Chip package with integrated off-die inductor
A chip package and method for fabricating the same are provided that includes an off-die inductor. The off-die inductor is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The redistribution layer is connected to a package substrate to form the chip package.
1. A chip package comprising:
an integrated circuit (IC) die;
a package substrate having a die side and a ball side;
a redistribution layer (RDL) disposed between the IC die and the die side of the package substrate, the RDL comprising at least a first conductive layer and a second conductive layer that are patterned to form a RDL circuitry within the RDL, the RDL circuitry connecting the IC die to the package substrate; and
an inductor formed from portions of the first conductive layer and the second conductive layer of the RDL, wherein the inductor is directly below a bottom surface of the IC die.
2. The chip package of claim 1 , wherein the IC die further comprises:
a plurality of contact pads arranged in an array having a pitch in a first direction, and wherein the inductor has a width that is less than 3 times the pitch of the contact pads in the first direction.
3. The chip package of claim 1 , wherein the RDL further comprises:
a shield formed from portions of the first conductive layer and the second conductive layer of the RDL, wherein the shield circumscribes at least three sides of the inductor.
4. The chip package of claim 1 , wherein the inductor comprises:
a head region comprising coils; and
a tail region comprising leads coupled to the coils.
5. The chip package of claim 4 , wherein the head region of the inductor comprises:
vias connecting portions of the first conductive layer and the second conductive layer forming a first coil of the coils formed in the head region;
vias connecting portions of the first conductive layer and the second conductive layer forming a second coil of the coils formed in the head region;
a first jumper formed in the first conductive layer and coupling a portion of the first coil to the second coil; and
a second jumper formed in the second conductive layer and coupling another portion of the first coil to the second coil, the second jumper passing over the first jumper.
6. The chip package of claim 5 , wherein no vias directly couple the first jumper to the second jumper.
7. The chip package of claim 4 , wherein the RDL further comprises:
a ground plane disposed between the inductor and the IC die.
8. The chip package of claim 7 , wherein the ground plane is formed from a portion of a third metal layer disposed between the head region of the inductor and the IC die, wherein the ground plane is spaced from a portion of the third metal layer disposed in the tail region of the inductor and the IC die.
9. The chip package of claim 1 , wherein the RDL further comprises:
a third metal layer forming a ground plane disposed between the inductor and the IC die.
10. The chip package of claim 9 , wherein the RDL further comprises:
a ground shield formed from portions of the first conductive layer and the second conductive layer of the RDL that form the inductor, wherein the ground shield is coupled to the ground plane.
11. A chip package comprising:
an integrated circuit (IC) die;
a package substrate having a die side and a ball side;
a redistribution layer (RDL) disposed between the IC die and the die side of the package substrate; and
an inductor disposed in the RDL and sandwiched between the IC die and the package substrate, the inductor comprising a first terminal coupled to a circuitry of the IC die and a second terminal coupled to the circuitry of the IC die, wherein the inductor is directly below a bottom surface of the IC die.
12. The chip package of claim 11 , wherein the IC die further comprises:
a plurality of contact pads arranged in an array having a pitch in a first direction, and wherein the inductor has a width that is less than 3 times the pitch of the contact pads in the first direction.
13. The chip package of claim 11 , wherein the RDL further comprises:
a first conductive layer;
a second conductive layer; and
a shield formed from portions of the first conductive layer and the second conductive layer of the RDL, wherein the shield circumscribes at least three sides of the inductor.
14. The chip package of claim 13 , wherein the inductor comprises:
a head region comprising coils formed from the first and second conductive layers; and
a tail region comprising leads coupled to the coils.
15. The chip package of claim 14 , wherein the head region of the inductor comprises:
vias connecting portions of the first conductive layer and the second conductive layer forming a first coil of the coils formed in the head region;
vias connecting portions of the first conductive layer and the second conductive layer forming a second coil of the coils formed in the head region;
a first jumper formed in the first conductive layer and coupling a portion of the first coil to the second coil; and
a second jumper formed in the second conductive layer and coupling another portion of the first coil to the second coil, the second jumper passing over the first jumper.
16. The chip package of claim 15 , wherein no vias directly couple the first jumper to the second jumper.
17. The chip package of claim 13 , wherein the RDL further comprises:
a ground plane disposed between the inductor and the IC die.
18. The chip package of claim 17 , wherein the ground plane is formed from a portion of a third metal layer disposed between a head region of the inductor and the IC die, wherein the ground plane is spaced from a portion of the third metal layer disposed in a tail region of the inductor and the IC die.
19. The chip package of claim 11 , wherein the RDL further comprises:
a third metal layer forming a ground plane disposed between the inductor and the IC die.
20. A method for fabricating a chip package, the method comprising:
forming an inductor within a redistribution layer (RDL) formed on an integrated circuit (IC) die, wherein the inductor is directly below a bottom surface of the IC die; and
stacking the RDL with a package substrate to form a chip package.