IP Library › Granted Patent US 12,442,495
Granted Patent B2
US 12,442,495 · App. 18/418,885 · Granted Oct 14, 2025

High-voltage LED string light and method of manufacturing thereof

Inventor: Zhumei Deng (Dongguan, CN)
Assignee: Dongguan Yongfeng Lighting Co., Ltd
F21S4/10F21V15/01F21Y2115/10
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Quick Facts
Patent No.
US 12,442,495
App. No.
18/418,885
Granted
Oct 14, 2025
Kind
B2
Abstract

A light assembly of a string light is disclosed. The light assembly includes a first wire and a second wire, each of the first wire and the second wire comprising an end exposing copper strands; a first light-emitting diode (LED) chip soldered to the exposed copper strands of the first wire and the second wire; a colloid encapsulating the first LED chip soldered to the first wire and the second wire; a light head securing the colloid and a part of the first wire and the second wire; and a decorative shell secured onto the light head and enclosing the colloid encapsulating the first LED chip.

Claims (12)

1. A method of making a light assembly of a string light, the method comprising:

providing a first wire and a second wire;

stripping an end of each of the first wire and the second wire of insulation to expose a portion of copper strands of each of the first wire and the second wire;

encapsulating the first LED chip with a colloid;

attaching a light head to the first wire and the second wire after the first LED chip is encapsulated with the colloid; and

securing a decorative shell on the light head after the light head is attached to the first wire and second wire,

wherein the decorative shell and the light head enclose the colloid encapsulating the first LED chip.

2. The method of claim 1 , further comprises placing a rear plug in a space between the first wire and the second wire where the first wire and the second wire diverge.

3. The method of claim 1 , wherein soldering the first LED chip to the first wire and the second wire comprises soldering an anode of the first LED chip to the exposed copper strands of the first wire and soldering a cathode of the first LED chip to the exposed copper strands of the second wire.

4. The method of claim 1 , wherein the light head is assembled or made by foam injection.

5. The method of claim 1 , wherein the colloid is formed over the first LED chip using injection molding, casting, or foam injection.

6. The method of claim 1 , further comprises soldering a second LED chip to the exposed copper strands of the first wire and the second wire.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND ADDRESS FROM DONGGUAN YONGFENG LIGHT CO., LTD, NO. 55, NORTH 9TH STREET, EAST QIAOTOUQQIAO ROAD QIAOTOUDONGGUAN, CHINA 523575 TO DONGGUAN YONGFENG LIGHTING CO., LTD, ROOM 703, BUILDING 10, NO. 10 QIAOXING WEST 2ND ROAD,QIAOTOU TOWN, DONGGUAN CITY, GUANGDONG PROVINCE, CHINA 523518 PREVIOUSLY RECORDED ON REEL 66396 FRAME 430. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST . Recorded Sep 17, 2025
From: DENG, ZHUMEI
To: DONGGUAN YONGFENG LIGHTING CO., LTD
Reel/Frame 072817/0705 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2024
From: DENG, ZHUMEI
To: DONGGUAN YONGFENG LIGHT CO., LTD
Reel/Frame 066396/0430 →
Priority Claims (1)
CN 202410046398.6 · Jan 12, 2024 · national
Continuity (1)
Related Publication 20250230908A1 · Jul 17, 2025
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