Mounting board and circuit board
A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d 1 and long sides of the electronic component have a dimension d 2 , a value of (dimension d 1 −dimension d 2 ) is 10 μm or less.
1. A mounting board comprising:
an electronic component including at least a pair of first terminals; and
a circuit board including at least a pair of second terminals,
wherein the first terminals and the second terminals are electrically joined by a joining material containing a metal element,
the electronic component and the joining material are disposed within a wall made of an insulator,
a lower surface of the electronic component is lower than an upper surface of the wall,
when long sides of a region surrounded by the wall have a dimension d 1 and long sides of the electronic component have a dimension d 2 , a value of (dimension d 1 −dimension d 2 ) is 10 μm or less, and
wherein a constituent material is disposed between the wall and both the electronic component and the joining material.
2. The mounting board according to claim 1 ,
wherein the constituent material exists above the upper surface of the wall.
3. The mounting board according to claim 2 ,
wherein a first spacer lower than the upper surface of the wall is disposed between the pair of second terminals.
4. The mounting board according to claim 2 ,
wherein a second spacer lower than the upper surface of the wall is disposed on an inner periphery of the wall.
5. The mounting board according to claim 2 ,
wherein when a height of the upper surface of the wall is defined as a dimension h 1 , and a height of an upper surface of the electronic component is defined as a dimension h 2 , a value of (dimension h 2 −dimension h 1 ) is 9 μm or less.
6. The mounting board according to claim 2 ,
wherein there is a step at a lower portion of the electronic component, and a constituent material is disposed between the lower portion and the circuit board.
7. The mounting board according to claim 2 ,
wherein inner surfaces of the wall have a tapered shape.
8. The mounting board according to claim 1 ,
wherein when a height of the upper surface of the wall is defined as a dimension h 1 , and a height of an upper surface of the electronic component is defined as a dimension h 2 , a value of (dimension h 2 −dimension h 1 ) is 9 μm or less.
9. The mounting board according to claim 1 ,
wherein inner surfaces of the wall have a tapered shape.
10. The mounting board according to claim 1 ,
wherein a first spacer lower than the upper surface of the wall is disposed between the pair of second terminals.
11. The mounting board according to claim 1 ,
wherein a second spacer lower than the upper surface of the wall is disposed on an inner periphery of the wall.
12. The mounting board according to claim 1 ,
wherein when a height of the upper surface of the wall is defined as a dimension h 1 , and a height of an upper surface of the electronic component is defined as a dimension h 2 , a value of (dimension h 2 −dimension h 1 ) is 9 μm or less.
13. The mounting board according to claim 1 ,
wherein there is a step at a lower portion of the electronic component, and a constituent material is disposed between the lower portion and the circuit board.
14. The mounting board according to claim 1 ,
wherein inner surfaces of the wall have a tapered shape.
15. A mounting board comprising:
an electronic component including at least a pair of first terminals; and
a circuit board including at least a pair of second terminals,
wherein the first terminals and the second terminals are electrically joined by a joining material containing a metal element,
the electronic component and the joining material are disposed within a wall made of an insulator,
a lower surface of the electronic component is lower than an upper surface of the wall,
when long sides of a region surrounded by the wall have a dimension d 1 and long sides of the electronic component have a dimension d 2 , a value of (dimension d 1 −dimension d 2 ) is 10 μm or less, and
wherein a first spacer lower than the upper surface of the wall is disposed between the pair of second terminals.
16. The mounting board according to claim 15 ,
wherein a second spacer lower than the upper surface of the wall is disposed on an inner periphery of the wall.
17. A mounting board comprising:
an electronic component including at least a pair of first terminals; and
a circuit board including at least a pair of second terminals,
wherein the first terminals and the second terminals are electrically joined by a joining material containing a metal element,
the electronic component and the joining material are disposed within a wall made of an insulator,
a lower surface of the electronic component is lower than an upper surface of the wall,
when long sides of a region surrounded by the wall have a dimension d 1 and long sides of the electronic component have a dimension d 2 , a value of (dimension d 1 −dimension d 2 ) is 10 μm or less, and
wherein a second spacer lower than the upper surface of the wall is disposed on an inner periphery of the wall.
18. A mounting board comprising:
an electronic component including at least a pair of first terminals; and
a circuit board including at least a pair of second terminals,
wherein the first terminals and the second terminals are electrically joined by a joining material containing a metal element,
the electronic component and the joining material are disposed within a wall made of an insulator,
a lower surface of the electronic component is lower than an upper surface of the wall,
when long sides of a region surrounded by the wall have a dimension d 1 and long sides of the electronic component have a dimension d 2 , a value of (dimension d 1 −dimension d 2 ) is 10 μm or less, and
wherein there is a step at a lower portion of the electronic component, and a constituent material is disposed between the lower portion and the circuit board.