Integrated vacuum cell assemblies
The disclosure describes vacuum cell assemblies that integrate a vacuum envelope with a photonic integrated circuit (PIC). Walls of the vacuum envelope are coupled to the PIC, such as through anodic bonding, so that the PIC forms at least one wall of the vacuum envelope and provides an optically accessible medium and surface for transmitting and distributing light into various cavities of the vacuum envelope through one or more nonplanar waveguides. A surface of the PIC may include a material that is compatible with a material of the walls of the vacuum envelope, such as a silicon-based vacuum envelope bonded to a silicon nitride or amorphous silicon surface of the PIC. Each waveguide may include a bridge structure that forms a planar surface for tightly bonding with the vacuum envelope and preserves properties of the transmitted light between opposing sections of the waveguide.
1. An apparatus, comprising:
a photonic integrated circuit comprising one or more waveguides configured in a substrate, wherein a portion of a top surface of the substrate is substantially planar; and
a vacuum envelope comprising one or more walls coupled to the portion of the top surface of the substrate,
wherein each waveguide is configured to transmit light from a light input surface of the photonic integrated circuit exterior to the vacuum envelope to an interior of the vacuum envelope, and
wherein, for each waveguide:
the substrate comprises adjacent waveguide channels defining sidewall surfaces of the waveguide, and
the top surface of the substrate defines a top surface of the waveguide,
wherein each waveguide includes a bridge structure coupled to the one or more walls of the vacuum envelope and planar with the portion of the top surface of the substrate, and
wherein the bridge structure intersects the adjacent waveguide channels.
2. The apparatus of claim 1 ,
wherein the vacuum envelope comprises a pump cavity, and
wherein the apparatus further comprises a magnet-free ion pump housed in the pump cavity.
3. The apparatus of claim 1 , wherein the bridge structure tapers from a sidewall surface of the waveguide to an opposite edge of each adjacent waveguide channel.
4. The apparatus of claim 1 ,
wherein the bridge structure is configured to guide light through the bridge structure, and
wherein the guided light has a wavelength range of about 50 nanometers.
5. The apparatus of claim 1 , wherein a coefficient of thermal expansion (CTE) of a surface of the substrate is within at least one of:
about 5 ppm/° C. of a CTE of the one or more walls of the vacuum envelope, or
about a factor of 3 of the CTE of the one or more walls of the vacuum envelope.
6. The apparatus of claim 1 , wherein the one or more walls of the vacuum envelope are directly coupled to the top surface of the substrate.
7. The apparatus of claim 1 , further comprising an intermediate layer between the one or more walls of the vacuum envelope and the top surface of the substrate.
8. The apparatus of claim 1 , wherein the substrate comprises a Group III-V compound semiconductor and the one or more walls of the vacuum envelope comprise at least one of silicon or a silicon-based compound.
9. The apparatus of claim 1 , further comprising one or more optical components coupled to the photonic integrated circuit and configured to emit light into the light input surface of at least one waveguide or manipulate light transmitted through at least one waveguide.
10. The apparatus of claim 9 , wherein the one or more optical components comprise a laser configured to emit light into the light input surface of at least one waveguide.
11. The apparatus of claim 10 , further comprising one or more active electronic components coupled to the photonic integrated circuit and configured to control the one or more optical components and process signals from the one or more optical components.
12. The apparatus of claim 11 , wherein the one or more active electronic components are configured on the substrate.
13. The apparatus of claim 1 , wherein the vacuum envelope comprises:
a getter cavity housing a getter; and
a magneto-optical trap (MOT) cavity fluidically coupled to the getter cavity and the pump cavity.
14. The apparatus of claim 1 , further comprising a microchip underlying the substrate.
15. A method for forming one or more vacuum cells comprising, for each vacuum cell:
forming one or more waveguides in a substrate of a photonic integrated circuit, wherein a portion of a top surface of the substrate is substantially planar; and
bonding one or more walls of a vacuum envelope to the portion of the top surface of the substrate to form the vacuum cell,
wherein each waveguide is configured to transmit light from a light input surface of the photonic integrated circuit exterior to the vacuum envelope to an interior of the vacuum envelope, and
wherein, for each waveguide:
the substrate comprises adjacent waveguide channels defining sidewall surfaces of the waveguide, and
the top surface of the substrate defines a top surface of the waveguide,
wherein each waveguide includes a bridge structure coupled to the one or more walls of the vacuum envelope and planar with the portion of the top surface of the substrate, and
wherein the bridge structure intersects the adjacent waveguide channel.
16. The method of claim 15 ,
wherein bonding the one or more walls of the vacuum envelope to the top surface of the substrate further comprises anodically bonding at least a portion of the one or more walls of the vacuum envelope to the bridge structure of each waveguide.
17. The method of claim 15 , wherein the one or more vacuum cells comprise a plurality of vacuum cells, and further comprising separating the plurality of vacuum cells.