IP Library › Granted Patent US 12,441,896
Granted Patent B2
US 12,441,896 · App. 18/857,654 · Granted Oct 14, 2025

Conductive coating material and circuit former

Inventors: Katsutomo Wakabayashi (Kuki, JP); Akinori Naruse (Kuki, JP); Yuka Azakami (Kuki, JP)
Assignee: Fujikura Kasei Co., Ltd.
C09D5/24C08K3/08C08K7/18C09D7/61C09D7/69C09D7/70C09D183/04H01B1/22C08K2003/0806C08K2201/001
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Quick Facts
Patent No.
US 12,441,896
App. No.
18/857,654
Granted
Oct 14, 2025
Kind
B2
Abstract

A conductive coating material includes a silicone resin (A), and a conductive powder (B) at a specific mass ratio, in which the conductive powder (B) includes a flake-shaped conductive powder (B1) having an average particle size of 1 to 7 μm and an amorphous conductive powder (B2) having an average particle size of 1 to 6 μm at a specific mass ratio, and Expression (1) below is satisfied, 100≤X1+X2≤260 (1), X1=(the average particle size of the conductive powder (B1)/a tap density of the conductive powder (B1))×(a content of the conductive powder (B1) with respect to a total mass of the conductive powder (B)), X2=(the average particle size of the conductive powder (B2)/a tap density of the conductive powder (B2))×(a content of the conductive powder (B2) with respect to the total mass of the conductive powder (B)).

Claims (13)

1. A conductive coating material, comprising:

a silicone resin (A); and

a conductive powder (B),

wherein a mass ratio (A/B) of the silicone resin (A) to the conductive powder (B) is 10/90 to 35/65,

the conductive powder (B) includes a flake-shaped conductive powder (B1) having an average particle size of 1 to 7 μm and an amorphous conductive powder (B2) having an average particle size of 1 to 6 μm,

a mass ratio (B1/B2) of the conductive powder (B1) to the conductive powder (B2) is 40/60 to 90/10, and Expression (1) below is satisfied,

100≤ X 1+ X 2≤260  (1),

X1=(the average particle size of the conductive powder (B1)/a tap density of the conductive powder (B1))×(a content of the conductive powder (B1) with respect to a total mass of the conductive powder (B)),

X2=(the average particle size of the conductive powder (B2)/a tap density of the conductive powder (B2))×(a content of the conductive powder (B2) with respect to the total mass of the conductive powder (B)).

2. A circuit former comprising:

a substrate; and

a circuit,

wherein the circuit is formed on the substrate from a coating film obtained by using the conductive coating material according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2024
From: WAKABAYASHI, KATSUTOMO; NARUSE, AKINORI; AZAKAMI, YUKA
To: FUJIKURA KASEI CO., LTD.
Reel/Frame 068929/0845 →
Priority Claims (1)
JP 2022-073168 · Apr 27, 2022 · national
Continuity (1)
Related Publication 20250257227A1 · Aug 14, 2025
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