Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device includes a substrate, a sensing device, and a transistor. The sensing device includes a dielectric layer, a sensing pad, a first sensing electrode, and a second sensing electrode. The dielectric layer is over the substrate. The sensing pad is over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode are over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode surround the sensing pad, and a distance between the first sensing electrode and the second sensing electrode is greater than a distance between the sensing pad and the first sensing electrode. The transistor is over the substrate. A gate of the transistor is connected to the sensing pad.
1. A semiconductor device comprising:
a substrate;
a sensing device comprising:
a dielectric layer over the substrate;
a sensing pad over and in contact with the dielectric layer; and
a first sensing electrode and a second sensing electrode over and physically in contact with the dielectric layer, wherein the first sensing electrode and the second sensing electrode surround the sensing pad, and a distance between the first sensing electrode and the second sensing electrode is greater than a distance between the sensing pad and the first sensing electrode, and the dielectric layer has a first U-shaped cross-sectional profile wrapping around the first sensing electrode, a second U-shaped cross-sectional profile wrapping around the second sensing electrode, and a linear cross-sectional profile continuously extends from the first U-shaped cross-sectional profile to the second U-shaped cross-sectional profile; and
a transistor over the substrate, wherein a gate of the transistor is connected to the sensing pad.
2. The semiconductor device of claim 1 , further comprising:
a third sensing electrode over and in contact with the dielectric layer, wherein the first, second, and third sensing electrodes surround the sensing pad.
3. The semiconductor device of claim 2 , wherein a distance between the first and third sensing electrodes is greater than a distance between the third sensing electrode and the sensing pad.
4. The semiconductor device of claim 2 , wherein the first, second, and third sensing electrodes are spaced apart from each other.
5. The semiconductor device of claim 1 , wherein the distance between the first sensing electrode and the second sensing electrode is greater than a distance between the sensing pad and the second sensing electrode.
6. The semiconductor device of claim 1 , wherein a portion of the dielectric layer having the linear cross-sectional profile extends beneath the sensing pad.
7. The semiconductor device of claim 1 , wherein a thickness of a gate dielectric layer of the transistor is greater than a thickness of the dielectric layer of the sensing device.
8. The semiconductor device of claim 1 , wherein the sensing pad has a circular top view profile, and the first and second sensing electrodes have annulus sector top view profiles.
9. A semiconductor device comprising:
a substrate having a first recess and a second recess;
a sensing device comprising:
a dielectric layer lining sidewalls and bottom surfaces of the first recess and the second recess and a top surface of the substrate;
a first sensing electrode and a second sensing electrode over the dielectric layer and respectively in the first recess and the second recess; and
a sensing pad over the substrate and the dielectric layer, wherein the sensing pad is surrounded by the first sensing electrode and the second sensing electrode; and
a transistor over the substrate and connected to the sensing pad, wherein from a cross-sectional view, a topmost position of the dielectric layer is at an elevation lower than a topmost position of a gate dielectric layer of the transistor, and a bottommost position of the dielectric layer is at an elevation higher than a bottommost position of a source/drain region of the transistor.
10. The semiconductor device of claim 9 , wherein a top surface of the first sensing electrode is lower than a bottom surface of the sensing pad.
11. The semiconductor device of claim 9 , wherein a top surface of the first sensing electrode is lower than a bottom surface of a gate electrode of the transistor.
12. The semiconductor device of claim 9 , wherein the dielectric layer is in contact with sidewalls and a bottom surface of the first sensing electrode.
13. The semiconductor device of claim 9 , wherein the dielectric layer is in contact with a bottom surface of the sensing pad and is spaced apart from sidewalls of the sensing pad.
14. The semiconductor device of claim 9 , wherein the dielectric layer has a first U-shaped cross-sectional profile wrapping around the first sensing electrode, a second U-shaped cross-sectional profile wrapping around the second sensing electrode, and a linear cross-sectional profile continuously extends from the first U-shaped cross-sectional profile to the second U-shaped cross-sectional profile.
15. A method comprising:
depositing isolation structures in a substrate to define a transistor region and a sensing region in the substrate;
forming a transistor over the transistor region of the substrate;
depositing a dielectric layer over the sensing region of the substrate;
forming a sensing pad and a first sensing electrode, a second sensing electrode, and a third sensing electrode over the dielectric layer, wherein from a top view, the first, second, and third sensing electrodes surround the sensing pad and spaced apart from each other, and a thickness of a gate dielectric layer of the transistor is greater than a thickness of the dielectric layer; and
forming an inter-metal dielectric layer over the substrate to electrically interconnect a gate of the transistor and the sensing pad.
16. The method of claim 15 , further comprising:
forming a first recess, a second recess, and a third recess in the sensing region of the substrate prior to depositing the dielectric layer, wherein portions of the dielectric layer are deposited in the first second, and third recesses, and forming the sensing pad and the first, second, and third sensing electrodes comprises depositing the first, second, and third sensing electrodes in the first, second, and third recesses, respectively, and depositing the sensing pad over a protruding portion of the substrate surrounded by the first, second, and third recesses.
17. The method of claim 15 , wherein the step of depositing the dielectric layer is performed after the step of forming the transistor.
18. The method of claim 15 , wherein the first, second, and third sensing electrodes have annulus sector top view profiles.
19. The method of claim 15 , wherein from a cross-sectional view, a topmost position of the dielectric layer is at an elevation lower than a topmost position of the gate dielectric layer relative to the substrate.
20. The method of claim 15 , wherein a bottommost position of the dielectric layer is at an elevation higher than a bottommost position of a source/drain region of the transistor.