Method of manufacturing display device
According to one embodiment, a method of manufacturing a display device includes forming a first organic layer covering a lower electrode and a second organic layer on an upper portion of a partition, forming a first upper electrode and a second upper electrode, forming a first transparent layer and a second transparent layer, forming a first inorganic layer and a second inorganic layer, forming a sealing layer on the first inorganic layer and the second inorganic layer, forming a resist covering the sealing layer directly above the lower electrode and covering a part of the sealing layer directly above the partition, performing dry etching using the resist as a mask, and performing wet etching by an acidic solution using the resist as a mask.
1. A method of manufacturing a display device, comprising:
preparing a processing substrate in which a lower electrode, a rib having an aperture overlapping the lower electrode, and a partition including a lower portion disposed on the rib and an upper portion disposed on the lower portion and protruding from a side surface of the lower portion are formed above a substrate;
forming a first organic layer covering the lower electrode, and a second organic layer spaced apart from the first organic layer and located on the upper portion;
forming a first upper electrode located on the first organic layer and in contact with the lower portion, and a second upper electrode spaced apart from the first upper electrode and located on the second organic layer;
forming a first transparent layer located on the first upper electrode, and a second transparent layer spaced apart from the first transparent layer and located on the second upper electrode;
forming a first inorganic layer located on the first transparent layer, and a second inorganic layer spaced apart from the first inorganic layer and located on the second transparent layer;
forming a sealing layer located on the first inorganic layer and the second inorganic layer and covering the partition;
forming a resist covering the sealing layer directly above the lower electrode and covering a part of the sealing layer directly above the partition;
performing dry etching using the resist as a mask to remove the sealing layer exposed from the resist; and
performing wet etching by an acidic solution using the resist as a mask to remove the second inorganic layer exposed from the resist.
2. The method of manufacturing a display device of claim 1 , wherein the first inorganic layer and the second inorganic layer are formed by lithium fluoride (LiF).
3. The method of manufacturing a display device of claim 2 , wherein thickness of the first inorganic layer and the second inorganic layer is 20 nm or more and 200 nm or less.
4. The method of manufacturing a display device of claim 2 , wherein refractive indices of the first inorganic layer and the second inorganic layer are smaller than those of the first transparent layer and the second transparent layer.
5. The method of manufacturing a display device of claim 1 , wherein the acidic solution is a solution of at least one of the following organic acids: formic acid, acetic acid, propionic acid, and butanoic acid.
6. The method of manufacturing a display device of claim 5 , wherein the acidic solution is an acetic acid solution, and an acetic acid concentration is 0.01% or higher.
7. The method of manufacturing a display device of claim 6 , wherein the acetic acid concentration is 0.1% or higher and 15% or lower.
8. The method of manufacturing a display device of claim 5 , wherein pH of the acidic solution is 2.5 or higher and 3.6 or lower.
9. The method of manufacturing a display device of claim 1 , wherein the acidic solution is a solution of at least one of the following inorganic acids: nitric acid and hydrochloric acid.
10. The method of manufacturing a display device of claim 1 , wherein the first organic layer and the second organic layer include light emitting layers formed of a same material.
11. The method of manufacturing a display device of claim 1 , further comprising removing the second transparent layer exposed from the resist using the resist as a mask.
12. The method of manufacturing a display device of claim 11 , further comprising removing the second upper electrode exposed from the resist using the resist as a mask.
13. The method of manufacturing a display device of claim 12 , further comprising removing the second organic layer exposed from the resist using the resist as a mask.