IP Library › Granted Patent US 12,439,189
Granted Patent B2
US 12,439,189 · App. 18/338,806 · Granted Oct 7, 2025

Electronic device comprising microphone module

Inventors: Heejun Ryu (Suwon-si, KR); Heeseok Jung (Suwon-si, KR); Hanbom Park (Suwon-si, KR); Sunghyup Lee (Suwon-si, KR); Sungkeun Koo (Suwon-si, KR); Myeongjin Kim (Suwon-si, KR); Dongju Yeon (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H04R1/083G06F1/1658G06F1/1684H04R1/028H04R1/04H04M1/026H04R2499/11
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Quick Facts
Patent No.
US 12,439,189
App. No.
18/338,806
Granted
Oct 7, 2025
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a rear plate which includes a first through-hole, a flash member which includes a flash lens and a support structure accommodating the flash lens and including a second through-hole opposite to the rear plate, and at least a part of which is disposed in the first through-hole, a support member which supports the flash member and includes a third through-hole opposite to at least a part of the second through-hole, and a microphone module which is disposed under the support member and covers the third through-hole.

Claims (60)

1. An electronic device comprising:

a rear plate including a first through hole;

a flash member at least partially disposed within the first through hole and including:

a flash lens, and

a support structure accommodating the flash lens and including a second through hole facing the rear plate;

a support member supporting the flash member and including a third through hole facing at least a part of the second through hole; and

a microphone module disposed under the support member and configured to receive sound through the first through hole, the second through hole, and the third through hole.

2. The electronic device of claim 1 ,

wherein the rear plate includes a first surface exposed to an outside of the electronic device and a second surface opposite to the first surface,

wherein the support structure of the flash member includes a third surface facing the second surface and a fourth surface opposite to the third surface, and

wherein the second through hole penetrates at least a part of the support structure of the flash member between the third surface and the fourth surface.

3. The electronic device of claim 2 , wherein at least a part of the microphone module is configured to obtain sound from the outside of the electronic device through an internal space at least partially disposed between the second surface and the third surface, the second through hole, and the third through hole.

4. The electronic device of claim 2 , further comprising:

a first waterproof member disposed under the flash member and covering the second through hole.

5. The electronic device of claim 4 ,

wherein the second through hole includes a first portion extending from an internal space between the second surface and the third surface and a second portion extending from the first portion and having the first waterproof member attached thereto, and

wherein a cross-sectional area of the second portion is larger than a cross-sectional area of the first portion.

6. The electronic device of claim 1 , further comprising:

a printed circuit board accommodating at least one electronic component and disposed under the support member.

7. The electronic device of claim 6 ,

wherein the printed circuit board includes a fifth surface facing the support member, a sixth surface opposite to the fifth surface, and a fourth through hole penetrating between the fifth surface and the sixth surface and facing the third through hole, and

wherein the microphone module covers the fourth through hole and is disposed on the sixth surface.

8. The electronic device of claim 7 , further comprising:

a second sealing member disposed between the support member and the printed circuit board.

9. The electronic device of claim 6 , further comprising:

a flexible printed circuit board connected to the support member and including a fifth through hole facing the third through hole,

wherein the microphone module covers the fifth through hole and is disposed under the flexible printed circuit board.

10. The electronic device of claim 6 , further comprising:

at least one fastening structure connecting the support member and the printed circuit board to each other.

11. The electronic device of claim 1 ,

wherein the rear plate includes a seventh surface surrounding at least a part of the flash member, and

wherein the flash member includes a protrusion structure extending from the support structure and facing the seventh surface.

12. The electronic device of claim 11 , wherein the flash member includes at least one of at least one groove structure formed on the protrusion structure or at least one bump structure protruding from the protrusion structure toward the seventh surface.

13. The electronic device of claim 1 , further comprising:

a second waterproof member disposed between the flash member and the rear plate.

14. The electronic device of claim 1 , further comprising:

a first sealing member disposed between the flash member and the support member.

15. The electronic device of claim 1 ,

wherein the rear plate includes at least one camera hole spaced apart from the first through hole, and

wherein the electronic device further comprises a camera module at least partially exposed visually to an outside of the electronic device through the at least one camera hole.

16. An electronic device comprising:

a rear plate including a first through hole;

a flash member including:

a support structure including a second through hole facing the rear plate, and

a protrusion structure extending from the support structure and at least partially disposed within the first through hole;

a support member supporting the flash member and including a third through hole facing at least a part of the second through hole;

a printed circuit board disposed on the support member and including a fourth through hole facing the third through hole; and

a microphone module disposed on the printed circuit board and configured to receive sound through the first through hole, the second through hole, the third through hole, and the fourth through hole.

17. The electronic device of claim 16 ,

wherein the rear plate includes a first surface exposed to an outside of the electronic device and a second surface opposite to the first surface,

wherein the support structure of the flash member includes a third surface facing the second surface and a fourth surface opposite to the third surface, and

wherein the second through hole penetrates at least a part of the support structure of the flash member between the third surface and the fourth surface.

18. The electronic device of claim 17 , wherein at least a part of the microphone module is be configured to obtain sound from the outside of the electronic device through an internal space at least partially disposed between the second surface and the third surface, the second through hole, the third through hole, and the fourth through hole.

19. The electronic device of claim 16 , further comprising:

a second sealing member disposed between the support member and the printed circuit board.

20. The electronic device of claim 16 ,

wherein the rear plate includes a seventh surface surrounding at least a part of the protrusion structure, and

wherein the flash member includes at least one of at least one groove structure formed on the protrusion structure or at least one bump structure protruding from the protrusion structure toward the seventh surface.

21. The electronic device of claim 16 , wherein the second through hole, the third through hole, and the fourth through hole are aligned each other, and the first through hole and the second through hole are mis-aligned.

22. The electronic device of claim 16 , wherein the sound is received through a gap formed between the protrusion structure and the rear plate in the first through hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2023
From: RYU, HEEJUN; JUNG, HEESEOK; PARK, HANBOM; LEE, SUNGHYUP; KOO, SUNGKEUN; KIM, MYEONGJIN; YEON, DONGJU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064039/0670 →
Priority Claims (1)
KR 10-2021-0003575 · Jan 11, 2021 · national
Continuity (2)
Continuation PCTKR2021019228 · Dec 16, 2021
Related Publication 20230336900A1 · Oct 19, 2023
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