IP Library Granted Patent US 12,447,635
Granted Patent B2
US 12,447,635 · App. 18/327,064 · Granted Oct 21, 2025

Cooling device for robot controller

Inventor: Hajime Takagi (Nagano, JP)
Assignee: NIDEC INSTRUMENTS CORPORATION
B25J19/0054H05K7/20154H05K7/20209H05K7/20909
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Quick Facts
Patent No.
US 12,447,635
App. No.
18/327,064
Granted
Oct 21, 2025
Kind
B2
Abstract

A cooling device for a robot controller includes a servo driver having a circuit board and a heat generation element. The cooling device includes a fin member which is attached to the heat generation element, a temperature sensor, a heat conductive sheet which transmits heat generated in the heat generation element to the temperature sensor, a fan which generates an air flow toward the fin member, and a fan control part which controls the fan based on a detection value of the temperature sensor. The heat conductive sheet is disposed between the circuit board and the heat generation element in the servo driver and is contacted with both of the circuit board and the heat generation element, and the temperature sensor is provided on the circuit board and is covered by the heat conductive sheet.

Claims (21)

1. A cooling device for a robot controller comprising a servo driver having a control circuit, a circuit board and a heat generation element, wherein the heat generation element is a semiconductor element configuring an inverter circuit that drives a motor, the cooling device comprising:

a fin member which is attached to the heat generation element;

a temperature sensor;

a heat conductive sheet which transmits heat generated in the heat generation element to the temperature sensor;

a fan which generates an air flow toward the fin member; and

a fan control part which controls the fan based on a detection value of the temperature sensor;

wherein the heat conductive sheet is disposed between the circuit board and the heat generation element in the servo driver and is contacted with both of the circuit board and the heat generation element,

the temperature sensor is provided on a first surface of the circuit board and is covered by the heat conductive sheet,

the control circuit is provided on a second surface of the circuit board opposite to the first surface, and

the temperature sensor does not overlap the control circuit when viewed in a thickness direction of the circuit board.

2. The cooling device according to claim 1 , wherein the fan control part controls an air quantity generated by the fan so that a temperature measured by the temperature sensor does not exceed a predetermined value.

3. The cooling device according to claim 1 , wherein

the servo driver comprises a plurality of servo drivers,

the fin member comprises a plurality of fin members respectively disposed on the plurality of servo drivers,

the robot controller comprises the plurality of servo drivers, and

an air flow generated by the fan is divided to flow along each of the plurality of fin members.

4. The cooling device according to claim 3 , wherein the fan control part controls an air quantity generated by the fan so that a temperature measured by the temperature sensor provided in each of the plurality of servo drivers does not exceed a predetermined value.

5. The cooling device according to claim 2 , wherein

the predetermined value is a value which is determined based on a rated maximum value of a junction temperature of the semiconductor element.

6. The cooling device according to claim 4 , wherein

the predetermined value is a value which is determined based on a rated maximum value of a junction temperature of the semiconductor element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2023
From: TAKAGI, HAJIME
To: NIDEC INSTRUMENTS CORPORATION
Reel/Frame 063834/0737 →
Priority Claims (1)
JP 2022-098058 · Jun 17, 2022 · national
Continuity (1)
Related Publication 20230405846A1 · Dec 21, 2023
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