IP Library › Granted Patent US 12,431,933
Granted Patent B2
US 12,431,933 · App. 17/934,692 · Granted Sep 30, 2025

Radio-frequency module and communication device

Inventor: Reiji Nakajima (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H04B1/40H03F3/245H03F2200/165H03F2200/171H03F2200/294H03F2200/451
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Quick Facts
Patent No.
US 12,431,933
App. No.
17/934,692
Granted
Sep 30, 2025
Kind
B2
Abstract

Loss in a low-pass filter is reduced. A radio-frequency module includes an antenna terminal, a power amplifier, a low-noise amplifier, and a low-pass filter. The low-pass filter is disposed on a transmit path between the antenna terminal and the power amplifier and on a receive path between the antenna terminal and the low-noise amplifier. The low-pass filter has multiple paths. Each of the paths forms a part of either one or both of the transmit path and the receive path. The paths include a first path and a second path. The second path has a smaller reactance than the first path.

Claims (63)

1. A radio-frequency module comprising:

an antenna terminal;

a power amplifier;

a low-noise amplifier; and

a low-pass filter that is in a transmit path between the antenna terminal and the power amplifier, and in a receive path between the antenna terminal and the low-noise amplifier,

wherein the low-pass filter has a plurality of paths therethrough, each of the plurality of paths forming a part of the transmit path and/or the receive path, and

wherein the plurality of paths comprise:

a first path, and

a second path having a smaller reactance than the first path.

2. The radio-frequency module according to claim 1 , wherein, in the low-pass filter:

a transmit signal that passes through the transmit path passes through the first path, and

a receive signal that passes through the receive path passes through the second path.

3. The radio-frequency module according to claim 1 ,

wherein the low-pass filter comprises:

an inductor, and

a capacitor, and

wherein the capacitor is a digital tunable capacitor.

4. The radio-frequency module according to claim 3 , further comprising:

a mounting substrate that has a first principal surface and a second principal surface that are opposite each other; and

an external connection terminal that is on a second principal surface side of the mounting substrate,

wherein the inductor is on a first principal surface side of the mounting substrate, and

wherein the digital tunable capacitor is on the second principal surface side of the mounting substrate.

5. The radio-frequency module according to claim 4 , further comprising:

an antenna switch configured to switch a path for connection to an antenna,

wherein the digital tunable capacitor and the antenna switch are in a switch integrated circuit (IC).

6. The radio-frequency module according to claim 5 , wherein the inductor overlaps the switch IC in plan view in a thickness direction of the mounting substrate.

7. The radio-frequency module according to claim 6 , wherein the inductor overlaps the digital tunable capacitor in plan view in the thickness direction of the mounting substrate.

8. The radio-frequency module according to claim 1 , wherein a transmit signal that passes through the transmit path and a receive signal that passes through the receive path are time division duplex (TDD) signals.

9. The radio-frequency module according to claim 1 , wherein a transmit signal that passes through the transmit path and a receive signal that passes through the receive path are frequency division duplex (FDD) signals.

10. A communication device comprising:

the radio-frequency module according to claim 1 ; and

a signal processing circuit configured to process a transmit signal that passes through the transmit path and a receive signal that passes through the receive path.

11. A radio-frequency module comprising:

an antenna terminal;

a power amplifier;

a low-noise amplifier; and

a low-pass filter that is in a transmit path between the antenna terminal and the power amplifier, and in a receive path between the antenna terminal and the low-noise amplifier,

wherein the low-pass filter has a plurality of paths therethrough, each of the plurality of paths forming a part of the transmit path and/or the receive path,

wherein the low-pass filter comprises:

an inductor, and

a capacitor, and

wherein the plurality of paths comprise:

a first path that passes through the capacitor, and

a second path that bypasses the capacitor.

12. The radio-frequency module according to claim 11 , wherein, in the low-pass filter:

a transmit signal that passes through the transmit path passes through the first path, and

a receive signal that passes through the receive path passes through the second path.

13. The radio-frequency module according to claim 11 , wherein the capacitor is a digital tunable capacitor.

14. The radio-frequency module according to claim 13 , further comprising:

a mounting substrate that has a first principal surface and a second principal surface that are opposite each other; and

an external connection terminal that is on a second principal surface side of the mounting substrate,

wherein the inductor is on a first principal surface side of the mounting substrate, and

wherein the digital tunable capacitor is on the second principal surface side of the mounting substrate.

15. The radio-frequency module according to claim 14 , further comprising:

an antenna switch configured to switch a path for connection to an antenna,

wherein the digital tunable capacitor and the antenna switch are in a switch integrated circuit (IC).

16. The radio-frequency module according to claim 15 , wherein the inductor overlaps the switch IC in plan view in a thickness direction of the mounting substrate.

17. The radio-frequency module according to claim 16 , wherein the inductor overlaps the digital tunable capacitor in plan view in the thickness direction of the mounting substrate.

18. The radio-frequency module according to claim 11 , wherein a transmit signal that passes through the transmit path and a receive signal that passes through the receive path are time division duplex (TDD) signals.

19. The radio-frequency module according to claim 11 , wherein a transmit signal that passes through the transmit path and a receive signal that passes through the receive path are frequency division duplex (FDD) signals.

20. A communication device comprising:

radio-frequency module according to claim 11 ; and

a signal processing circuit configured to process a transmit signal that passes through the transmit path and a receive signal that passes through the receive path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2022
From: NAKAJIMA, REIJI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 061208/0656 →
Priority Claims (1)
JP 2020-077819 · Apr 24, 2020 · national
Continuity (2)
Continuation PCTJP2021016490 · Apr 23, 2021
Related Publication 20230017570A1 · Jan 19, 2023
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