IP Library Granted Patent US 12,435,506
Granted Patent B2
US 12,435,506 · App. 18/036,921 · Granted Oct 7, 2025

Safer dustless method for installing a precompressed expansion joint sealing system

Inventors: Lester Hensley (Westborough, MA); Massimo Demarco (Woodbridge, CA); Eric Muench (Fanwood, NJ)
Assignee: SIKA TECHNOLOGY AG
E04B1/6812
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,435,506
App. No.
18/036,921
Granted
Oct 7, 2025
Kind
B2
Abstract

Disclosed is a safer, dustless method for installing an expansion joint sealing system without mechanically grinding substrates to improve adhesion. The method includes locating substrates forming a gap between opposing surfaces of the substrates, preparing the surfaces by wiping with a solvent, and applying a mounting band of sealant to the surfaces. The method includes disposing the sealing system in the gap proximate to or within the mounting band, maintaining the sealing system in the gap until the system expands toward the surfaces, embeds within the mounting band and secures the sealing system in position between opposing surfaces. The method also includes prior to the preparing the surfaces, removing an existing joint sealing system by cutting sealant between the existing system and the substrates, wiping surfaces with solvent, and leaving any deformation or embedded residue from the removed sealing system on or embedded in the surfaces of the substrates.

Claims (18)

1. A safer, dustless method for installing a precompressed expansion joint sealing system, the method comprising:

locating a first substrate and a second substrate, the second substrate arranged coplanar with the first substrate and being spaced therefrom by a gap formed between opposing surfaces of the first substrate and the second substrate;

preparing the opposing surfaces of the first substrate and the second substrate without mechanically grinding, abrading or scraping by wiping the opposing surfaces with a solvent leaving any surface deformations and residue;

applying a mounting band of a liquid sealant to the opposing surfaces of the first substrate and the second substrate;

disposing a precompressed expansion joint sealing system in the gap by locating the expansion joint sealing system in a position between the opposing surfaces and at least in one of proximity to or within the mounting band of the liquid sealant applied to the opposing surfaces of the first substrate and the second substrate; and

maintaining the precompressed expansion joint sealing system in the position in the gap until the precompressed expansion joint sealing system expands outwardly toward the opposing surfaces, embeds within the mounting band of sealant and secures the expansion joint sealing system in the position between opposing surfaces of the first substrate and the second substrate.

2. The safer, dustless method for installing of claim 1 , wherein the method further comprises:

applying a bead of liquid sealant to and between a portion of a top surface of the precompressed expansion joint sealing system and the opposing surfaces of the first substrate and the second substrate.

3. The safer, dustless method for installing of claim 1 , wherein the method further comprises:

prior to the preparing the opposing surfaces of the first substrate and the second substrate, steps of:

locating an existing joint sealing system installed in the gap between the first substrate and the second substrate; and

removing the existing joint sealing system by cutting sealant between the existing joint sealing system and the first substrate and the second substrate; and

wherein the preparing the opposing surfaces of the first substrate and the second substrate by wiping further includes wiping the opposing surfaces with the solvent and leaving any surface deformation and embedded residue of sealant remaining from the removed joint sealing system on or embedded in the opposing surfaces of the first substrate and the second substrate without mechanically grinding, scraping or abrading the substrates either to prepare the substrates or to remove the residue of the previously installed and removed joint sealing system.

4. The safer, dustless method of installing of claim 1 , wherein the installed precompressed expansion joint sealing system is a water resistant and/or fire resistant precompressed expansion joint sealing system.

5. The safer, dustless method of installing of claim 4 , wherein the water resistant and/or fire resistant precompressed expansion joint sealing system includes fire retardant material introduced into a core of the expansion joint sealing system and has as a compressed density in a range of about 160 kg/m 3 to about 800 kg/m 3 and the expansion joint sealing system is configured to pass testing provided by UL 2079.

6. The safer, dustless method of installing of claim 4 , wherein the installed precompressed expansion joint sealing system further includes a water resistant or water proof resistant coating applied to a surface of the precompressed expansion joint sealing system.

7. The safer, dustless method of installing of claim 6 , wherein the water resistant or water proof resistant coating is paintable.

8. The safer, dustless method for installing of claim 1 , wherein the liquid sealant is based on isocyanate-terminated polyurethane polymers and/or based on silane-terminated polyurethane polymers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2023
From: HENSLEY, LESTER; DEMARCO, MASSIMO; MUENCH, ERIC
To: SIKA TECHNOLOGY AG
Reel/Frame 063638/0116 →
Continuity (2)
Provisional Application 63140428 · Jan 22, 2021
Related Publication 20230417047A1 · Dec 28, 2023
References Cited (24)
US 4932183A · Coulston · 1990 [cited by examiner]
US 5130176A · Baerveldt · 1992 [cited by examiner]
US 5935695A · Baerveldt · 1999 [cited by examiner]
US 8365495B1 · Witherspoon · 2013 [cited by examiner]
US 10815658B2 · Danna · 2020 [cited by examiner]
US 10920417B2 · Hulteen · 2021 [cited by examiner]
US 20040062605A1 · Lehto · 2004 [cited by examiner]
US 20040187235A1 · Elias · 2004 [cited by examiner]
US 20080115440A1 · Fortney · 2008 [cited by examiner]
US 20090266020A1 · Sladojevic · 2009 [cited by examiner]
US 20100307102A1 · Barnett · 2010 [cited by examiner]
US 20130133279A1 · Noonan · 2013 [cited by examiner]
US 20140154008A1 · Stachowicz · 2014 [cited by examiner]
US 20140219719A1 · Hensley · 2014 [cited by examiner]
US 20160076240A1 · Hensley · 2016 [cited by examiner]
US 20170284083A1 · Hensley et al. · 2017 [cited by applicant]
US 20190194935A1 · Robinson · 2019 [cited by examiner]
US 20190226340A1 · Andrick · 2019 [cited by examiner]
US 20190323347A1 · Hensley · 2019 [cited by examiner]
US 20200325674A1 · Robinson · 2020 [cited by examiner]
CA 2960236A1 · 2018 [cited by applicant]
DE 10153548C1 · 2003 [cited by applicant]
May 4, 2022 Search Report issued in International Patent Application No. PCT/EP2022/050812. [cited by applicant]
May 4, 2022 Written Opinion of the International Searching Authority issued in International Patent Application No. PCT/EP2022/050812. [cited by applicant]