Power distribution board
View Patent ↗A power distribution board includes a complex programmable logic device (CPLD), a first buck chip and a second buck chip. The first buck chip is connected to the complex programmable logic device. The first buck chip is configured to receive a first direct current (DC) voltage, lower the first DC voltage to a first voltage, and supply the first voltage to the complex programmable logic device. The second buck chip is configured to receive a second direct current voltage, lower the second direct current voltage to a second voltage, and supply the second voltage to a power module. The first direct current voltage and the second direct current voltage has a same voltage value.
1. A power distribution board, comprising:
a complex programmable logic device;
a first buck chip connected to the complex programmable device, and configured to receive a first direct current voltage, lower the first direct current voltage to a first voltage, and supply the first voltage to the programmable device;
a second buck chip configured to receive a second direct current voltage, lower the second direct current voltage to a second voltage, and supply the second voltage to a power module;
a fuse control chip connected to a direct current power, the first buck chip and the second buck chip, and configured to receive electricity from the direct current power and provide a first portion of the electricity as a first direct current voltage to the first buck chip, and a second portion of the electricity as a second direct current voltage to the second buck chip respectively; and
a sideband connector configured to connect a baseboard management controller with the fuse control chip, the first buck chip, and the second buck chip,
wherein the first direct current voltage is equal to the second direct current voltage.
2. The power distribution board according to claim 1 , wherein the sideband connector is connected to the baseboard management controller with the fuse control chip, the first buck chip, and the second buck chip through an inter-integrated circuit interface.
3. The power distribution board according to claim 1 , wherein the sideband connector is connected to at least one of a temperature sensor, a field replaceable unit and a general purpose parallel input/output expansion chip through an inter-integrated circuit interface.
4. The power distribution board according to claim 1 , further comprising:
an electrically erasable programmable read-only memory connected to the complex programmable logic device through an inter-integrated circuit interface, and configured to store firmware back-up of the complex programmable logic device.
5. The power distribution board according to claim 1 , wherein the first buck chip is further configured to supply the first voltage to at least one of a temperature sensor, a field replaceable unit and a general parallel input/output expansion chip, wherein the first voltage equals a stand-by voltage.
6. The power distribution board according to claim 1 , wherein the second buck chip is further connected to the complex programmable logic device, and the first buck chip and the second buck chip are further configured to output at least one of a power good signal, a warning signal, a fine-DC-power signal and a fine-AC-power signal to the complex programmable logic device.
7. The power distribution board according to claim 1 , wherein the second buck chip comprises a connector configured to receive at least one of a firmware update command or a firmware debug command related to the second buck chip.
8. The power distribution board according to claim 1 , wherein the complex programmable logic device is further connected to a light emitting element configured to emit light corresponding to a state of the complex programmable logic device.