Image pickup unit and endoscope
An image pickup unit includes: an image pickup device, a first wiring board bonded to the image pickup device; and a second wiring board bonded to the first wiring board and including a gate remnant in a back area of the second wiring board.
1. An image pickup unit comprising:
an image pickup device including a light-receiving surface located on a front side and a rear surface located on a back side, and a plurality of external electrodes disposed on the rear surface;
a first wiring board including a first surface located on a front side and a second surface located on a back side, the first wiring board including a plurality of first electrodes disposed on the first surface, and a plurality of second electrodes disposed on the second surface, the plurality of first electrodes being bonded respectively to the plurality of external electrodes; and
a second wiring board including a third surface located on a front side and a fourth surface located on a back side, the second wiring board including a plurality of third electrodes disposed on the third surface, and a gate remnant located in a back area of the second wiring board, the plurality of third electrodes being bonded respectively to the plurality of second electrodes.
2. The image pickup unit according to claim 1 , wherein
the back area of the second wiring board is a back side area, when a front side area and a back side area are defined, with a surface located at an equal distance from the third surface and the fourth surface, as a boundary.
3. The image pickup unit according to claim 2 , wherein
the gate remnant is located in the fourth surface which is parallel to the third surface.
4. The image pickup unit according to claim 3 , wherein
the gate remnant is located in a center area of the fourth surface which is parallel to the third surface.
5. The image pickup unit according to claim 2 , wherein
among a plurality of bonding portions between the plurality of second electrodes of the first wiring board and the plurality of third electrodes of the second wiring board, four bonding portions arranged at an outermost side have an equal distance from the gate remnant.
6. The image pickup unit according to claim 4 , wherein
the fourth surface includes a recess, and
the gate remnant is located on a bottom surface of the recess.
7. The image pickup unit according to claim 6 , wherein
a back side of the gate remnant is located in the recess.
8. The image pickup unit according to claim 2 , wherein
the second wiring board includes a fifth surface intersecting the fourth surface, and
the gate remnant is located on the fifth surface.
9. The image pickup unit according to claim 2 , wherein
the second wiring board is a molded interconnect device.
10. The image pickup unit according to claim 2 , wherein
the plurality of third electrodes are solder-bonded respectively to the plurality of second electrodes.
11. The image pickup unit according to claim 2 , wherein
the second wiring board is an irregularly-shaped wiring board in which the fourth surface is smaller than the third surface.
12. The image pickup unit according to claim 2 , wherein
the second wiring board has a thermal expansion coefficient different from a thermal expansion coefficient of the first wiring board.
13. The image pickup unit according to claim 1 , wherein
the second wiring board does not have an anisotropy in a thermal expansion coefficient.
14. An endoscope comprising:
an insertion portion configured to be inserted into a subject; and
an image pickup unit provided at a distal end portion of the insertion portion;
the image pickup unit comprising:
an image pickup device including a light-receiving surface located on a front side and a rear surface located on a back side, and a plurality of external electrodes disposed on the rear surface;
a first wiring board including a first surface located on a front side and a second surface located on a back side, the first wiring board including a plurality of first electrodes disposed on the first surface, and a plurality of second electrodes disposed on the second surface, the plurality of first electrodes being bonded respectively to the plurality of external electrodes; and
a second wiring board including a third surface located on a front side and a fourth surface located on a back side, the second wiring board including a plurality of third electrodes disposed on the third surface, and a gate remnant located in a back area of the second wiring board, the plurality of third electrodes being bonded respectively to the plurality of second electrodes.