opening, removing the sacrificial layer, and the removing forming a space separating the first surface of the MEMS die from the substrate.
2. The method of claim 1 , wherein forming the opening further comprises aligning the opening with a sensor component of the MEMS die.
3. The method of claim 1 , wherein the sacrificial layer is a thermally decomposable die attach.
4. The method of claim 3 , wherein removing the thermally decomposable die attach further comprises exposing the thermally decomposable die attach to heat utilizing a reflow oven.
5. The method of claim 1 , wherein forming the opening in the substrate further comprises laser drilling the substrate.
6. The method of claim 1 , further comprising:
affixing a second die to a second surface of the MEMS die; and
forming a bonding wire coupling the second die to the substrate.
7. The method of claim 1 , further comprising:
affixing a second die to the substrate, the second die being spaced laterally with respect to the MEMS die; and
forming a bonding wire coupling the second die to the substrate.
8. A method, comprising:
coupling a first surface of a MEMS die at which a sensor component of the MEMS die is present to a second surface of a substrate with a sacrificial layer;
forming at least one first wire electrically coupling a contact pad of the MEMS die at a third surface of the MEMS die opposite to the first surface of the MEMS die;
forming a molding compound covering the MEMS die, the sacrificial layer, and the at least one first wire, and a plurality of sidewalls of the MEMS die that extend from the first surface of the MEMS die to the third surface of the MEMS die;
after forming the molding compound, forming an opening extending through the substrate from a fourth surface of the substrate opposite to the second surface of the substrate to the second surface of the substrate;
forming a space between the first surface of the MEMS die and the second surface of the substrate by removing the sacrificial layer exposing a plurality of walls of the molding compound delimiting the space.
9. The method of claim 8 , wherein forming the opening further comprises aligning the opening with the sensor component of the MEMS die.
10. The method of claim 8 , wherein the sacrificial layer is a thermally decomposable die attach.
11. The method of claim 10 , wherein removing the thermally decomposable die attach further comprises exposing the thermally decomposable die attach to heat utilizing a reflow oven.
12. The method of claim 8 , further comprising:
affixing a second die to the third surface of the MEMS die; and
forming at least one second wire coupling the second die to the substrate.
13. The method of claim 12 , wherein affixing the second die to the third surface of the MEMS die further includes affixing the second die to the third surface of the MEMS die with an adhesive.
14. The method of claim 8 , further comprising:
affixing a second die to the substrate, the second die being spaced laterally with respect to the MEMS die; and
forming at least one second wire coupling the second die to the substrate.
15. The method of claim 8 , wherein coupling the first surface of the MEMS die at which the sensor component of the MEMS die is present to the second surface of the substrate with the sacrificial layer further comprises covering the sensor component with the sacrificial layer.
16. A method, comprising:
coupling a first surface of a MEMS die at which a sensor component of the MEMS die is present to a second surface of a substrate with a sacrificial layer;
forming a molding compound covering the MEMS die and the sacrificial layer, and covering a plurality of sidewalls of the MEMS die that are transverse to the first surface of the MEMS die and extend from the first surface of the MEMS die;
after forming the molding compound, forming an opening extending through the substrate from a fourth surface of the substrate opposite to the second surface of the substrate to the second surface of the substrate;
forming a space between the first surface of the MEMS die and the second surface of the substrate by removing the sacrificial layer exposing a plurality of walls of the molding compound delimiting the space, and removing the sacrificial layer includes exposing the sacrificial layer to heat generated by a heat source.
17. The method of claim 16 , wherein forming the opening further comprises aligning the opening with the sensor component of the MEMS die.
18. The method of claim 16 , wherein the sacrificial layer is a thermally decomposable die attach.
19. The method of claim 16 , wherein coupling the first surface of the MEMS die at which the sensor component of the MEMS die is present to the second surface of the substrate with the sacrificial layer further comprises covering the sensor component with the sacrificial layer.
20. The method of claim 16 , wherein the plurality of walls of the molding compound are coplanar with the plurality of sidewalls of the MEMS die.