Dynamic flash memory (DFM) with ring-type insulator in channel for improved retention
A three-dimensional (3D) memory device includes a memory cell, a top contact coupled to the memory cell, and a bottom contact coupled to the memory cell. The memory cell can include a pillar, an insulating layer surrounding the pillar, a first gate contact coupled to a word line, a second gate contact coupled to a plate line, and an annular dielectric layer within a portion of the pillar. The annular dielectric layer can increase a retention time of electrical charge in the pillar. The 3D memory device can utilize dynamic flash memory (DFM), increase retention times, decrease refresh rates, increase a floating body effect, decrease manufacturing defects, decrease leakage current, decrease junction current, decrease power consumption, increase an upper limit of charge density in the pillar, dynamically adjust a length of the plate line, and decrease parasitic resistance.
1. A three-dimensional memory device comprising:
a memory cell comprising:
a pillar;
an insulating layer surrounding the pillar;
a first gate contact surrounding a first portion of the insulating layer, the first gate contact coupled to a word line configured to address and non-destructively read the pillar;
a second gate contact surrounding a second portion of the insulating layer, the second gate contact coupled to a plate line configured to program the pillar; and
an annular dielectric layer radially separating the pillar into a channel and a body, the body to store an electrical charge, the annular dielectric layer between the body of the pillar and the insulating layer.
2. The memory device of claim 1 , wherein the annular dielectric layer comprises a high-k dielectric, an oxide, a nitride, or a combination thereof.
3. The memory device of claim 1 , wherein:
the annular dielectric layer is configured to increase a retention time in the pillar, and the retention time of storing the electrical charge is greater than about 100 ms.
4. The memory device of claim 1 , wherein the channel includes an inversion layer in the pillar.
5. The memory device of claim 1 , wherein the body of the pillar and the channel of the pillar have different doping concentrations to increase a floating body effect of the memory cell.
6. The memory device of claim 5 , wherein the body of the pillar has a doping concentration of about 5×10 18 cm .3 and the channel of the pillar has a doping concentration of about 1×10 16 cm .3 to about 1×10 17 cm .3 .
7. The memory device of claim 1 , wherein the annular dielectric layer isolates the body of the pillar thereby increasing a charge density in the body of the pillar.
8. The memory device of claim 7 , wherein the charge density is greater than about 1×10 18 cm .3 .
9. The memory device of claim 1 , wherein the annular dielectric layer comprises an annulus extending axially along the pillar from a top end of the second gate contact to a bottom contact.
10. The memory device of claim 1 , wherein the pillar is a monocrystalline material.