Radio-frequency module and communication apparatus
A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel to the major face and spaced apart from the major face, the joint part extending from the shield part. A top face of at least one of the first circuit component and the second circuit component is connected with the joint part by a bonding wire. With the module substrate seen in plan view, the metal shield plate is disposed between the first circuit component and the second circuit component.
1. A radio-frequency module comprising:
a module substrate comprising a major face;
a first circuit component and a second circuit component that are disposed over the major face;
a metal plate disposed over the major face and set to a ground potential; and
a via-conductor disposed in the module substrate, the via-conductor extending in a direction that crosses the major face, the via-conductor being set to the ground potential,
wherein the metal plate includes:
a body part extending in a direction perpendicular to the major face, and
a first joint part parallel to the major face and spaced apart from the major face, the first joint part extending from the body part,
wherein a top face of at least one of the first circuit component and the second circuit component is connected with the first joint part by a bonding wire,
wherein with the module substrate seen in plan view, the metal plate is disposed between the first circuit component and the second circuit component,
wherein the metal plate is connected at the major face with the via-conductor, and
wherein the via-conductor has an outside diameter that is greater than or equal to a thickness of the metal plate.
2. The radio-frequency module according to claim 1 , further comprising:
a resin component that covers the major face, at least part of the first circuit component, and at least part of the second circuit component; and
a metal layer that covers a surface of the resin component, the metal layer being set to the ground potential.
3. The radio-frequency module according to claim 2 ,
wherein the metal plate and the metal layer are in contact with each other, and
wherein the metal plate is thicker than the metal layer.
4. The radio-frequency module according to claim 3 , further comprising a hole between the metal plate and the major face, the hole penetrating the body part in a normal direction relative to the body part.
5. The radio-frequency module according to claim 3 ,
wherein the metal plate further comprises:
a second joint part parallel to the major face and in contact with the major face, the second joint part extending from the body part, and
wherein the second joint part is joined with a ground electrode of the module substrate.
6. The radio-frequency module according to claim 2 , further comprising a hole between the metal plate and the major face, the hole penetrating the body part in a normal direction relative to the body part.
7. The radio-frequency module according to claim 2 ,
wherein the metal plate further comprises:
a second joint part parallel to the major face and in contact with the major face, the second joint part extending from the body part, and
wherein the second joint part is joined with a ground electrode of the module substrate.
8. The radio-frequency module according to claim 2 , wherein the at least one of the first circuit component and the second circuit component comprises a surface-mount electronic component or a surface-mount semiconductor integrated circuit (IC).
9. The radio-frequency module according to claim 1 , further comprising a hole between the metal plate and the major face, the hole penetrating the body part in a normal direction relative to the body part.
10. The radio-frequency module according to claim 9 ,
wherein the metal plate further comprises:
a second joint part parallel to the major face and in contact with the major face, the second joint part extending from the body part, and
wherein the second joint part is joined with a ground electrode of the module substrate.
11. The radio-frequency module according to claim 1 ,
wherein the metal plate further comprises:
a second joint part parallel to the major face and in contact with the major face, the second joint part extending from the body part, and
wherein the second joint part is joined with a ground electrode of the module substrate.
12. The radio-frequency module according to claim 1 , wherein the at least one of the first circuit component and the second circuit component comprises a surface-mount electronic component or a surface-mount semiconductor integrated circuit (IC).
13. The radio-frequency module according to claim 1 , further comprising:
a power amplifier; and
a low-noise amplifier,
wherein the first circuit component comprises a first inductor connected with an output terminal of the power amplifier, and
wherein the second circuit component comprises a second inductor connected with an input terminal of the low-noise amplifier.
14. The radio-frequency module according to claim 1 ,
wherein the first circuit component comprises a power amplifier,
wherein the second circuit component comprises a low-noise amplifier,
wherein the low-noise amplifier is included in a first semiconductor integrated circuit (IC), and
wherein a top face of the first semiconductor IC is connected with the first joint part by a bonding wire.
15. A communication apparatus comprising:
a radio-frequency integrated circuit that is configured to process a radio-frequency signal transmitted and received by an antenna; and
the radio-frequency module according to claim 1 that is configured to propagate the radio-frequency signal between the antenna and the radio-frequency integrated circuit.